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PDF ( 数据手册 , 数据表 ) JMK316BJ106ML

零件编号 JMK316BJ106ML
描述 HIGH VALUE MULTILAYER CERAMIC CAPACITORS
制造商 Taiyo Yuden
LOGO Taiyo Yuden LOGO 


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JMK316BJ106ML 数据手册, 描述, 功能
www.DataSheet.co.kr
HIGH VALUE MULTILAYER CERAMIC
CAPACITORS
OPERATING TEMP.
code
BJ
C
E
F
Temp.characteristics operating Temp. range
B K25VJ85C
X7R
K55VJ125C
X5R
K55VJ85C
C K25VJ85C
X5S
K55VJ85C
X6S
K55VJ105C
E K25VJ85C
Y5U
K30VJ85C
F K25VJ85C
Y5V
K30VJ85C
FEATURES
Y Ni
Y fESRg
Y
Y
Y
APPLICATIONS
YThe use of Nickel(Ni) as material for both the internal and external elec-
trodes improves the solderability and heat resistance characteristics. This
almost completely eliminates migration and raises the level of reliability
significantly.
YLow equivalent series resistance(ESR) provides excellent noise absorp-
tion characteristics.
YCompared to tantalum or aluminum electrolytic capacitors these ceramic
capacitors offer a number of excellent features, including:
Higher permissible ripple current values
Smaller case sizes relative to rated voltage
Improved reliability due to higher insulation resistance and break-
down voltage.
Y
Y
Y
DC-DC
LSI IC OP
f
f2 g
g
YGeneral digital circuit
YPower supply bypass capacitors
Liquid crystal modules
Liquid crystal drive voltage lines
LS I, I C, converters(both for input and output)
YSmoothing capacitors
DC-DC converters (both for input and output)
Switching power supplies (secondary side)
ORDERING CODE
1
hVDCi
A4
J 6.3
L 10
E 16
T 25
G 35
U 50
2
M
JMK
3
K
4
hEIAiLPWfmmg
107f0603g
1.6P0.8
212f0805g
2.0P1.25
316f1206g
3.2P1.6
325f1210g
3.2P2.5
432f1812g
4.5P3.2
5
QF
QC
QE
BJ
6
473
105
hLi
J30
K80
M20
JK225005
M10
QW
hpFi
47,000
1,000,000
316BJ10
7
K
M
Z
8
K
V
A
D
F
G
H
L
N
Y
M
U
6
M10
M20
J80
K20
%
%
%
hmmi
0.45
0.5
0.8
0.85
1.15
1.25
1.5
1.6
1.9
2.0max
2.5
3.2
ML
9
K
10
B
T
11
Q
fg
QW
_TZ
1 23
4
5 6 7 8 9 10 11
1
Rated voltagehVDCi
A4
J 6.3
L 10
E 16
T 25
G 35
U 50
2
Series name
M Multilayer Ceramic Capacitors
3
End termination
K Plated
4
Dimensionshcase sizeifmmg
107f0603g
1.6P0.8
212f0805g
2.0P1.25
316f1206g
3.2P1.6
325f1210g
3.2P2.5
432f1812g
4.5P3.2
38
5
Temperature characteristics code
QF
Y5V
K30VJ85C
J22NK82L
BJ
X7R
K55VJ125C
M15L
BJ
X5R
K55VJ85C
M15L
QC
X5S
K55VJ85C
M22L
QC
X6S
K55VJ105C
M22L
QE
Y5U
K30VJ85C
M22NK56L
6 QWBlank space
Nominal capacitancehpFi
example
473 47,000
105 1,000,000
7
Capacitance toleranceshLi
K M10
M M20
Z
J80
K20
8
Thicknesshmmi
K 0.45
V 0.5
A 0.8
D 0.85
F 1.15
G 1.25
H 1.5
L 1.6
N 1.9
Y 2.0max
M 2.5
U 3.2
9
Special code
K Standard products
10
Packaging
B Bulk
T Tape & reel
11
Internal code
Q Standard products
QWBlank space
Datasheet pdf - http://www.DataSheet4U.net/







JMK316BJ106ML pdf, 数据表
www.DataSheet.co.kr
ELECTRICAL CHARACTERISTICS
LMK212BJ105K
LMK212BJ225M
4
JMK212BJ106M
LMK432BJ226M
TMK107 C105M
TMK316 C106M
JMK432C107M
45Datasheet pdf - http://www.DataSheet4U.net/







JMK316BJ106ML equivalent, schematic
www.DataSheet.co.kr
PRECAUTIONS
3/6
Precautions on the use of Multilayer Ceramic Capacitors
Stages
Precautions
Technical considerations
3.Considerations for auto-
matic placement
Adjustment of mounting machine
1. Excessive impact load should not be imposed on the capaci-
tors when mounting onto the PC boards.
2. The maintenance and inspection of the mounters should be
conducted periodically.
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the
capacitors, causing damage. To avoid this, the following points should be considered
before lowering the pick-up nozzle:
(1)The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC
board after correcting for deflection of the board.
(2)The pick-up pressure should be adjusted between 1 and 3 N static loads.
(3)To reduce the amount of deflection of the board caused by impact of the pick-up nozzle,
supporting pins or back-up pins should be used under the PC board. The following dia-
grams show some typical examples of good pick-up nozzle placement:
Not recommended
Recommended
Single-sided
mounting
4
Double-sided
mounting
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or
cracking of the capacitors because of mechanical impact on the capacitors. To avoid
this, the monitoring of the width between the alignment pin in the stopped position, and
maintenance, inspection and replacement of the pin should be conducted periodically.
Selection of Adhesives
1. Mounting capacitors with adhesives in preliminary assembly,
before the soldering stage, may lead to degraded capacitor
characteristics unless the following factors are appropriately
checked; the size of land patterns, type of adhesive, amount
applied, hardening temperature and hardening period. There-
fore, it is imperative to consult the manufacturer of the adhe-
sives on proper usage and amounts of adhesive to use.
1. Some adhesives may cause reduced insulation resistance. The difference between the
shrinkage percentage of the adhesive and that of the capacitors may result in stresses
on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied
to the board may adversely affect component placement, so the following precautions
should be noted in the application of adhesives.
(1)Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting &
solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
(2)The recommended amount of adhesives is as follows;
Figure
a
b
c
212/316 case sizes as examples
0.3mm min
100 V120 Am
Adhesives should not contact the pad
91Datasheet pdf - http://www.DataSheet4U.net/










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