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零件编号 | IGC13T120T6L | ||
描述 | IGBT4 Low Power Chip | ||
制造商 | Infineon | ||
LOGO | |||
1 Page
IGC13T120T6L
IGBT4 Low Power Chip
Features:
• 1200V Trench + Field stop technology
• low switching losses
• positive temperature coefficient
• easy paralleling
This chip is used for:
• low / medium power modules
Applications:
• low / medium power drives
C
G
E
Chip Type
IGC13T120T6L
VCE ICn
1200V 10A
Die Size
3.54 x 3.81 mm2
Package
sawn on foil
MECHANICAL PARAMETER
Raster size
Emitter pad size
Gate pad size
Area total / active
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Pad metal
Backside metal
Die bond
Wire bond
Reject ink dot size
Recommended storage environment
3.54 x 3.81
1.497 x 2.34
0.608 x 1.092
mm 2
13.48 / 6.93
115 µm
150 mm
90 grd
1109
Photoimide
3200 nm AlSiCu
Ni Ag –system
suitable for epoxy and soft solder die bonding
Electrically conductive glue or solder
Al, <500µm
∅ 0.65mm ; max 1.2mm
Store in original container, in dry nitrogen,
< 6 month at an ambient temperature of 23°C
Edited by IN FINEON Technologies , AIM PMD D CID CLS , L7623C, Edition 1, 31.10.2007
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页数 | 5 页 | ||
下载 | [ IGC13T120T6L.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
IGC13T120T6L | IGBT4 Low Power Chip | Infineon |
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