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零件编号 | PG-LQFP-64-6 | ||
描述 | Package Outline | ||
制造商 | Infineon | ||
LOGO | |||
1 Page
P/PG-LQFP-64-6, -8, -12, -19, -22
Package Outline
15 x 0.5 = 7.5
H
0.5
0.2
+0.07
-0.03
C 0.08 C 64x
SEATING COPLANARITY
PLANE
0.08 M A-B D C 64x
0.5 x 45°
12
10 1)
D
0.2 A-B D 64x
0.2 A-B D H 4x
AB
0.6 ±0.15
Bottom View
Ex
Ox
Exposed Diepad
64
1
Index Marking
64
1
Index Marking
1) Does not include plastic or metal protrusion of 0.25 max. per side
Exposed Diepad Dimensions
Package
Leadframe
Ex Ey Ox Oy
PG-LQFP-64-8
C66065-A6866-C005 5 5 0 0
PG-LQFP-64-6
C66065-A6866-C013 5.6 5.6 0 0
PG-LQFP-64-12
C66065-A6866-C018 4 4 0 0
PG-LQFP-64-6, -22 C66065-A6866-C019 5.4 5.4 0 0
PG-LQFP-64-19
C66065-A6866-C020 5.8 5.8 0 0
Foot Print
Soldering Type: Reflow Soldering
0.5
1.35
Package Information
Ex
0.29
11.45
Thermal Pad
Published by Infineon Technologies AG
http://www.Datasheet4U.com
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页数 | 2 页 | ||
下载 | [ PG-LQFP-64-6.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
PG-LQFP-64-12 | Package Outline | Infineon |
PG-LQFP-64-13 | Package Outline | Infineon |
PG-LQFP-64-19 | Package Outline | Infineon |
PG-LQFP-64-22 | Package Outline | Infineon |
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