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PDF ( 数据手册 , 数据表 ) TMP125

零件编号 TMP125
描述 2C Accurate Digital Temperature Sensor
制造商 Burr-Brown Corporation
LOGO Burr-Brown Corporation LOGO 


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TMP125 数据手册, 描述, 功能
TMP125
SBOS323 − DECEMBER 2004
2°C Accurate Digital Temperature Sensor
with SPIInterface
FEATURES
D DIGITAL OUTPUT: SPI-Compatible Interface
D RESOLUTION: 10-Bit, 0.25°C
www.DataSheet4UD.comACCURACY:
±2.0°C (max) from −25°C to +85°C
±2.5°C (max) from −40°C to +125°C
D LOW QUIESCENT CURRENT: 50µA (max)
D WIDE SUPPLY RANGE: 2.7V to 5.5V
D TINY SOT23-6 PACKAGE
D OPERATION FROM −40°C to +125°C
APPLICATIONS
D BASE STATION EQUIPMENT
D COMPUTER PERIPHERAL THERMAL
PROTECTION
D NOTEBOOK COMPUTERS
D DATA ACQUISITION SYSTEMS
D TELECOM EQUIPMENT
D OFFICE MACHINES
TMP125 RELATED PRODUCTS
FEATURES
2°C Digital Temp Sensors with Two-Wire Interface
1.5°C Digital Temp Sensors with Two-Wire Interface
1.5°C Digital Temp Sensors with SPI
1.5°C Programmable Digital Temp Sensors with SPI
PRODUCT
TMP100/101
TMP75/175
TMP121/123
TMP122/124
DESCRIPTION
The TMP125 is an SPI-compatible temperature sensor
available in the tiny SOT23-6 package. Requiring no
external components, the TMP125 is capable of
measuring temperatures within 2°C of accuracy over a
temperature range of −25°C to +85°C and 2.5°C of
accuracy over −40°C to +125°C. Low supply current, and
a supply range from 2.7V to 5.5V, make the TMP125 an
excellent candidate for low-power applications.
The TMP125 is ideal for extended thermal measurement
in a variety of communication, computer, consumer,
environmental, industrial, and instrumentation
applications.
Temperature
GND 1
Diode
Temp.
Sensor
Control
Logic
6 SO
SI 2
∆Σ
A/D
Converter
Serial
Interface
5 CS
V+ 3
OSC
Config.
and Temp.
Register
4 SCK
TMP125
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
SPI is a registered trademark of Motorola. All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Products
conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters.
Copyright 2004, Texas Instruments Incorporated
www.ti.com







TMP125 pdf, 数据表
www.ti.com
PACKAGE OPTION ADDENDUM
11-Mar-2005
PACKAGING INFORMATION
Orderable Device
TMP125AIDBVR
TMP125AIDBVRG4
TMP125AIDBVT
Status (1)
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOT-23
Package
Drawing
DBV
SOT-23
SOT-23
DBV
DBV
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
6 3000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
6 3000
None
Call TI
Call TI
6 250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
www.DataSheet4NUR.cNomD: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - May not be currently available - please check http://www.ti.com/productcontent for the latest availability information and additional
product content details.
None: Not yet available Lead (Pb-Free).
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean "Pb-Free" and in addition, uses package materials that do not contain halogens,
including bromine (Br) or antimony (Sb) above 0.1% of total product weight.
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1














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