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PDF ( 数据手册 , 数据表 ) A3V64S40GTP

零件编号 A3V64S40GTP
描述 64M Single Data Rate Synchronous DRAM
制造商 Zentel
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A3V64S40GTP 数据手册, 描述, 功能
A3V64S40GTP
64M Single Data Rate Synchronous DRAM
64Mb Synchronous DRAM Specification
A3V64S40GTP
Zentel Electronics Corp.
Revision 1.0
Dec., 2012







A3V64S40GTP pdf, 数据表
A3V64S40GTP
64M Single Data Rate Synchronous DRAM
AC OPERATING TEST CONDITIONS (VDD = VddQ = 3.3V ±0.3V, TA = 0 to 70°C)
Parameter
Value
Unit
AC input levels (Vih/Vil)
2.4 / 0.4
V
Input timing measurement reference level
1.4
V
Input rise and fall time
tr/tf = 1/1
Ns
Output timing measurement reference level
1.4
V
Output load condition
See Figure 2
Revision 1.0
Page 7/39
Dec., 2012







A3V64S40GTP equivalent, schematic
A3V64S40GTP
64M Single Data Rate Synchronous DRAM
Operation of the SDRAM
Read/Write Operations
Bank active
Before executing a read or write operation, the corresponding bank and the row address must be activated by the bank
active (ACT) command. An interval of tRCD is required between the bank active command input and the following read/write
command input.
Read operation
A read operation starts when a read command is input. Output buffer becomes Low-Z in the (CAS Latency - 1) cycle after
read command set. The SDRAM can perform a burst read operation.
The burst length can be set to 1, 2, 4 and 8. The start address for a burst read is specified by the column address and the
bank select address at the read command set cycle. In a read operation, data output starts after the number of clocks
specified by the CAS Latency. The CAS Latency can be set to 2 or 3.
When the burst length is 1, 2, 4 and 8 the DOUT buffer automatically becomes High-Z at the next clock after the successive
burst-length data has been output.
The CAS latency and burst length must be specified at the mode register.
Revision 1.0
Page 15/39
Dec., 2012










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