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PDF ( 数据手册 , 数据表 ) MP04HBN490-24

零件编号 MP04HBN490-24
描述 Thyristor/Diode Module
制造商 Dynex Semiconductor
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MP04HBN490-24 数据手册, 描述, 功能
MP04---490
Replaces Jun3 2000 version, DS5204-1.2
FEATURES
s Dual Device Module
s Electrically Isolated Package
s Pressure Contact Construction
s International Standard Footprint
s Alumina (Non Toxic) Isolation Medium
s Integral Water Cooled Heatsink
APPLICATIONS
s Motor Control
s Controlled Rectifier Bridges
s Heater Control
s AC Phase Control
MP04---490
Dual Thyristor, Thyristor/Diode Module
Advance Information
DS5204-2.1 April 2001
KEY PARAMETERS
VDRM
IT(AV)
ITSM(per arm)
Visol
2800V
490A
11250A
3000V
Code
HBT
HBP
HBN
Circuit
Fig.1 Circuit diagrams
VOLTAGE RATINGS
Type Number
MP04---490-28
MP04---490-26
MP04---490-24
Repetitive Peak
Voltages
VDRM VRRM
V
2800
2600
2400
Lower voltage grades available.
Conditions
Tvj = 0˚ to 125˚C,
IDRM = IRRM = 50mA
V =V =
DSM
RSM
V = V + 100V
DRM
RRM
respectively
ORDERING INFORMATION
Order As:
MP04HBT490-28 or MP04HBT490-26 or MP04HBT490-24
MP04HBP490-28 or MP04HBP490-26 or MP04HBP490-24
MP04HBN490-28 or MP04HBN490-26 or MP04HBN490-24
Note: When ordering, please use the whole part number.
Module type code: MP04.
For further information see Package Details.
Fig. 2 Electrical connections - (not to scale)
www.dynexsemi.com
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MP04HBN490-24 pdf, 数据表
MP04---490
MOUNTING RECOMMENDATIONS
Adequate heatsinking is required to maintain the base
temperature at 75˚C if full rated current is to be achieved. Power
dissipation may be calculated by use of VT(TO) and rT information
in accordance with standard formulae. We can provide
assistance with calculations or choice of heatsink if required.
The heatsink surface must be smooth and flat; a surface finish
of N6 (32µin) and a flatness within 0.05mm (0.002") are
recommended.
Immediately prior to mounting, the heatsink surface should be
lightly scrubbed with fine emery, Scotch Brite or a mild chemical
etchant and then cleaned with a solvent to remove oxide build
up and foreign material. Care should be taken to ensure no
foreign particles remain.
An even coating of thermal compound (eg. Unial) should be
applied to both the heatsink and module mounting surfaces.
This should ideally be 0.05mm (0.002") per surface to ensure
optimum thermal performance.
After application of thermal compound, place the module
squarely over the mounting holes, (or Tslots) in the heatsink.
Fit and finger tighten the recommended fixing bolts at each end.
Using a torque wrench, continue to tighten the fixing bolts by
rotating each bolt in turn no more than 1/4 of a revolution at a
time, until the required torque of 6Nm (55lbs.ins) is reached on
all bolts at both ends.
It is not acceptable to fully tighten one fixing bolt before starting
to tighten the others. Such action may DAMAGE the module.
POWER ASSEMBLY CAPABILITY
The Power Assembly group provides support for those
customers requiring more than the basic semiconductor switch.
Using CAD design tools the group has developed a flexible
range of heatsink / clamping systems in line with advances in
device types and the voltage and current capability of Dynex
semiconductors.
An extensive range of air and liquid cooled assemblies is
available covering the range of circuit designs in general use
today.
HEATSINKS
The Power Assembly group has a proprietary range of extruded
aluminium heatsinks. These were designed to optimise the
performance of Dynex semiconductors. Data with respect to air
natural, forced air and liquid cooling (with flow rates) is available
on request.
For further information on device clamps, heatsinks and
assemblies, please contact your nearest sales representative or
customer service office.
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www.dynexsemi.com














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