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PDF ( 数据手册 , 数据表 ) HSMC-C110

零件编号 HSMC-C110
描述 (HSMx-C110 - HSMx-C191) High Performance ChipLED
制造商 Avago
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HSMC-C110 数据手册, 描述, 功能
HSMx-C110/C170/C190/C191/C150
High Performance ChipLED
Data Sheet
HSMA-C110/C170/C190/C191/C150
HSML-C110/C170/C190/C191/C150
HSMC-C110/C170/C190/C191/C150
HSMZ-C110/C170/C190
Description
These chip-type LEDs utilize Aluminum Indium Gal-
lium Phosphide (AlInGaP) material technology. The
AlInGaP material has a very high luminous efficiency,
capable of producing high light output over a wide
range of drive currents. The available colors in this
surface mount series are 592 nm Amber, 605 nm
Orange, 626 nm Red for AS AlInGaP and 631 nm red
for TS AlInGaP.
All packages are binned by both color and intensity,
except for red color.
Features
• High brightness AlInGaP material
• Small size
• Industry standard footprint
• Diffused optics
• Top emitting or right angle emitting
• Available in 3 colors (red, orange, amber)
• Compatible with IR soldering
• Available in 8 mm tape on 7" diameter reel
• Reel sealed in zip locked moisture barrier bags
These ChipLEDs come either in two top emitting
packages (HSMx-C170/C190/C191/C150) or in a side
emitting package (HSMx-C110). The right angle
ChipLEDs are suitable for applications such as LCD
backlighting. The top emitting ChipLEDs with wide
viewing angle are suitable for light piping and direct
backlighting of keypads and panels. In order to facili-
tate pick and place operation, these ChipLEDs are
shipped in tape and reel, with 4000 units per reel for
HSMx-C170/C190/C191 and 3000 units per reel for
HSMx-C110/C150.
Applications
• LCD backlighting
• Push button backlighting
• Front panel indicator
• Symbol indicator
• Microdisplays
• Small message panel signage
These packages are compatible with IR soldering
process.
Free Datasheet http://www.datasheet-pdf.com/







HSMC-C110 pdf, 数据表
10 SEC. MAX.
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC.
Figure 7. Recommended reflow soldering profile.
0.9 (0.035)
5.0 (0.200)
0.9 (0.035)
0.2 (0.008)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
1.0 (0.039)
CENTERING
BOARD
Figure 9. Recommended soldering pattern for HSMx-C110.
217 °C
200 °C
150 °C
255 - 260 °C
3 °C/SEC. MAX.
3 °C/SEC. MAX.
60 - 120 SEC.
10 - 30 SEC.
6 °C/SEC. MAX.
100 SEC. MAX.
TIME
(Acc. to J-STD-020C)
Figure 8. Recommended Pb-free reflow soldering profile.
1.2 (0.047)
1.2
(0.047)
1.2
(0.047)
0.9
(0.035)
Figure 10. Recommended soldering pattern for HSMx-C170.
0.8 (0.031)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
Figure 11. Recommended soldering pattern for HSMx-C190 and C191.
1.5 (0.059)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 12. Recommended soldering pattern for HSMx-C150.
Note: All dimensions in millimeters (inches).
8
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HSMC-C110(HSMx-C110 - HSMx-C191) High Performance ChipLEDAvago
Avago

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