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零件编号 | IKCM30F60GD | ||
描述 | Control Integrated POwer System | ||
制造商 | Infineon | ||
LOGO | |||
1 Page
Control Integrated POwer
System (CIPOS™)
IKCM30F60GD
Datasheet
For Power Management Application
1
Ver. 1.2, 2014-11-01
CIPOS™ IKCM30F60GD
Recommended Operation Conditions
All voltages are absolute voltages referenced to VSS -potential unless otherwise specified.
Description
Symbol
min
Value
typ
max
DC link supply voltage of P-N
High side floating supply voltage (VB vs. VS)
Low side supply voltage
Control supply variation
VPN
VBS
VDD
ΔVBS,
ΔVDD
0
13.5
14.5
-1
-1
-
-
16
-
400
18.5
18.5
1
1
Logic input voltages LIN,HIN,ITRIP
Between VSS - N (including surge)
VIN
VITRIP
VSS
0
0
-5
-
-
5
5
5
Unit
V
V
V
V/µs
V
V
Figure 6: TC measurement point1
1Any measurement except for the specified point in figure 6 is not relevant for the temperature verification and
brings wrong or different information.
Datasheet
8 Ver. 1.2, 2014-11-01
Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™,
DI-POL™, DrBLADE™, EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™,
HybridPACK™, ISOFACE™, IsoPACK™, i-Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™,
POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™,
SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™, thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™
of ARM Limited, UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth
SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of
Epcos AG. FLEXGO™ of Microsoft Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission
Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR
STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics
Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACTURING CO., MICROWAVE
OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ of Openwave Systems Inc. RED HAT™
of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of
Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of
Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design
Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex.
Last Trademarks Update 2014-07-17
www.Infineon.com
Edition 2014-06-01
Published by
Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2015.
All Rights Reserved.
Document reference
Ifx000000000001
IMPORTANT NOTICE
The information given in this document shall in no event be
regarded as a guarantee of conditions or characteristics
(“Beschaffenheitsgarantie”). With respect to any examples, hints
or any typical values stated herein and/or any information
regarding the application of the product, Infineon Technologies
hereby disclaims any and all warranties and liabilities of any kind,
including without limitation warranties of non-infringement of
intellectual property rights of any third party.
In addition, any information given in this document is subject to
customer’s compliance with its obligations stated in this document
and any applicable legal requirements, norms and standards
concerning customer’s products and any use of the product of
Infineon Technologies in customer’s applications.
The data contained in this document is exclusively intended for
technically trained staff. It is the responsibility of customer’s
technical departments to evaluate the suitability of the product for
the intended application and the completeness of the product
information given in this document with respect to such
application.
For further information on the product, technology, delivery terms
and conditions and prices please contact your nearest Infineon
Technologies office (www.infineon.com).
WARNINGS
Due to technical requirements products may contain dangerous
substances. For information on the types in question please
contact your nearest Infineon Technologies office.
Except as otherwise explicitly approved by Infineon Technologies
in a written document signed by authorized representatives of
Infineon Technologies, Infineon Technologies’ products may not be
used in any applications where a failure of the product or any
consequences of the use thereof can reasonably be expected to
result in personal injury.
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页数 | 16 页 | ||
下载 | [ IKCM30F60GD.PDF 数据手册 ] |
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