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PDF ( 数据手册 , 数据表 ) X7R0402

零件编号 X7R0402
描述 Surface Mount Multilayer Ceramic Chip Capacitors
制造商 Kemet
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X7R0402 数据手册, 描述, 功能
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Overview
KEMET’s X7R dielectric features a 125°C maximum operating
temperature and is considered “temperature stable.” The
Electronics Components, Assemblies & Materials Association
(EIA) characterizes X7R dielectric as a Class II material.
Components of this classification are fixed, ceramic dielectric
capacitors suited for bypass and decoupling applications
or for frequency discriminating circuits where Q and stability
of capacitance characteristics are not critical. X7R exhibits a
predictable change in capacitance with respect to time and voltage
and boasts a minimal change in capacitance with reference to
ambient temperature. Capacitance change is limited to ±15% from
-55°C to +125°C.
Benefits
• -55°C to +125°C operating temperature range
• Pb-Free and RoHS Compliant
• Temperature stable dielectric
• EIA 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2220,
and 2225 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
• Capacitance offerings ranging from 10 pF to 47 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request
(5% minimum)
Applications
Typical applications include decoupling, bypass, filtering and
transient voltage suppression.
Ordering Information
C 1206
Ceramic
Case Size
(L" x W")
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
C
Specification/
Series1
C = Standard
106
Capacitance
Code (pF)
2 Significant
Digits + Number
of Zeros
M
Capacitance
Tolerance
J = ±5%
K = ±10%
M = ±20%
4
Voltage
9 = 6.3 V
8 = 10 V
4 = 16 V
3 = 25 V
6 = 35 V
5 = 50 V
1 = 100 V
2 = 200 V
A = 250 V
R
Dielectric
R = X7R
AC
TU
Failure Rate/
Design
Termination Finish2
Packaging/Grade
(C-Spec)3
A = N/A
C = 100% Matte Sn
Blank = Bulk
TU = 7" Reel
Unmarked
TM = 7" Reel
Marked
1 Flexible termination option is available. Please see FT-CAP product bulletin C1013_X7R_FT-CAP_SMD.
2 Additional termination finish options may be available. Contact KEMET for details.
3 Additional reeling or packaging options may be available. Contact KEMET for details.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
One world. One KEMET
C1002_X7R_SMD • 9/20/2013 1
Free Datasheet http://www.datasheet-pdf.com/







X7R0402 pdf, 数据表
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2225 Case Sizes) cont'd
Cap
6.8 µF
8.2 µF
10 µF
15 µF
22 µF
47 µF
Cap
Series
C1210
C1808
C1812
C1825
C2220
C2225
Cap Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A 5 1 2 A
Code Voltage DC
Cap Tolerance
Product Availability and Chip Thickness Codes – See Table 2 for Chip Thickness Dimensions
685 J K M FG FG FG FM
825 J K M FH FH FH FK
106 J K M FH FH FH FS¹
156 J K M FM FM
226 J K M FS FS FS² FS²
476 J K M FS²
GK
JF JO
JO JO
JO
Voltage DC
Cap
Code
Voltage Code
9
8
4
3
5
1
2
A
5
1
2
3
5
1
2
A
5
1
2
A
3
5
1
2
A
5
1
2
A
Series
C1210
C1808
C1812
C1825
C2220
C2225
xx1 Available only in K, M tolerance.
xx2 Available only in M tolerance.
Table 2 – Chip Thickness/Packaging Quantities
Thickness
Code
BB
CB
CF
CC
CD
DC
DD
DE
DG
DH
EB
EC
EN
ED
EE
EF
EM
EG
EH
FB
FC
FD
FE
FF
FG
FL
FH
FM
Thickness
Code
Case
Size
0402
0603
0603
0603
0603
0805
0805
0805
0805
0805
1206
1206
1206
1206
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1210
Case
Size
Thickness ±
Range (mm)
0.50 ± 0.05
0.80 ± 0.07
0.80 ± 0.07
0.80 ± 0.10
0.80 ± 0.15
0.78 ± 0.10
0.90 ± 0.10
1.00 ± 0.10
1.25 ± 0.15
1.25 ± 0.20
0.78 ± 0.10
0.90 ± 0.10
0.95 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.20 ± 0.15
1.25 ± 0.15
1.60 ± 0.15
1.60 ± 0.20
0.78 ± 0.10
0.90 ± 0.10
0.95 ± 0.10
1.00 ± 0.10
1.10 ± 0.10
1.25 ± 0.15
1.40 ± 0.15
1.55 ± 0.15
1.70 ± 0.20
Thickness ±
Range (mm)
Paper Quantity
7" Reel
10,000
4,000
4,000
4,000
4,000
4,000
4,000
0
0
0
4,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
7" Reel
13" Reel
50,000
10,000
15,000
10,000
10,000
10,000
10,000
0
0
0
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
13" Reel
Paper Quantity
Package quantity based on finished chip thickness specifications.
Plastic Quantity
7" Reel
0
0
0
0
0
0
0
2,500
2,500
2,500
4,000
4,000
4,000
2,500
2,500
2,500
2,500
2,000
2,000
4,000
4,000
4,000
2,500
2,500
2,500
2,000
2,000
2,000
7" Reel
13" Reel
0
0
0
0
0
0
0
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
10,000
10,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
13" Reel
Plastic Quantity
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for
Order Info.
C1002_X7R_SMD • 9/20/2013 8
Free Datasheet http://www.datasheet-pdf.com/







X7R0402 equivalent, schematic
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – X7R Dielectric, 6.3 – 250 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
T P2
ØDo
Po
[10 pitches cumulative
tolerance on tape ± 0.2 mm]
E1
Bottom Cover Tape
A0
B0
F
E2
W
T1
T1
Top Cover Tape
Center Lines of Cavity
P1 G
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
User Direction of Unreeling
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Tape Size
8 mm
Tape Size
8 mm
8 mm
D0
1.5 +0.10 -0.0
(0.059 +0.004 -0.0)
Pitch
Half (2 mm)
Single (4 mm)
Constant Dimensions — Millimeters (Inches)
E1
1.75 ±0.10
(0.069 ±0.004)
P0
4.0 ±0.10
(0.157 ±0.004)
P2
2.0 ±0.05
(0.079 ±0.002)
T1 Maximum
0.10
(0.004) Maximum
G Minimum
0.75
(0.030)
Variable Dimensions — Millimeters (Inches)
E2 Minimum
6.25
(0.246)
F
3.5 ±0.05
(0.138 ±0.002)
P1
2.0 ±0.05
(0.079 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
T Maximum
1.1
(0.098)
W Maximum
8.3
(0.327)
8.3
(0.327)
R Reference
Note 2
25
(0.984)
A0 B0
Note 1
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
c) rotation of the component is limited to 20° maximum (see Figure 3).
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).
e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1002_X7R_SMD • 9/20/2013 16
Free Datasheet http://www.datasheet-pdf.com/










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