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零件编号 | IGC142T120T6RL | ||
描述 | IGBT4 Low Power Chip | ||
制造商 | Infineon | ||
LOGO | |||
1 Page
IGC142T120T6RL
IGBT4 Low Power Chip
FEATURES:
• 1200V Trench + Field Stop technology
• low switching losses
• positive temperature coefficient
• easy paralleling
This chip is used for:
• low / medium power modules
Applications:
• low / medium power drives
C
G
E
Chip Type
VCE ICn
Die Size
IGC142T120T6RL 1200V 150A 11.31 x 12.56 m m2
Package
sawn on foil
MECHANICAL PARAMETER
Raster size
Emitter pad size (incl. gate pad)
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Pad metal
Backside metal
Die bond
Wire bond
Reject ink dot size
Recommended storage environment
11.31 x 12.56
11.04 x 9.80
1.31 x 0.81
mm 2
142.1 / 113.1
115 µm
150 mm
90 grd
94
Photoimide
3200 nm AlSiCu
Ni Ag –system
suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al, <500µm
∅ 0.65mm ; max 1.2mm
Store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by IN FINEON Technologies , AIM PMD D CID CLS , L7693C, Edition 1, 31.10.2007
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页数 | 5 页 | ||
下载 | [ IGC142T120T6RL.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
IGC142T120T6RH | IGBT4 High Power Chip | Infineon |
IGC142T120T6RL | IGBT4 Low Power Chip | Infineon |
IGC142T120T6RM | IGBT4 Medium Power Chip | Infineon |
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