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零件编号 | D16857 | ||
描述 | UPD16857 | ||
制造商 | NEC | ||
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1 Page
DATA SHEET
MOS INTEGRATED CIRCUIT
µPD16857
MONOLITHIC 6 channel H-BRIDGE DRIVER
DESCRIPTION
µPD16857 is monolithic 6 channel H-bridge driver employing power MOS FETs in the output stages. The MOS
FETs in the output stage lower the saturation voltage and power consumption as compared with conventional drivers
using bipolar transistors.
In addition, a low-voltage malfunction prevention circuit is also provided that prevents the IC from malfunctioning
when the supply voltage drops. A 30-pin plastic shrink SOP package is adopted to help create compact and slim
application sets.
In the output stage H bridge circuits, two low-ON resistance H-bridge circuits for driving actuators, and another
three channels for driving sled motors and tilt control, and another channel for driving loading motor are provided,
making the product ideal for applications in DVD-ROM/DVD-RAM.
FEATURES
• Six H-bridge outputs employing power MOS FETs.
• High speed PWM drive corresponding: Operating input frequency 120 kHz (MAX.)
• Low voltage malfunction prevention circuit: Operating control block voltage under 2.5 V (TYP.)
• Loading into 38-pin shrink SOP (300 mil).
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter
Control block supply voltage
Output block supply voltage
Input voltage
Output current
Power consumptionNote
Peak junction temperature
Storage temperature range
Symbol
Condition
VDD
VM
VIN
ID(pulse) PW ≤ 5 ms, Duty ≤ 20 %
PT
TCH(MAX)
Tstg
Rating
–0.5 to +6.0
–0.5 to +13.5
–0.5 to VDD+0.5
±1.0
1.0
150
–55 to +150
Note When mounted on a glass epoxy board (10 cm × 10 cm × 1 mm, 15 % copper foil)
Unit
V
V
V
A/ch
W
°C
°C
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability
and additional information.
Document No. S13908EJ1V0DS00 (1st edition)
Date Published July 1999 N CP(K)
Printed in Japan
©
1999
µPD16857
RON vs. TA characteristics
VM=12V
3.0
RONa(ch6)
2.5
RONa(ch1. 3. 5)
2.0
1.5
1.0
0
RONb(ch2. 4)
20 40 60
Ambient temperature TA (°C)
80
tTHLa, tTHLb, tTHLc vs. TA characteristics
250
VDD=3.3V
VM=12V
200
150
100
50
tTHLc
tTHLa
tTHLb
0 20 40 60 80
Ambient temperature TA (°C)
tPHLa, tPHLb, tPHLc vs. TA characteristics
350
VDD=3.3V
VM=12V
300
tPHLa
250
tPHLb
200
tPHLc
250
200
150
100
50
tTLHa, tTLHb, tTLHc, vs. TA characteristics
VDD=3.3V
VM=12V
tTLHc
tTLHb
tTLHa
0 20 40 60 80
Ambient temperature TA (°C)
tPLHa, tPLHb, tPLHc, vs. TA characteristics
600 VDD=3.3V
VM=12V
500
tPLHc
400
300
200
0
100
80
60
40
tPLHb
tPLHa
20 40 60
Ambient temperature TA (°C)
80
tPLHa, tPLHb, vs. TA characteristics
VDD=3.3V
VM=12V
tPLHb
tPLHa
150 20
100
0
8
20 40 60
Ambient temperature TA (°C)
80
0
Data Sheet S13908EJ1V0DS00
20 40 60
Ambient temperature TA (°C)
80
µPD16857
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights
or other intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated “quality assurance program“ for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98.8
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页数 | 16 页 | ||
下载 | [ D16857.PDF 数据手册 ] |
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