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PDF ( 数据手册 , 数据表 ) MOC3063M

零件编号 MOC3063M
描述 6-Pin DIP Zero-Cross Phototriac Driver Optocoupler
制造商 Fairchild Semiconductor
LOGO Fairchild Semiconductor LOGO 


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MOC3063M 数据手册, 描述, 功能
September 2015
MOC3061M, MOC3062M, MOC3063M,
MOC3162M, MOC3163M
6-Pin DIP Zero-Cross Triac Driver Optocoupler (600 Volt Peak)
Features
• Simplifies Logic Control of 115/240 VAC Power
• Zero Voltage Crossing to Minimize Conducted and
Radiated Line Noise
• 600 V Peak Blocking Voltage
• Superior Static dv/dt
– 600 V/μs (MOC306xM)
– 1000 V/μs (MOC316xM)
• Safety and Regulatory Approvals
– UL1577, 4,170 VACRMS for 1 Minute
– DIN EN/IEC60747-5-5
Applications
• Solenoid/Valve Controls
• Static Power Switches
• Temperature Controls
• AC Motor Starters
• Lighting Controls
• AC Motor Drives
• E.M. Contactors
• Solid State Relays
Description
The MOC306XM and MOC316XM devices consist of a
GaAs infrared emitting diode optically coupled to a
monolithic silicon detector performing the function of a
zero voltage crossing bilateral triac driver.
They are designed for use with a triac in the interface of
logic systems to equipment powered from 115/240 VAC
lines, such as solid-state relays, industrial controls,
motors, solenoids and consumer appliances, etc.
Schematic
Package Outlines
ANODE 1
6 MAIN TERM.
CATHODE 2
N/C 3
ZERO
CROSSING
CIRCUIT
5 NC*
4 MAIN TERM.
*DO NOT CONNECT
(TRIAC SUBSTRATE)
Figure 1. Schematic
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.5
Figure 2. Package Outlines
www.fairchildsemi.com







MOC3063M pdf, 数据表
Reflow Profile
260 TP
240
220 TL
200
180
160
140
120
100
80
60
40
20
0
Max. Ramp-up Rate = 3°C/S
Max. Ramp-down Rate = 6°C/S
Tsmax
Preheat Area
Tsmin
120
ts
240
Time 25°C to Peak
Time (seconds)
tL
tP
360
Profile Freature
Temperature Minimum (Tsmin)
Temperature Maximum (Tsmax)
Time (tS) from (Tsmin to Tsmax)
Ramp-up Rate (TL to TP)
Liquidous Temperature (TL)
Time (tL) Maintained Above (TL)
Peak Body Package Temperature
Time (tP) within 5°C of 260°C
Ramp-down Rate (TP to TL)
Time 25°C to Peak Temperature
Pb-Free Assembly Profile
150°C
200°C
60 seconds to 120 seconds
3°C/second maximum
217°C
60 seconds to 150 seconds
260°C +0°C / –5°C
30 seconds
6°C/second maximum
8 minutes maximum
Figure 14. Reflow Profile
©2005 Fairchild Semiconductor Corporation
MOC306XM, MOC316XM Rev. 1.5
8
www.fairchildsemi.com














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