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PDF ( 数据手册 , 数据表 ) LIS302DLH

零件编号 LIS302DLH
描述 MEMS digital output motion sensor ultra low-power high performance 3-axes piccolo accelerometer
制造商 ST Microelectronics
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LIS302DLH 数据手册, 描述, 功能
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LIS302DLH
MEMS digital output motion sensor
ultra low-power high performance 3-axes “piccolo” accelerometer
Features
Wide supply voltage, 2.16 V to 3.6 V
Low voltage compatible IOs, 1.8 V
Ultra thickness 0.8 mm
Ultra low-power mode consumption
down to 10 µA
±2g/±4g/±8g dynamically selectable full-scale
I2C/SPI digital output interface
16 bit data output
2 independent programmable interrupt
generators for free-fall and motion detection
Sleep to wake-up function
6D orientation detection
Embedded self-test
10000 g high shock survivability
ECOPACK® RoHS and “Green” compliant (see
Section 8)
Applications
Motion activated functions
Free-fall detection
Intelligent power saving for handheld devices
Pedometer
Display orientation
Gaming and virtual reality input devices
Impact recognition and logging
Vibration monitoring and compensation
LGA-14 (3x5x0.8mm)
Description
The LIS302DLH is an ultra low-power high
performance three axes linear accelerometer
belonging to the “piccolo” family, with digital
I2C/SPI serial interface standard output.
The device features ultra low-power operational
modes that allow advanced power saving and
smart sleep to wake-up functions.
The LIS302DLH has dynamically user selectable
full scales of ±2g/±4g/±8g and it is capable of
measuring accelerations with output data rates
from 0.5 Hz to 1 kHz.
The self-test capability allows the user to check
the functioning of the sensor in the final
application.
The device may be configured to generate
interrupt signal by inertial wake-up/free-fall events
as well as by the position of the device itself.
Thresholds and timing of interrupt generators are
programmable by the end user on the fly.
The LIS302DLH is available in small thin plastic
land grid array package (LGA) and it is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1. Device summary
Order codes
Temperature range [° C]
LIS302DLH
-40 to +85
LIS302DLHTR
-40 to +85
Package
LGA-14
LGA-14
Packaging
Tray
Tape and reel
June 2009
Doc ID 15797 Rev 1
1/37
www.st.com
37







LIS302DLH pdf, 数据表
www.DataSBhleoect4kU.dcoiamgram and pin description
LIS302DLH
Table 2. Pin description
Pin#
Name
Function
1 Vdd_IO Power supply for I/O pins
2
GND
0V supply
3 Reserved Connect to Vdd
4
GND
0V supply
5
GND
0V supply
6 Vdd Power supply
SPI enable
7 CS I2C/SPI mode selection (1: I2C mode; 0: SPI enabled)
8
INT1
Inertial interrupt 1
9
INT2
Inertial interrupt 2
10
GND
0V supply
11 Reserved Connect to Gnd
SPI serial data output
12
SDO
I2C less significant bit of the device address
SDA
I2C serial data (SDA)
13 SDI SPI serial data input (SDI)
SDO
3-wire interface serial data output (SDO)
SCL I2C serial clock (SCL)
14
SPC
SPI serial port clock (SPC)
8/37 Doc ID 15797 Rev 1







LIS302DLH equivalent, schematic
www.DataSAhpeept4liUc.acotimon hints
4 Application hints
Figure 5. LIS302DLH electrical connection
LIS302DLH
Vdd
10uF
100nF
6
Top VIEW
8
Vdd_IO
1Z
1
YX
13
6
8
13 TOP VIEW
DIRECTIONS OF THE
DETECTABLE
ACCELERATIONS
GND
Digital signal from/to signal controller.Signal’s levels are defined by proper selection of Vdd_IO
The device core is supplied through Vdd line while the I/O pads are supplied through
Vdd_IO line. Power supply decoupling capacitors (100 nF ceramic, 10 µF Aluminum) should
be placed as near as possible to the pin 6 of the device (common design practice).
All the voltage and ground supplies must be present at the same time to have proper
behavior of the IC (refer to Figure 5). It is possible to remove Vdd maintaining Vdd_IO
without blocking the communication bus, in this condition the measurement chain is
powered off.
The functionality of the device and the measured acceleration data is selectable and
accessible through the I2C/SPI interface.When using the I2C, CS must be tied high.
The functions, the threshold and the timing of the two interrupt pins (INT 1 and INT 2) can be
completely programmed by the user through the I2C/SPI interface.
4.1 Soldering information
The LGA package is compliant with the ECOPACK®, RoHS and “Green” standard.
It is qualified for soldering heat resistance according to JEDEC J-STD-020C.
Leave “Pin 1 Indicator” unconnected during soldering.
Land pattern and soldering recommendations are available at www.st.com.
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Doc ID 15797 Rev 1










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