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PDF ( 数据手册 , 数据表 ) NB3N121K

零件编号 NB3N121K
描述 3.3V Differential 1:21 Fanout Clock and Data Driver
制造商 ON Semiconductor
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NB3N121K 数据手册, 描述, 功能
NB3N121K
3.3V Differential 1:21
Fanout Clock and Data
Driver with HCSL Outputs
Description
The NB3N121K is a differential 1:21 Clock and Data fanout buffer
with Highspeed Current Steering Logic (HCSL) outputs optimized
for ultra low propagation delay variation. The NB3N121K is designed
with HCSL PCI Express clock distribution and FBDIMM applications
in mind.
Inputs can directly accept differential LVPECL, HCSL, and LVDS
signals per Figures 7, 8, and 9. Single ended LVPECL, HCSL,
LVCMOS, or LVTTL levels are accepted with a proper external Vth
reference supply per Figures 4 and 10. Input pins incorporate separate
internal 50 W termination resistors allowing additional single ended
system interconnect flexibility.
Output drive current is set by connecting a 475 W resistor from
IREF (Pin 1) to GND per Figure 6. Outputs can also interface to
LVDS receivers when terminated per Figure 11.
The NB3N121K specifically guarantees low output–to–output
skew. Optimal design, layout, and processing minimize skew within a
device and from device to device. System designers can take
advantage of the NB3N121K’s performance to distribute low skew
clocks across the backplane or the motherboard.
Features
Typical Input Clock Frequency 100, 133, 166, 200, 266, 333 and
400 MHz
340 ps Typical Rise and Fall Times
800 ps Typical Propagation Delay
100 ps Max Within Device Skew
150 ps Max DevicetoDevice Skew
Dtpd 100 ps Maximum Propagation Delay Variation Per Each
Differential Pair
0.1 ps Typical RMS Additive Phase Jitter
LVDS Output Levels Optional with Interface Termination
Operating Range: VCC = 3.0 V to 3.6 V with GND = 0 V
Typical HCSL Output Level (700 mV PeaktoPeak)
These are PbFree Devices
Applications
Clock Distribution
PCIe I, II, III
Networking
High End Computing
Routers
End Products
Servers
FBDIMM Memory Card
© Semiconductor Components Industries, LLC, 2012
March, 2012 Rev. 1
1
http://onsemi.com
1 52
QFN52
MN SUFFIX
CASE 485M
MARKING DIAGRAM*
52
1
NB3N
121K
AWLYYWWG
A = Assembly Site
WL = Wafer Lot
YY = Year
WW = Work Week
G = PbFree Package
*For additional marking information, refer to
Application Note AND8002/D.
Q0
VTCLK
Q0
Q1
Q1
CLK
CLK Q19
VTCLK
VCC
GND
IREF
RREF
Q19
Q20
Q20
Figure 1. Simplified Logic Diagram
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 10 of this data sheet.
Publication Order Number:
NB3N121K/D







NB3N121K pdf, 数据表
Qx RS1B Z0 = 50 W
NB3N121K
NB3N121K
Driver
RS2B
Z0 = 50 W
Qx
RREFA
CL1C
2 pF
CL2C
2 pF
RL1D
50 W
RL2D
50 W
Receiver
A. Connect 475 W resistor RREF from IREF pin to GND.
B. RS1, RS2: 0 W for Test and Evaluation. Select to Minimizing Ringing.
C. CL1, CL2: Receiver Input Simulation (for test only not added to application circuit.
D. RL1, RL2 Termination and Load Resistors Located at Receiver Inputs.
Figure 6. Typical Termination Configuration for Output Driver and Device Evaluation
VCC = 3.3 V / 2.5 V
VCC = 3.3 V
LVPECL
Driver
Z0 = 50 W CLK
VTCLK
VTCLK
Z0 = 50 W CLK
NB3N121K
50 W*
50 W*
VTCLK = VTCLK = VCC 2.0 V
GND
GND
*RTIN, Internal Input Termination Resistor
Figure 7. LVPECL Interface
VCC = 3.3 V / 2.5 V / 1.8 V
VCC = 3.3 V
LVDS
Driver
Z0 = 50 W CLK
VTCLK
VTCLK
Z0 = 50 W CLK
NB3N121K
50 W*
50 W*
GND
VTCLK = VTCLK
GND
*RTIN, Internal Input Termination Resistor
Figure 8. LVDS Interface
http://onsemi.com
8














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