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PDF ( 数据手册 , 数据表 ) FD120W06A5B

零件编号 FD120W06A5B
描述 Fred Die
制造商 International Rectifier
LOGO International Rectifier LOGO 


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FD120W06A5B 数据手册, 描述, 功能
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PD - 20988 rev. A
FD120W06A5B
FRED Die in Wafer Form
z 100% Tested at Probe c
z Available in Tape and Reel,
Chip Pack, and Sawn on Film d (upon request)
600V
VF = 3.2 V
(max.)
5" Wafer
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Description
Min Typ Max
Test Conditions
VFM
VRRM
IRM
trr
Qrr
Maximum Forward Voltage
Minimum Reverse Breakdown Voltage
Max. Reverse Leakage Current
Typ. Reverse Recovery Time
Typ. Reverse Recovery Charge
–––
600V
–––
–––
–––
–––
–––
–––
–––
18ns
20ns
350nC
3.2V
–––
50µA
–––
–––
–––
TJ = 25°C, IF = 15A
TJ = 25°C, IRRM = 100µA
TJ = 25°C, VRRM = 600V
IF = 1A, di/dt = 100A/µs, VR = 30V
IF = 15A, di/dt = 100A/µs, VR = 30V
TJ = 125°C, IF = 15A, di/dt = 80A/µs, VR = 390V
Mechanical Data
Nominal Back Metal Composition, Thickness:
Nominal Front Metal Composition, Thickness:
Dimensions:
Wafer Diameter:
Wafer Thickness:
Scribe Line Width
Reject Ink Dot Size
Recommended Storage Environment:
Recommended Die Attach Conditions:
Reference Packaged Part
Cr-Ni-Ag ( 1kA-2kA-3kA)
99%Al, 1%Si (3mm)
0.120" x 0.120" (see drawing)
125 mm
14 mils
90 ±10 µm
0.25 mm Diameter Minimum
Store in original container, in dessicated
nitrogen, with no contamination
For optimum electrical results, die attach
temperature should not exceed 300 °C
15ETX06 Series
Die Outline
40 (1.57)
Wafer flat alligned with
side b of the die
Ø 125 (4.92)
a 0.35 ± 0.01
c (14 ± 0.4)
C
A
NOTES:
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS).
2. CONTROLLING DIMENSION (INCH):
3. DIMENSIONS AND TOLERANCES:
a = 3.05 +0, - 0.01
(120 +0, - 0.4)
b = 3.05 +0, - 0.01
(120 +0, - 0.4)
c = 1.98 +0, - 0.01
(78.1 +0, - 0.4)
d = 1.98 +0, - 0.01
(78.1 +0, - 0.4)
4. LETTER DESIGNATION:
A = Anode (Top Metal)
C = Cathode (Back Metal)
5. SAWING:
Recommended Blade
SEMITEC S1025 QS00 Blade
Note:
c The above data sheet is based on IR sample testing under certain predetermined and assumed conditions, and is
provided for illustration purposes only. Customers are encouraged to perform testing in actual proposed packaged
and use conditions. IR die products are tested using IR-based quality assurance procedures and are manufactured
using IR’s established processes. Programs for customer-specified testing are available upon request. IR has
experienced assembly yields of generally 95% or greater for individual die; however, customer’s results may vary.
Estimates such as those described and set forth in this data sheet for semiconductor die will vary depending on a
number of packaging, handling, use and other factors. Sold die may not perform on an equivalent basis to standard
package products and are therefore offered with a limited warranty as described in IR’s applicable standard terms
and conditions of sale. All IR die sales are subject to IR’s applicable standard terms and conditions of sale, which
are available upon request.
d Part number shown is for die in waveform. Contact factory for these other options.
www.irf.com
1
12/23/03












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