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PDF ( 数据手册 , 数据表 ) V048F015T80

零件编号 V048F015T80
描述 Voltage Transformation Module
制造商 Vicor Corporation
LOGO Vicor Corporation LOGO 


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V048F015T80 数据手册, 描述, 功能
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V•I ChipTM – VTM
Voltage Transformation Module
• 48V to 1.5V V•I Chip Converter
• 80 A (120 A for 1 ms)
• High density – up to 320 A/in3
• Small footprint – 80 A/in2
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >92% efficiency at 1.5V
• 125°C operation
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I Chip BGA package
V048K015T801
Vf = 32 - 57.6 V
VOUT = 1.0 - 1.8 V
IOUT = 80 A
K = 1/32
ROUT = 1.5 mmax
©
Actual size
Product Description
Absolute Maximum Ratings
The V048K015T80 VI Chip Voltage Transformation
Module (VTM) breaks records for speed, density and
Parameter
Values
Unit
Notes
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
+In to -In
+In to -In
-1.0 to 60.0
Vdc
100 Vdc For 100 ms
isolation from input to output. It achieves a response
PC to -In
-0.3 to 7.0
Vdc
time of less than 1 µs and delivers up to 80A in a
TM to -In
-0.3 to 7.0
Vdc
volume of less than 0.25 in3 while converting 48 V to
1.5 V with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 1.0 to 1.8 Vdc.
P R E L I M I N A RYThe VTM V048K015T80’s nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, Vf, and is
controllable from 1.0 to 1.8 Vdc at no load, and from
0.9 V to 1.7 V at full load, over a Vf input range of 32 to
57.6 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K=1/32, and an output resistance, ROUT =1.3 milliohm,
to enable applications requiring a programmable low
output voltage at high current and high efficiency.
SG to -In
+Out to -Out
Isolation voltage
Operating junction temperature
Output current
Peak output current
Case temperature during reflow
Storage temperature
Output power
Peak output power
Thermal Resistance
500
-0.5 to 5.0
1500
-40 to 125
80
120
208
-40 to 150
144
216
mA
Vdc
Vdc Input to Output
°C See note 2
A Continuous
A For 1 ms
°C
°C
W Continuous
W For 1 ms
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter may be used to
Symbol Parameter
Typ Max Units
compensate for ROUT.
RθJC
Junction-to-case
1.1 1.5 °C/W
The 1.5V VTM achieves break-through current density
of 320 A/in3 in a VI Chip package compatible with
standard pick-and-place and surface mount assembly
processes. The VI Chip BGA package supports in-board
mounting with a low profile of 0.16" (4mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6mm)
over the board. The VTM’s fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
RθJB
RθJA
RθJA
Junction-to-BGA
Junction-to-ambient 3
Junction-to-ambient 4
2.1 2.5 °C/W
6.5 7.2 °C/W
5.0 5.5 °C/W
Notes
1. For complete product matrix, see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
Page 1 of 20







V048F015T80 pdf, 数据表
Mechanical Drawings
PRELIMINARY
SOLDER BALL
#A1 INDICATOR
21,5
0.85
1,00 18,00 1,00
0.039
0.709
0.039
6,0
0.24 (106) X ø 0,51 SOLDER BALL
0.020
9,00
0.354
SOLDER BALL #A1
1,00 TYP
0.039
30,00
1.181
32,0 28,8
1.26
1.13
CL
16,0
0.63
15,00
0.591
TOP VIEW (COMPONENT SIDE)
1,6 CL 1,00
0.06
BOTTOM VIEW
0.039
4,0
0.16
15,7
0.62
SEATING PLANE
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
3- PRODUCT MARKING ON BOTH TOP AND BOTTOM SURFACES
Figure 16—VTM BGA mechanical outline; In-board mounting
IN-BOARD MOUNTING
BGA surface mounting requires a
cutout in the PCB in which to recess the V•I Chip
(
ø
0,51
0.020
)
SOLDER MASK
DEFINED PADS
0,50
0.020
1,50
0.059
(01.,00309)
ø
0,53
0.021
PLATED
VIA
CONNECT TO
INNER LAYERS
0,50
0.020
1,00
0.039
SOLDER PAD #A1
18,00
0.709
9,00
0.354
1,00
0.039
(2)
X
10,00
0.394
(4)
X
6,00
0.236
20,00
0.787 17,00
0.669
15,00
0.591
13,00
0.512
PCB CUTOUT
24,00
0.945
16,00
0.630
8,00
0.315
29,26
1.152
(106) X
ø
0,51
0.020
SOLDER MASK
DEFINED PAD
8,08
0.318
16,16
0.636
(4) X R
1,6
0.06
0,37
0.015
Figure 17— VTM BGA PCB land/VIA layout information; In-board mounting
1,00
0.039
(01.,00309)
RECOMMENDED LAND AND VIA PATTERN
(COMPONENT SIDE SHOWN)
NOTES:
mm
1- DIMENSIONS ARE inch .
2- UNLESS OTHERWISE SPECIFIED, TOLERANCES ARE:
.X/[.XX] = +/-0.25/[.01]; .XX/[.XXX] = +/-0.13/[.005]
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
Page 8 of 20







V048F015T80 equivalent, schematic
Application Note (continued)
PRELIMINARY
V•I Chip Handling and Solderability
The product should remain in its package in a dry environment
until ready for use.
The following table shows the soldering requirements for both
the BGA in-board surface mount package and the J-lead
on-board surface mount package.
The reflow process should use industry standard Surface Mount
Technology (SMT) conditions. The exact conditions will
depend upon the solder paste manufacturer’s recommendations.
Under no circumstance should the case temperature exceed
208°C. Refer to Fig.32 for a suggested thermal profile.
Solder Paste
Stencil Thickness
Stencil Aperture
Placement
Acceleration Rate
BGA Package
63/37 "No Clean"*
4-6 mil
20 mil; 1:1 ratio
Within 50% of pad center
<500 in/sec2
J-Lead Package
63/37 "No Clean"
4-6 mil
0.8-0.9:1 ratio
± 5 mil
<500 in/sec2
*Halide free water washable 63/37 Flux paste can be used for the BGA version
package only. Please consult our Application Engineers for further information.
Figure 32—Thermal profile diagram
45 Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module Rev. 1.6
Page 16 of 20










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