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PDF ( 数据手册 , 数据表 ) AWB7228

零件编号 AWB7228
描述 Small-Cell Power Amplifier Module
制造商 ANADIGICS
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AWB7228 数据手册, 描述, 功能
FEATURES
InGaP HBT Technology
-47 dBc ACPR @ 6 10 MHz, +27 dBm
• 27 dB Gain
High Efficiency
• Low Transistor Junction Temperature
Matched for a 50 System
Low Profile Miniature Surface Mount Package;
RoHS Compliant
Multi-Carrier Capability
AWB7228
2.545 - 2.69 GHz
Small-Cell Power Amplifier Module
PRELIMINARY DATA SHEET - Rev 1.2
APPLICATIONS
LTE, WCDMA and HSDPA Air Interfaces
FDD and TDD Systems
Picocell, Femtocell, Home Nodes
Customer Premises Equipment (CPE)
Data Cards and Terminals
14 Pin 7 mm x 7 mm x 1.3 mm
Surface Mount Module
PRODUCT DESCRIPTION
The AWB7228 is a fully matched, Multi-Chip-Module
(MCM) designed for picocell, femtocell, and customer
premises equipment (CPE) applications. Its high
linearity and efficiency meet the extremely demanding
needs of small cell infrastructure architectures.
Designed for LTE,WCDMA and HSDPA air interfaces
operating in the 2.545 GHz to 2.69 GHz band, the
AWB7228 delivers up to +27 dBm of LTE (E-TM1.1)
power with an ACPR of -47 dBc. It operates from
a convenient +4.5 V supply and provides 27 dB of
gain. The device is manufactured using an advanced
InGaP HBT MMIC technology offering state-of-the-
art reliability, temperature stability, and ruggedness.
The self-contained 7 mm x 7 mm x 1.3 mm surface
mount package incorporates RF matching networks
optimized for output power, efficiency, and linearity in
a 50 Ω system.
Vcc 1 Vcc 2
RF Input
Matching
Network
Bias
Network
Matching
Network
Matching
Network
Bias
Network
Matching
Network
Power
Detector
VREF
VDET
Figure 1: Block Diagram
09/2012
RF Output







AWB7228 pdf, 数据表
AWB7228
COMPONENT PACKAGING
PIN 1
Figure 7: Tape & Reel Packaging
PACKAGE TYPE
7 mm x 7 mm x 1.3 mm
Table 5: Tape & Reel Dimensions
TAPE WIDTH POCKET PITCH
REEL
CAPACITY
16 mm
12 mm
2500
MAX REEL DIA
13"
8
PRELIMINARY DATA SHEET - Rev 1.2
09/2012














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