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零件编号 | F89ETSM13-W2 | ||
描述 | highly integrated and excellent performance Wireless LAN (WLAN) SDIO network interface device | ||
制造商 | FN-LINK | ||
LOGO | |||
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FN-LINK TECHNOLOGY LIMITED
5th Floor, A Building, Haoye Logistics Park,
Shugang Channel, Bao'an District,
Shenzhen City, CHINA
TEL: 86-0755-29558186
FAX: 86-0755-29558196
Website: www.fn-link.com
Product Specification
IEEE 802.11 b/g/n 2.4GHz 1T1R SDIO Module
Project Name
Model NO
Customer
Customer’s Part NO
Drawing: LF WEI
Realtek RTL8189ETV 11n WIFI Module
F89ETSM13-W2 12.0*12.0*1.8, 3.3V SDIO Interface
Approved: Jim HU
Sales: Sunny LIU
Customer Approval
Check
Approved
Date
4.2 Recommended Reflow Profile
Referred to IPC/JEDEC standard.
Peak Temperature : <250°C
Number of Times : ≤2 times
FN-LINK TECHNOLOGY LIMITED
4.3 Patch WIFI modules installed before the notice:
WIFI module installed note:
1. Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a
stencil
2. Take and use the WIFI module, please insure the electrostatic protective measures.
3. Reflow soldering temperature should be according to the customer the main size of the products, such
as the temperature set at 250 + 5 ℃ for the MID motherboard.
About the module packaging, storage and use of matters needing attention are as follows:
1. The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage
environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.
2. The module vacuum packing once opened, time limit of the assembly:
Card: 1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink),
or greater than 40% (red) the module have been moisture absorption.
2.) factory environmental temperature humidity control: ≦ 30℃, ≦ 60% r.h..
3). Once opened, the workshop the preservation of life for 168 hours.
3. Once opened, such as when not used up within 168 hours:
1). The module must be again to remove the module moisture absorption.
2). The baking temperature: 125 ℃, 8 hours.
3.) After baking, put the right amount of desiccant to seal packages.
http://www.fn-link.com
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11/21/2014
Rev0.2
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页数 | 9 页 | ||
下载 | [ F89ETSM13-W2.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
F89ETSM13-W2 | highly integrated and excellent performance Wireless LAN (WLAN) SDIO network interface device | FN-LINK |
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