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PDF ( 数据手册 , 数据表 ) MC33076

零件编号 MC33076
描述 DUAL HIGH OUTPUT CURRENT OPERATIONAL AMPLIFIER
制造商 Motorola Semiconductors
LOGO Motorola Semiconductors LOGO 


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MC33076 数据手册, 描述, 功能
Order this document by MC33076/D
MC33076
Dual High Output Current,
Low Power, Low Noise
Bipolar Operational Amplifier
The MC33076 operational amplifier employs bipolar technology with
innovative high performance concepts for audio and industrial applications.
This device uses high frequency PNP input transistorsto improve frequency
response. In addition, the amplifier provides high output current drive
capability while minimizing the drain current. The all NPN output stage
exhibits no deadband crossover distortion, large output voltage swing,
excellent phase and gain margins, low open loop high frequency output
impedance and symmetrical source and sink AC frequency performance.
The MC33076 is tested over the automotive temperature range and is
available in an 8–pin SOIC package(D suffix) and in both the standard 8 pin
DIP and 16–pin DIP packages for high power applications.
100 Output Drive Capability
Large Output Voltage Swing
Low Total Harmonic Distortion
High Gain Bandwidth: 7.4 MHz
High Slew Rate: 2.6 V/µs
Dual Supply Operation: ±2.0 V to ±18 V
High Output Current: ISC = 250 mA typ
Similar Performance to MC33178
DUAL HIGH OUTPUT
CURRENT OPERATIONAL
AMPLIFIER
SEMICONDUCTOR
TECHNICAL DATA
8
1
D SUFFIX
PLASTIC PACKAGE
CASE 751
(SO–8)
8
1
P1 SUFFIX
PLASTIC PACKAGE
CASE 626
PIN CONNECTIONS
Output 1 1
Inputs 1
2
3
+
1
VEE 4
8 VCC
7 Output 2
2
+
6
5
Inputs 2
(8 Pin Pkg, Top View)
Equivalent Circuit Schematic
(Each Amplifier)
VCC
Iref
Vin–
Iref
Vin+ CC
CM
VEE
MOTOROLA ANALOG IC DEVICE DATA
16
1
P2 SUFFIX
PLASTIC PACKAGE
CASE 648C
DIP (12+2+2)
PIN CONNECTIONS
Inputs 1
1
2
+1
16 Output 1
15 NC
NC 3
14 VCC
4
VEE
5
13
12 VEE
NC 6
11 NC
Vout
Inputs 2
7
8
+
–2
10 NC
9 Output 2
(16 Pin Pkg, Top View)
ORDERING INFORMATION
Device
MC33076D
MC33076P1
MC33076P2
Operating
Temperature Range Package
SO–8
TA = – 40° to + 85°C Plastic DIP
Power Plastic
© Motorola, Inc. 1996
Rev 0
1
http://www.Datasheet4U.com







MC33076 pdf, 数据表
Figure 25. Percent Overshoot
versus Load Capacitance
100
VCC = +15 V
80
VEE = –15 V
TA = 25°C
60
RL = 2.0 k
40
RL = 100
20
0
10 100 1000
CL, LOAD CAPACITANCE (pF)
MC33076
Figure 26. PC Board Heatsink Example
Copper
Pad
Copper
Pad
10 k
APPLICATIONS INFORMATION
The MC33076 dual operational amplifier is available in the
standard 8–pin plastic dual–in–line (DIP) and surface mount
packages, and also in a 16–pin batwing power package. T o
enhance the power dissipation capability of the power
package, Pins 4, 5, 12, and 13 are tied together on the
leadframe, giving it an ambient thermal resistance of 52°C/W
typically, in still air . The junction–to–ambient thermal
resistance (RθJA) can be decreased further by using a copper
padb on the printed circuit board (as shown in Figure 26) to
draw the heat away from the package. Care must be taken
not to exceed the maximum junction temperature or damage
to the device may occur.
8 MOTOROLA ANALOG IC DEVICE DATA














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