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PDF ( 数据手册 , 数据表 ) IRF6810STR1PBF

零件编号 IRF6810STR1PBF
描述 Power MOSFET ( Transistor )
制造商 International Rectifier
LOGO International Rectifier LOGO 


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IRF6810STR1PBF 数据手册, 描述, 功能
PD -96393
IRF6810STRPbF
IRF6810STR1PbF
l RoHS Compliant and Halogen Free 
l Low Profile (<0.7 mm)
l Dual Sided Cooling Compatible 
l Ultra Low Package Inductance
l Optimized for High Frequency Switching 
l Ideal for CPU Core DC-DC Converters
l Optimized for Control FET Application
l Compatible with existing Surface Mount Techniques 
l 100% Rg tested
l Footprint compatible to DirectFET
DirectFET®plus Power MOSFET ‚
Typical values (unless otherwise specified)
VDSS
VGS
RDS(on)
RDS(on)
25V max ±16V max 4.0mΩ @ 10V 5.6mΩ @ 4.5V
Qg tot Qgd
Qgs2
Qrr
Qoss Vgs(th)
7.4nC 2.7nC 0.98nC 12nC 8.9nC 1.6V
DGS
D
Applicable DirectFET Outline and Substrate Outline 
S1 DirectFET®plus ISOMETRIC
S1 S2 SB
M2 M4
L4 L6 L8
Description
The IRF6810STRPbF combines the latest HEXFET® Power MOSFET Silicon technology with the advanced DirectFETTM packaging to
achieve improved performance in a package that has the footprint of a MICRO-8 and only 0.7 mm profile. The DirectFET package is
compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection
soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET
package allows dual sided cooling to maximize thermal transfer in power systems, improving previous best thermal resistance by 80%.
The IRF6810STRPbF has low gate resistance and low charge along with ultra low package inductance providing significant reduction in
switching losses. The reduced losses make this product ideal for high efficiency DC-DC converters that power the latest generation of
processors operating at higher frequencies. The IRF6810STRPbF has been optimized for the control FET socket of synchronous buck
operating from 12 volt bus converters.
Absolute Maximum Ratings
Parameter
VDS Drain-to-Source Voltage
VGS
ID @ TA = 25°C
ID @ TA = 70°C
ID @ TC = 25°C
IDM
EAS
IAR
Gate-to-Source Voltage
eContinuous Drain Current, VGS @ 10V
eContinuous Drain Current, VGS @ 10V
fContinuous Drain Current, VGS @ 10V
gPulsed Drain Current
hSingle Pulse Avalanche Energy
ÃgAvalanche Current
15
ID = 16A
10
TJ = 125°C
5
TJ = 25°C
0
0 2 4 6 8 10 12 14 16
VGS, Gate -to -Source Voltage (V)
Fig 1. Typical On-Resistance vs. Gate Voltage
Notes:
 Click on this section to link to the appropriate technical paper.
‚ Click on this section to link to the DirectFET Website.
ƒ Surface mounted on 1 in. square Cu board, steady state.
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Max.
25
±16
16
13
50
130
51
13
Units
V
A
mJ
A
14.0
12.0 ID= 13A
10.0
8.0
VDS= 20V
VDS= 13V
VDS= 5V
6.0
4.0
2.0
0.0
0
5 10 15 20
QG Total Gate Charge (nC)
Fig 2. Typical Total Gate Charge vs Gate-to-Source Voltage
„ TC measured with thermocouple mounted to top (Drain) of part.
… Repetitive rating; pulse width limited by max. junction temperature.
† Starting TJ = 25°C, L = 0.601mH, RG = 50Ω, IAS = 13A.
1
08/08/11
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IRF6810STR1PBF pdf, 数据表
IRF6810STRPbF
DirectFET®plus Outline Dimension, S1 Outline (Small Size Can, 1- Source Pad).
Please see DirectFET application note AN-1035 for all details regarding the assembly of DirectFETplus.
This includes all recommendations for stencil and substrate designs
DIMENSIONS
METRIC
IMPERIAL
CODE MIN MAX MIN MAX
A 4.75 4.85 0.187 0.191
B 3.70 3.95 0.146 0.156
C 2.75 2.85 0.108 0.112
D 0.35 0.45 0.014 0.018
E 0.48 0.52 0.019 0.020
F 0.58 0.62 0.023 0.024
G 0.48 0.52 0.019 0.020
H 1.08 1.12 0.043 0.044
J N/A N/A N/A N/A
K 0.80 0.90 0.031 0.035
L 1.70 1.80 0.067 0.071
M 0.535 0.595 0.021 0.023
P 0.08 0.17 0.003 0.007
R 0.02 0.08 0.0008 0.0031
DirectFET®plus Part Marking
8
GATE MARKING
LOGO
PART NUMBER
BATCH NUMBER
DATE CODE
Line above the last character of
the date code indicates "Lead-Free"
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