DataSheet8.cn


PDF ( 数据手册 , 数据表 ) HLMP-1700

零件编号 HLMP-1700
描述 Low Current LED Lamps
制造商 Avago
LOGO Avago LOGO 


1 Page

No Preview Available !

HLMP-1700 数据手册, 描述, 功能
HLMP-4700, HLMP-4719, HLMP-4740
HLMP-1700, HLMP-1719, HLMP-1790
T-13/4 (5 mm), T-1 (3 mm), Low Current LED Lamps
Data Sheet
Description
These tinted diffused LED lamps are designed and opti-
mized specifically for low DC current operation. Luminous
intensity and forward voltage are tested at 2 mA to assure
consistent brightness at TTL output current levels.
Applications
•  Low power DC circuits
•  Telecommunications indicators
•  Portable equipment
•  Keyboard indicators
Package Dimensions
Features
•  Low power
•  High efficiency
•  CMOS-MOS compatible
•  TTL compatible
•  Wide viewing angle
•  Choice of package styles
•  Choice of colors
0.89 (0.035)
0.64 (0.025)
0.65 (0.026) MAX.
SQUARE TYP.
0.55 (0.022)
0.40 (0.016)
6.10 (0.240)
5.59 (0.220)
5.08 (0.200)
4.57 (0.180)
9.19 (0.362)
8.43 (0.332)
A - HLMP-4700, -4719, -4740
1.14 (.045)
0.51 (.020)
3.43 (.135)
2.92 (.115)
CATHODE
25.40 (1.00)
MIN.
24.1 (.95) MIN.
CATHODE
0.65 (0.026) MAX.
1.52 (.060)
1.02 (.040)
1.27(0.050)
NOM.
2.54 (0.100) NOM.
2.79 (.110)
2.29 (.090)
3.17 (.125)
2.67 (.105)
4.70 (.185)
4.19 (.165)
(0.022) 0.55
(0.016) 0.40
SQUARE TYP.
6.35 (.250)
5.58 (.220)
B - HLMP-1700, -1719, -1790
Notes:
1. All dimensions are in mm (inches).
2. An epoxy meniscus may extend about 1 mm (0.040") down the leads.
3. For PCB hole recommendations, see the Precautions section.







HLMP-1700 pdf, 数据表
Precautions:
Lead Forming:
The leads of an LED lamp may be preformed or cut to
length prior to insertion and soldering on PC board.
For better control, it is recommended to use proper
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
If manual lead cutting is necessary, cut the leads after
the soldering process. The solder connection forms a
mechanical ground which prevents mechanical stress
due to lead cutting from traveling into LED package.
This is highly recommended for hand solder operation,
as the excess lead length also acts as small heat sink.
Soldering and Handling:
Care must be taken during PCB assembly and soldering
process to prevent damage to the LED component.
LED component may be effectively hand soldered
to PCB. However, it is only recommended under
unavoidable circumstances such as rework. The closest
manual soldering distance of the soldering heat source
(soldering iron’s tip) to the body is 1.59mm. Soldering
the LED using soldering iron tip closer than 1.59mm
might damage the LED.
1.59 mm
ESD precaution must be properly applied on the
soldering station and personnel to prevent ESD
damage to the LED component that is ESD sensitive.
Do refer to Avago application note AN 1142 for details.
The soldering iron used should have grounded tip to
ensure electrostatic charge is properly grounded.
Recommended soldering condition:
Wave
Manual Solder
Soldering[1],[2] Dipping
Pre-heat Temperature 105°C Max.
Pre-heat Time
60 sec Max.
Peak Temperature 250°C Max.
260°C Max.
Dwell Time
3 sec Max.
5 sec Max.
Note:
1) Above conditions refers to measurement with thermocouple
mounted at the bottom of PCB.
2) It is recommended to use only bottom preheaters in order to
reduce thermal stress experienced by LED.
Wave soldering parameters must be set and maintained
according to the recommended temperature and dwell
time. Customer is advised to perform daily check on the
soldering profile to ensure that it is always conforming
to recommended soldering conditions.
Note:
1. PCB with different size and design (component density) will have
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the soldering
profile again before loading a new type of PCB.
2. Customer is advised to take extra precaution during wave soldering
to ensure that the maximum wave temperature does not exceed
250°C and the solder contact time does not exceeding 3sec. Over-
stressing the LED during soldering process might cause premature
failure to the LED due to delamination.
Any alignment fixture that is being applied during
wave soldering should be loosely fitted and should
not apply weight or force on LED. Non metal material
is recommended as it will absorb less heat during wave
soldering process.
At elevated temperature, LED is more susceptible to
mechanical stress. Therefore, PCB must allowed to cool
down to room temperature prior to handling, which
includes removal of alignment fixture or pallet.
If PCB board contains both through hole (TH) LED and
other surface mount components, it is recommended
that surface mount components be soldered on the
top side of the PCB. If surface mount need to be on the
bottom side, these components should be soldered
using reflow soldering prior to insertion the TH LED.
Recommended PC board plated through holes (PTH)
size for LED component leads.
LED Component
Lead Size
Diagonal
Plated Through-
Hole Diameter
Lead size (typ.) 0.45 × 0.45 mm 0.636 mm 0.98 to 1.08 mm
(0.018 × 0.018 in.) (0.025 in) (0.039 to 0.043 in)
Dambar shear- 0.65 mm
off area (max.) (0.026 in)
0.919 mm
(0.036 in)
Lead size (typ.) 0.50 × 0.50 mm 0.707 mm 1.05 to 1.15 mm
(0.020 × 0.020 in.) (0.028 in) (0.041 to 0.045 in)
Dambar shear- 0.70 mm
off area (max.) (0.028 in)
0.99 mm
(0.039 in)
Note: Refer to application note AN1027 for more information on
soldering LED components.
Over-sizing the PTH can lead to twisted LED after
clinching. On the other hand under sizing the PTH can
cause difficulty inserting the TH LED.
Refer to application note AN5334 for more information
about soldering and handling of TH LED lamps.
8














页数 10 页
下载[ HLMP-1700.PDF 数据手册 ]


分享链接

Link :

推荐数据表

零件编号描述制造商
HLMP-1700LOW CURRENT T-100 & T-1 3/4 SOLID STATE LAMPSQT Optoelectronics
QT Optoelectronics
HLMP-1700LOW CURRENT T-100 & T-1 3/4 SOLID STATE LAMPSFairchild Semiconductor
Fairchild Semiconductor
HLMP-1700T-13/4 (5 mm)/ T-1 (3 mm)/ Low Current LED LampsAgilent(Hewlett-Packard)
Agilent(Hewlett-Packard)
HLMP-1700LOW CURRENT T-100 & T-1 3/4 SOLID STATE LAMPSFairchild Semiconductor
Fairchild Semiconductor

零件编号描述制造商
STK15C88256-Kbit (32 K x 8) PowerStore nvSRAMCypress Semiconductor
Cypress Semiconductor
NJM4556DUAL HIGH CURRENT OPERATIONAL AMPLIFIERNew Japan Radio
New Japan Radio
EL1118-G5 PIN LONG CREEPAGE SOP PHOTOTRANSISTOR PHOTOCOUPLEREverlight
Everlight


DataSheet8.cn    |   2020   |  联系我们   |   搜索  |  Simemap