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零件编号 | FOD3150 | ||
描述 | Gate Drive Optocoupler | ||
制造商 | Fairchild Semiconductor | ||
LOGO | |||
1 Page
October 2011
FOD3150
High Noise Immunity, 1.0A Output Current,
Gate Drive Optocoupler
Features
■ High noise immunity characterized by 20kV/µs
minimum common mode rejection
■ Use of P-channel MOSFETs at output stage enables
output voltage swing close to the supply rail
■ Wide supply voltage range from 15V to 30V
■ Fast switching speed
– 500ns max. propagation delay
– 300ns max. pulse width distortion
■ Under Voltage LockOut (UVLO) with hysteresis
■ Extended industrial temperate range, -40°C to 100°C
temperature range
■ Safety and regulatory approvals
– UL1577, 5000 VRMS for 1 min.
– IEC60747-5-2
■ >8.0mm clearance and creepage distance (option ‘T’)
Applications
■ Industrial inverter
■ Uninterruptible power supply
■ Induction heating
■ Isolated IGBT/Power MOSFET gate drive
Description
The FOD3150 is a 1.0A Output Current Gate Drive
Optocoupler, capable of driving most 800V/20A
IGBT/MOSFET. It is ideally suited for fast switching
driving of power IGBT and MOSFETs used in motor
control inverter applications, and high performance
power system.
It utilizes Fairchild’s patented coplanar packaging
technology, Optoplanar®, and optimized IC design to
achieve high noise immunity, characterized by high
common mode rejection.
It consists of a gallium aluminum arsenide (AlGaAs) light
emitting diode optically coupled to an integrated circuit
with a high-speed driver for push-pull MOSFET output
stage.
Related Resources
■ FOD3120, 2.5A Output Current, Gate Drive
Optocoupler Datasheet
■ www.fairchildsemi.com/products/opto/
Functional Block Diagram
Package Outlines
NC 1
8 VCC
ANODE 2
7 VO2
CATHODE 3
6 VO1
NC 4
5 VEE
Note:
A 0.1µF bypass capacitor must be connected between pins 5 and 8.
8
1
8
1
8
1
©2008 Fairchild Semiconductor Corporation
FOD3150 Rev. 1.0.4
www.fairchildsemi.com
Typical Performance Curves (Continued)
Fig. 7 Low to High Input Current Threshold vs.
Ambient Temperature
4.0
VCC = 15 V to 3 0V
3.5
VEE = 0V
Output = Open
3.0
2.5
2.0
1.5
1.0
-4 0
-20 0 20 40 60 80
TA - AMBIENT TEMPERATURE (°C)
100
Fig. 9 Propagation Delay vs. LED Forward Current
500
VCC = 30V, VEE = 0V
Rg = 20Ω, Cg = 10nF
T A = 25°C
DU TY CYCLE = 50%
400 f = 10 kHz
300
200
tPHL
tPLH
100
6
8 10 12 14
IF – FORWARD LED CURRENT (mA)
16
Fig. 11 Propagation Delay vs. Series Load Resistance
500
IF = 10mA
VCC = 30V, VEE = 0V
Cg = 10nF
TA = 25°C
400 DUTY CYCLE = 50%
f = 10 kHz
300
200
tPHL
tPLH
100
0
10 20 30 40
Rg - SERIES LOAD RESISTANCE (Ω)
50
Fig. 8 Propagation Delay vs. Supply Voltage
400
IF = 10mA
TA = 25 °C
350
Rg = 20Ω, Cg = 10nF
DUTY CYCLE = 50%
f = 10 kHz
300
250
tPHL
tPLH
200
150
100
15
18 21 24 27
VCC – SUPPLY VOLTAGE (V)
30
Fig. 10 Propagation Delay vs. Ambient Temperature
500
IF = 10mA
VCC = 30V, VEE = 0V
Rg = 20Ω, Cg = 10 nF
DUTY CYCLE = 50%
400 f = 10 kHz
300
200
tPHL
tPLH
100
-40
-20 0 20 40 60
TA – AMBIENT TEMPERATURE (°C)
80
100
Fig. 12 Propagation Delay vs. Load Capacitance
500
IF = 10mA
VCC = 30V, VEE = 0V
Rg = 20Ω
TA = 25°C
400 DUTY C YCLE = 50%
f = 10 kHz
300
200
t PHL
t PLH
100
0
20 40 60 80
Cg - LOAD CAPACITANCE (nF)
100
©2008 Fairchild Semiconductor Corporation
FOD3150 Rev. 1.0.4
8
www.fairchildsemi.com
Ordering Information
Part Number
FOD3150
FOD3150S
FOD3150SD
FOD3150V
FOD3150SV
FOD3150SDV
FOD3150T
FOD3150TV
Package
DIP 8-Pin
SMT 8-Pin (Lead Bend)
SMT 8-Pin (Lead Bend)
DIP 8-Pin, IEC60747-5-2 option
SMT 8-Pin (Lead Bend), IEC60747-5-2 option
SMT 8-Pin (Lead Bend), IEC60747-5-2 option
DIP 8-Pin, 0.4” Lead Spacing
DIP 8-Pin, 0.4” Lead Spacing , IEC60747-5-2 option
Packing Method
Tube (50 units per tube)
Tube (50 units per tube)
Tape and Reel (1,000 units per reel)
Tube (50 units per tube)
Tube (50 units per tube)
Tape and Reel (1,000 units per reel)
Tube (50 units per tube)
Tube (50 units per tube)
Marking Information
3150
V XX YY B
1
2
6
34
5
Definitions
1 Fairchild logo
2 Device number
3 IEC60747-5-2 Option (only appears on component ordered
with this option)
4 Two digit year code, e.g., ‘08’
5 Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
©2008 Fairchild Semiconductor Corporation
FOD3150 Rev. 1.0.4
16
www.fairchildsemi.com
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页数 | 19 页 | ||
下载 | [ FOD3150.PDF 数据手册 ] |
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