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PDF ( 数据手册 , 数据表 ) US1881

零件编号 US1881
描述 CMOS MULTI-PURPOSE LATCH
制造商 Melexis Microelectronic Systems
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US1881 数据手册, 描述, 功能
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US1881
Features and Benefits
Chopper stabilized amplifier stage
Optimized for brushless DC motor applications
Miniature high reliability package
Operation down to 3.5V
CMOS for optimum stability, quality and cost
Low power consumption
Ordering Information
Part No.
US1881
US1881
US1881
Temperature Suffix
E (-40°C to 85°C)
K (-40°C to 125°C)
L (-40°C to 150°C)
Package Code
SO (SOT-23) or UA(TO-92)
SO (SOT-23) or UA(TO-92)
SO (SOT-23) or UA(TO-92)
Applications
Solid state switch
Brushless DC motor commutation
Speed Sensing
Linear position sensing
Angular position sensing
Current sensing
Pinout:
1 Functional Diagram
UA Package:
Pin1: VDD - supply
Pin2: GND - Ground
Pin3: OUT - Output
SO Package:
Pin1: VDD - supply
Pin2: OUT – Output
Pin3: GND - Ground
Note: Static electricity sensitive device; please observe
ESD precautions. Reverse voltage protection is not in-
cluded. For reverse polarity protection, a 100Ohm resistor
in series with VDD is recommended.
2 Description
The US1881 is the industry’s first Hall integrated circuit in SOT-23 package. The US1881 is a bipolar Hall effect
sensor IC based on mixed signal CMOS technology. It incorporates advanced chopper stabilization techniques to
provide accurate and stable magnetic switch points. There are many applications for this HED in addition to those
listed above. The design, specifications and performance have been optimized for commutation applications in 5V
and 12V brushless DC motors.
In UA packaged device the output transistor will be latched on (Bop) in presence of a sufficiently strong South
pole magnetic field facing the marked side of the package. Similarly, the output will be latched off (Brp) in the
presence of a North field. The SOT-23 device behaviour is reverse to the UA device. The SOT-23 output transistor will
be latched on (BOP) in the presence of a sufficiently strong North pole magnetic field on the marked side.
3901001881
Rev. 014
Page 1 of 12
Jun/05







US1881 pdf, 数据表
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US1881
12 Reliability Information
This Melexis device is classified and qualified regarding soldering technology, solderability and moisture
sensitivity level, as defined in this specification, according to following test methods:
IPC/JEDEC J-STD-020
Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface Mount Devices
(classification reflow profiles according to table 5-2)
EIA/JEDEC JESD22-A113
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing
(reflow profiles according to table 2)
CECC00802
Standard Method For The Specification of Surface Mounting Components (SMDs) of Assessed
Quality
EIA/JEDEC JESD22-B106
Resistance to soldering temperature for through-hole mounted devices
EN60749-15
Resistance to soldering temperature for through-hole mounted devices
MIL 883 Method 2003 / EIA/JEDEC JESD22-B102
Solderability
For all soldering technologies deviating from above mentioned standard conditions (regarding peak
temperature, temperature gradient, temperature profile etc) additional classification and qualification tests
have to be agreed upon with Melexis.
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of
adhesive strength between device and board.
Based on Melexis commitment to environmental responsibility, European legislation (Directive on the
Restriction of the Use of Certain Hazardous substances, RoHS) and customer requests, Melexis has
installed a Roadmap to qualify their package families for lead free processes also.
Various lead free generic qualifications are running, current results on request.
For more information on Melexis lead free statement see quality page at our website:
http://www.melexis.com/html/pdf/MLXleadfree-statement.pdf
13 ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
3901001881
Rev. 014
Page 8 of 11
Jun/05














页数 11 页
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