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PDF ( 数据手册 , 数据表 ) FX11LB-140S-SV

零件编号 FX11LB-140S-SV
描述 0.5mm Pitch Connectors
制造商 HRS
LOGO HRS LOGO 


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FX11LB-140S-SV 数据手册, 描述, 功能
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative.
0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
FX11 Series
Stacking height : 2mm
Stacking height : 2.5mm, 3mm
Features
1. Low Profile Design
The board to board mating height of 2mm, 2.5mm and 3mm suits
smaller, thinner case designs.
2. Improved Transmission Efficiency Between Boards
Transmission characteristics have been improved through
a design that fixes ground plates to both sides of the
header and receptacle.
3. 10 Signal:1 Ground Arrangement
Signal and ground are arranged in a ratio of 10:1 with the
ground plate SMT connected to the board. The ground
stability achieved serves to reduce noise.
4. Metal Fittings for Added Solder Weld Strength
Metal fittings provide greater adhesion to the board,
protecting against peeling.The unique connector design
provides a connection between the fitting and the ground
plate for a stronger ground.
5. Suited to High-Density Applications
The signal contact pitch of 0.5mm produces a smaller
connector utilizing less board area for mounting.
6. Structure Prevents Solder Wicking
A solder gap has been designed into the contact SMT
portion to prevent solder wicking.
7. High contact reliability
Effective mating length is 0.55mm (2mm height),
1mm(2.5mm, 3mm height) for signal contacts.
8. Optional Ground Plate
An alternate style without the ground plate is available.The
space provided by the ground plate removal has been filled
with additional signal contacts.
Applications
Notebook computers, PDA, and other miniature electronic equipment.
10 Signal: 1 Ground Arrangement
Housing
Metal fitting
0.5mm
0.75mm
Ground Plate
Signal contact
0.75mm
Ground plate and metal fitting make contact
Stacking height variation
2mm 2.5 , 3
mm
Note: 2.0mm type and 2.5mm, 3mm type are not mated with each other.
Structure Prevent solder vicking
Contact
surface
Solder gap portion
Board mounting portion
Land
A222
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FX11LB-140S-SV pdf, 数据表
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be disconFtiXnu1e1d sSooenr. iPelesase0ch.5ecmk tmhe PpriotdcuhctsCsotantuns eonctthoerHsirowseitwhebGsitreoRuoHnSdseParlcahteat fwowrw.2himrosme-ctoonn3ecmtorms.cBomo, aorrcdo-nttoac-tByoouar rHdiroCseosnanlesercetpiroesnesntative.
Stacking height : 2.5mm, 3mm
Product Specifications
Rated current 0.3 A (Note 1) Operating temperature range -55 to 85ç
Storage temperature range -10 to +60ç (Note 2)
Rating Rated voltage 50 V AC
Operating humidity range Relative humidity 95% or less Storage humidity range -40 to -70% (Note 2)
(No condensation)
Item
1. Insulation resistance
2. Voltage proof
3. Contact resistance
4. Vibration
Requirements
100 Mø or greater
No flashover or breakdown
70 mø or less
No electrical discontinuity for 1μs or greater
No damage, cracks, or parts looseness
Conditions
Measured at 100 V DC
150 V AC applied for one minute
Measured at 100 mA
Frequency: 10 to 55 Hz, amplitude of 0.75 mm in 3 directions,
10 cycles each
5. Shock
No electrical discontinuity for 1μs or longer
No damage, cracks, or parts looseness
Acceleration of 490 m/s2, 11ms duration, sine half-wave
waveform,for 3 cycles in the both directions of each of the 3 axes
6. Damp heat
(Steady state)
Contact resistance of 80 mø or less, insulation resistance of
100 Mø or greater, no damage, cracks, or parts looseness
Temperature of 40ç, humidity of 90 to 95%, duration 96 h
7. Temperature cycle
Contact resistance of 80 mø or less, insulation resistance of Temperature: -55ç 15 to 35ç 85ç 15 to 35ç
100 Mø or greater, no damage, cracks, or parts looseness Time: 30 min. 2 to 3 min. 30 min. 2 to 3 min. for 5 cycles
8. Durability
Contact resistance of 80 mø or less
No damage, cracks, or parts looseness
50 times
9. Resistance to
soldering heat
No melting of resin portion which affects performance
Reflow: At the recommended temperature profile
Soldering iron temperature: 360ç for 5 seconds
Note 1: The term storage refers to an unused products prior to board mounting (including packing materials) that is being kept for a long period.
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.
Note 2: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for
a specific part number shown.
Materials
Part
Insulator
Contacts
Ground plate
Metal fitting
Metal plate
Material
LCP
Copper alloy
Phosphor bronze
Phosphor bronze
Phosphor bronze
Beige
Header
Receptacle
Tin plating
Tin plating
Finish
Engagement Area: Gold plating of 0.1μm
Termination Area: Flash plating
Remarks
UL94V-0
----------
----------
----------
----------
Ordering information
Type With Ground Plate FX11 # - π P / π - SV 0.5 (✽ ✽)
12
4
56
7
3
Type Without Ground Plate FX11 # - π P - SV 0.5 (✽ ✽)
12
3
1 Series name : FX11
2 Form Symbol A : With guide post
B : Without guide post
3 Number of contacts Type with ground plate
Signal/Ground:60/6,
80/8, 100/10
Type without ground
Signal: 80, 100
4
56
7
4 Connector type
P : Header
S : Receptacle
5 Contact form
SV : Straight SMT
6 Product height
Blank: Standard
0.5 : Standard + 0.5mm
7 Blank, (71): Tray packaging (Without pick-and-place tape)
(21),(91): Embossed tape packaging (Without pick-and-place tape)
(22),(92): Embossed tape packaging (With pick-and-place tape)
A229
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FX11LB-140S-SV equivalent, schematic
The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information.
All non-RoHS products have been discontinued, or will be disconFtiXnu1e1d sSooenr. iPelesase0ch.5ecmk tmhe PpriotdcuhctsCsotantuns eonctthoerHsirowseitwhebGsitreoRuoHnSdseParlcahteat fwowrw.2himrosme-ctoonn3ecmtorms.cBomo, aorrcdo-nttoac-tByoouar rHdiroCseosnanlesercetpiroesnesntative.
BRecommended Temperature Profile
260 (MAX250ç)
240
220 220ç
200 200ç
180
160
140 150ç
0
(90 to 120 sec.)
(60 sec. max.) Time(sec.)
Preheating(150 to 200ç) Soldering
(220ç min)
Note : The temperature profile indicates the maximum temperature
of the connector surfaces at the highest point from the PCB
mounting surface.
HRS test conditions
Test boardGlass epoxy 60mm∞35mm∞1.6mm thick
Solder method : Reflow
Solder composition : Paste,96.5%Sn/ 3%Ag/ 0.5%Cu
Metal mask
: 0.15mm thick
Reflow cycles
: 2 cycles
The temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and
board size/thickness. Consult your solder paste and
equipment manufacturer for specific recommendations.
BWashing Conditions
Organic Solvent Washing
Solvent
Room temperature washing Heated washing
IPA(Isopropyl alcohol)
Yes Yes
HCFC(Hydrochlorofluorocarbon)
Yes
Yes
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the
deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed.
BConnector Handling Precautions
1. Allowable Creepage Dimensions at Time of Mating
[Stacking height : 2mm]
The effective coupling length of this product is 0.55 mm for
the signal portion and the ground portion. The creepage of
the header and receptacle at the time of mating should be
within 0.18 mm of the completely coupled condition.
[Stacking height : 2.5mm, 3mm]
The effective coupling length of this product is 1 mm for the
signal portion and 0.7mm for the ground portion. The creepage
of the header and receptacle at the time of mating should be
within 0.4 mm of the completely coupled condition.
2. Compatibility
2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other.
3. Retension of Boards
Avoid the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors.
4. Solder Repair
Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair.
This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into
consideration prior to connector washing.
5. Miscellaneous
·Note that excessive twisting while inserting or withdrawing connectors will cause damage.
·The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance.
A237
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