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PDF ( 数据手册 , 数据表 ) HBCA124ES6R

零件编号 HBCA124ES6R
描述 PNP and NPN Dual Digital Transistors
制造商 CYStech Electronics
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HBCA124ES6R 数据手册, 描述, 功能
CYStech Electronics Corp.
PNP and NPN Dual Digital Transistors
HBCA124ES6R
Spec. No. : C153S6R
Issued Date : 2011.04.01
Revised Date : 2013.09.06
Page No. : 1/8
Features
Built-in bias resistors enable the configuration of an inverter circuit without connecting external input
resistors (see equivalent circuit).
The bias resistors consist of thin-film resistors with complete isolation to allow positive biasing of the
input for PNP transistor, and negative biasing of the input for NPN transistor. They also have the
advantage of almost completely eliminating parasitic effects.
Only the on/off conditions need to be set for operation, making device design easy.
One DTA124E chip and one DTC124E chip in a SOT-363 package.
Mounting by SOT-323 automatic mounting machines is possible.
Mounting cost and area can be cut in half.
Transistor elements are independent, eliminating interference.
Pb-free lead plating and halogen-free package.
Equivalent Circuit
HBCA124ES6R
RBE2
RB2
TR1
RBE1
RB1
TR2
RB1=22kΩ , RB2=22 kΩ
RBE1=22kΩ , RBE2=22 kΩ
Outline
SOT-363
Ordering Information
Device
HBCA124ES6R-0-T1-G
Package
SOT-363
(Pb-free lead plating and halogen-free package)
Shipping
Marking
3000 pcs / Tape & Reel 12
HBCA124ES6R
CYStek Product Specification
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HBCA124ES6R pdf, 数据表
CYStech Electronics Corp.
SOT-363 Dimension
Spec. No. : C153S6R
Issued Date : 2011.04.01
Revised Date : 2013.09.06
Page No. : 8/8
Marking:
12
Device
Code
Date Code:
Year + Month
Year : 62006,
72007,…, etc
Month : 1Jan
2Feb, …, 9
Sep, AOct, B
Nov, CDec
6-Lead SOT-363 Plastic
Surface Mounted Package
CYStek Package Code: S6R
Style:
Pin 1. Emitter1 (E1)
Pin 2. Base1 (B1)
Pin 3. Collector2 (C2)
Pin 4. Emitter2 (E2)
Pin 5. Base2 (B2)
Pin 6. Collector1 (C1)
DIM
Millimeters
Min. Max.
Inches
Min. Max.
DIM
Millimeters
Min. Max.
Inches
Min. Max.
A 0.900 1.100 0.035 0.043 E1 2.150 2.450 0.085 0.096
A1 0.000 0.100 0.000 0.004
e
0.650 TYP
0.026 TYP
A2 0.900 1.000 0.035 0.039 e1 1.200 1.400 0.047 0.055
b 0.150 0.350 0.006 0.014 L
0.525 REF
0.021 REF
c 0.080 0.150 0.003 0.006 L1 0.260 0.460 0.010 0.018
D 2.000 2.200 0.079 0.087
θ
0°
8°
0°
8°
E 1.150 1.350 0.045 0.053
Notes : 1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
Lead : Pure tin plated.
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0.
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
CYStek reserves the right to make changes to its products without notice.
CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
HBCA124ES6R
CYStek Product Specification














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