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PDF ( 数据手册 , 数据表 ) FSB50550US

零件编号 FSB50550US
描述 Smart Power Module
制造商 Fairchild Semiconductor
LOGO Fairchild Semiconductor LOGO 


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FSB50550US 数据手册, 描述, 功能
February 2009
FSB50550US
Smart Power Module (SPM®)
Features
• 500V RDS(on)=1.4Ω(max) 3-phase FRFET inverter including
high voltage integrated circuit (HVIC)
• 3 divided negative dc-link terminals for inverter current sens-
ing applications
• HVIC for gate driving and undervoltage protection
• 3/5V CMOS/TTL compatible, active-high interface
• Optimized for low electromagnetic interference
• Isolation voltage rating of 1500Vrms for 1min.
• Surface mounted device package
• Moisture Sensitive Level (MSL) 3
General Description
FSB50550US is a tiny smart power module (SPM®) based on
FRFET technology as a compact inverter solution for small
power motor drive applications such as fan motors and water
suppliers. It is composed of 6 fast-recovery MOSFET (FRFET),
and 3 half-bridge HVICs for FRFET gate driving. FSB50550US
provides low electromagnetic interference (EMI) characteristics
with optimized switching speed. Moreover, since it employs
FRFET as a power switch, it has much better ruggedness and
larger safe operation area (SOA) than that of an IGBT-based
power module or one-chip solution. The package is optimized
for the thermal performance and compactness for the use in the
built-in motor application and any other application where the
assembly space is concerned. FSB50550US is the most
solution for the compact inverter providing the energy efficiency,
compactness, and low electromagnetic interference.
www.DataAShbeseto4Ul.ucotme Maximum Ratings
Symbol
Parameter
VPN
DC Link Input Voltage,
Drain-source Voltage of each FRFET
ID25 Each FRFET Drain Current, Continuous
ID80 Each FRFET Drain Current, Continuous
IDP Each FRFET Drain Current, Peak
PD Maximum Power Dissipation
VCC Control Supply Voltage
VBS High-side Bias Voltage
VIN Input Signal Voltage
TJ Operating Junction Temperature
TSTG Storage Temperature
RθJC Junction to Case Thermal Resistance
VISO Isolation Voltage
Conditions
Rating
500
TC = 25°C
TC = 80°C
TC = 25°C, PW < 100μs
TC = 25°C, Each FRFET
Applied between VCC and COM
Applied between VB(U)-U, VB(V)-V, VB(W)-W
Applied between IN and COM
2.0
1.5
5
14.5
20
20
-0.3 ~ VCC+0.3
-40 ~ 150
Each FRFET under inverter operating con-
dition (Note 1)
-50 ~ 150
8.6
60Hz, Sinusoidal, 1 minute, Connection
pins to heatsink
1500
Units
V
A
A
A
W
V
V
V
°C
°C
°C/W
Vrms
©2009 Fairchild Semiconductor Corporation
FSB50550US Rev. A
1
www.fairchildsemi.com







FSB50550US pdf, 数据表
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be
an exhaustive list of all such trademarks.
ACEx®
GlobalOptoisolator™
Power247®
SyncFET™
Across the board. Around the world.™ GTO™
ActiveArray™
HiSeC™
Bottomless™
i-Lo
PowerEdge™
PowerSaver™
PowerTrench®
TCM™
The Power Franchise®
Build it Now™
CoolFET™
ImpliedDisconnect™
IntelliMAX™
Programmable Active Droop™
tm
QFET®
TinyBoost™
CROSSVOLT
CTL™
ISOPLANAR™
MICROCOUPLER™
QS™
QT Optoelectronics™
TinyBuck™
TinyLogic®
Current Transfer Logic™
MicroPak™
Quiet Series™
TINYOPTO™
DOME™
E2CMOS™
EcoSPARK®
MICROWIRE™
MSX™
MSXPro™
RapidConfigure™
RapidConnect™
ScalarPump™
TinyPower™
TinyWire™
TruTranslation™
EnSigna™
FACT Quiet Series™
FACT®
FAST®
OCX™
OCXPro™
OPTOLOGIC®
OPTOPLANAR®
SMART START™
SPM®
STEALTH™
SuperFET™
µSerDes™
UHC®
UniFET™
VCX™
FASTr™
PACMAN™
SuperSOT™-3
Wire™
FPS™
FRFET®
POP™
Power220®
SuperSOT™-6
SuperSOT™-8
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS
HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF
THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE
UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF
FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE
PRODUCTS.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR
SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.
As used herein:
www.Dat1a.ShLeiefet4Usu.cpopmort devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to result
in significant injury to the user.
2. A critical component is any component of a life support
device or system whose failure to perform can be reasonably
expected to cause the failure of the life support device or
system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS
Definition of Terms
Datasheet Identification
Product Status
Advance Information
Formative or In Design
Preliminary
First Production
No Identification Needed Full Production
Obsolete
Not In Production
Definition
This datasheet contains the design specifications for product development.
Specifications may change in any manner without notice.
This datasheet contains preliminary data; supplementary data will be pub-
lished at a later date. Fairchild Semiconductor reserves the right to make
changes at any time without notice to improve design.
This datasheet contains final specifications. Fairchild Semiconductor reserves
the right to make changes at any time without notice to improve design.
This datasheet contains specifications on a product that has been discontin-
ued by Fairchild semiconductor. The datasheet is printed for reference infor-
mation only.
Rev. I15
FSB50550US Rev. A
8
www.fairchildsemi.com














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