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PDF ( 数据手册 , 数据表 ) NT2L757DT

零件编号 NT2L757DT
描述 WARM WHITE LED
制造商 NICHIA CORPORATION
LOGO NICHIA CORPORATION LOGO 


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NT2L757DT 数据手册, 描述, 功能
NICHIA STS-DA1-2779 <Cat.No.130523>
NICHIA CORPORATION SPECIFICATIONS FOR WARM WHITE LED
NT2L757DT
Pb-free Reflow Soldering Application
Built-in ESD Protection Device
RoHS Compliant
http://www.Datasheet4U.com







NT2L757DT pdf, 数据表
PACKAGING - TAPE & REEL
シリカゲルとともにリールをアルミ防湿袋に入れ、熱シールにより封をします。
Reels are shipped with desiccants in heat-sealed moisture-proof bags.
シリカゲル
Desiccants
リール
Reel
熱シール
Seal
NICHIA STS-DA1-2779 <Cat.No.130523>
Nxxxxxxx
管理番号 No. STS-DA7-0006C
ラベル Label
XXXX LED
TYPE Nxxxxxxx
*******
LOT YMxxxx-RRR
QTY.
PCS
RoHS
NICHIA CORPORATION 491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
アルミ防湿袋
Moisture-proof Bag
アルミ防湿袋を並べて入れ、。ダンボールで仕切ります
Moisture-proof bags are packed in cardboard boxes
with corrugated partitions.
Nichia LED
ラベル Label
XXXX LED
TYPE Nxxxxxxx
*******
RANK RRR
QTY.
PCS
RoHS
NICHIA CORPORATION
491 OKA, KAMINAKA, ANAN, TOKUSHIMA, JAPAN
* 客先型名を*******で示。 します
客先型名が設定されていない場合は空白です。
******* is the customer part number.
If not provided, it will not be indicated on the label.
* ロット表記方法についてはロット番号の項を
参照して下さい。
For details, see "LOT NUMBERING CODE"
in this document.
* ランク分けがない場合はランク表記はありません。
The label does not have the RANK field for
un-ranked products.
* 本製品はテーピングしたのち、。輸送の衝撃から保護するためダンボールで梱包します
Products shipped on tape and reel are packed in a moisture-proof bag.
They are shipped in cardboard boxes to protect them from external forces during transportation.
* 取り扱いに際して、、落下させたり 強い衝撃を与えたりしますと、製品を損傷させる原因になりますので注意して下さい。
Do not drop or expose the box to external forces as it may damage the products.
* ダンボールには防水加工がされておりませんので、。梱包箱が水に濡れないよう注意して下さい
Do not expose to water. The box is not water-resistant.
* 輸送、。運搬に際して弊社よりの梱包状態あるいは同等の梱包を行って下さい
Using the original package material or equivalent in transit is recommended.
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NT2L757DT equivalent, schematic
RELIABILITY
NICHIA STS-DA1-2779 <Cat.No.130523>
(1) Tests and Results
Test
Reference
Standard
Test Conditions
Test
Duration
Resistance to
Soldering Heat
(Reflow Soldering)
JEITA ED-4701
300 301
Tsld=260°C, 10sec, 2reflows,
Precondition: 30°C, 70%RH, 168hr
#1
Solderability
(Reflow Soldering)
JEITA ED-4701
303 303A
Tsld=245±5°C, 5sec,
Lead-free Solder(Sn-3.0Ag-0.5Cu)
#2
Temperature Cycle
JEITA ED-4701
100 105
-40°C(30min)~25°C(5min)~
100°C(30min)~25°C(5min)
100cycles #1
Moisture Resistance
(Cyclic)
JEITA ED-4701
200 203
25°C~65°C~-10°C, 90%RH,
24hr per cycle
10cycles #1
High Temperature
Storage
JEITA ED-4701
200 201
TA=100°C 1000hours
Temperature Humidity
Storage
JEITA ED-4701
100 103
TA=60°C, RH=90%
1000hours
Low Temperature
Storage
JEITA ED-4701
200 202
TA=-40°C 1000hours
Room Temperature
Operating Life
Condition 1
TA=25°C, IF=150mA
Test board: See NOTES below
1000hours #1
Room Temperature
Operating Life
Condition 2
TA=25°C, IF=300mA
Test board: See NOTES below
500hours #1
High Temperature
Operating Life
TA=100°C, IF=80mA
Test board: See NOTES below
1000hours #1
Temperature Humidity
Operating Life
60°C, RH=90%, IF=150mA
Test board: See NOTES below
500hours #1
Low Temperature
Operating Life
TA=-40°C, IF=150mA
Test board: See NOTES below
1000hours #1
Vibration
JEITA ED-4701
400 403
200m/s2, 100~2000~100Hz,
4cycles, 4min, each X, Y, Z
48minutes #1
Electrostatic Discharges
JEITA ED-4701
300 304
HBM, 2kV, 1.5k, 100pF, 3pulses,
alternately positive or negative
#1
Soldering Joint Shear
Strength
JEITA ED-4702B
5N, 10±1sec
002 3
NO TES:
1) Test board: FR4 board thickness=1.6mm, copper layer thickness=0.07mm, RθJA74°C/W
2) Measurements are performed after allowing the LEDs to return to room temperature.
Failure
Criteria
#
#1
#1
#1
#1
Units
Failed/Tested
0/22
0/22
0/50
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
0/22
(2) Failure Criteria
Criteria #
Items
Conditions
Failure Criteria
Forward Voltage(VF)
IF=150mA
>U.S.L.×1.1
#1
Luminous Flux(ΦV) I
F=150mA <L.
S.L.×0.7
#2
Solderability
-
Less than 95% solder coverage
U.S.L. : Upper Specification Limit L.S.L. : Lower Specification Limit
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