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PDF ( 数据手册 , 数据表 ) L74VHC1G66

零件编号 L74VHC1G66
描述 Single Supply Analog Switch
制造商 LRC
LOGO LRC LOGO 


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L74VHC1G66 数据手册, 描述, 功能
LESHAN RADIO COMPANY, LTD.
Single Supply Analog Switch
L74VHC1G66
The L74VHC1G66 is an advanced high speed CMOS bilateral analog switch fabricated with silicon gate
CMOS technology. Itachieves high speed propagation delays and low ON resistances while maintaining low power
dissipation.This bilateral switch controls analog and digital voltages that may vary across the full power–supply range
(from VCC to GND).
The L74VHC1G66 is compatible in function to a single gate of the High Speed CMOS L74VHC4066.The device
has been designed so the ON resistances (RON ) are lower and more linear over input voltage.
The ON/OFF control inputs are compatible with standard CMOSoutputs. The ON/OFF control input structure
provides protection when voltages between 0 V and 5.5 V are applied, regardless of the supply voltage. This input
structure helps prevent device destruction caused by supply voltage – input/output voltage mismatch, battery backup, hot
insertion, etc.
High Speed: tPD = 20 ns (Typ) at VCC = 5.0 V
Low Power Dissipation: ICC = 1 mA (Max) at TA = 25°C
Diode Protection Provided on Inputs and Outputs
Improved Linearity and Lower ON Resistance over Input Voltage
5
4
1
2
3
SC–88A/SOT–353/SC–70
DF SUFFIX
5
4
1
2
3
TSOP–5/SOT–23/SC–59
DT SUFFIX
MARKING
DIAGRAMS
V9d
Pin 1
IN/OUT XA 1
OUT/IN YA 2
GND 3
5 VCC
4 ON/OFF CONTROL
Figure 1. Pinout
V9d
ON/OFF CONTROL
IN/OUT XA
X1
1
1
Pin 1
d = Date Code
Figure 2. Logic Symbol
PIN ASSIGNMENT
1 IN/OUT XA
2 OUT/IN YA
3 GND
4 ON/OFF CONTROL
5 VCC
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FUNCTION TABLE
On/Off Control Input
L
H
State of Analog Switch
Off
On
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
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L74VHC1G66 pdf, 数据表
LESHAN RADIO COMPANY, LTD.
L74VHC1G66
PACKAGE DIMENSIONS
SOT23–5/TSOP–5/SC59–5
DT SUFFIX
D
54
S 1 23
L
G
A
B
0.05 (0.002)
H
C
J
KM
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
MILLIMETERS
INCHES
DIM MIN MAX MIN MAX
A 2.90 3.10 0.1142 0.1220
B 1.30 1.70 0.0512 0.0669
C 0.90 1.10 0.0354 0.0433
D 0.25 0.50 0.0098 0.0197
G 0.85 1.05 0.0335 0.0413
H 0.013 0.100 0.0005 0.0040
J 0.10 0.26 0.0040 0.0102
K 0.20 0.60 0.0079 0.0236
L 1.25 1.55 0.0493 0.0610
M 0 _ 10_ 0_ 10_
S 2.50 3.00 0.0985 0.1181
0.074
1.9
0000..ÉÉÉÉÉÉÉÉÉ.00.99335577 ÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉÉ02.0.494
ÉÉÉÉÉÉÉÉÉ
ÉÉÉÉÉÉÉÉÉ
0.039
1.0
0.028
0.7
inches
mm
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