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PDF ( 数据手册 , 数据表 ) 93AA76A

零件编号 93AA76A
描述 (93AA76A/B/C) 8K Microwire Compatible Serial EEPROM
制造商 Microchip Technology
LOGO Microchip Technology LOGO 


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93AA76A 数据手册, 描述, 功能
93AA76A/B/C, 93LC76A/B/C,
93C76A/B/C
8K Microwire Compatible Serial EEPROM
www.DataSheet4U.com
Device Selection Table
Part Number
93AA76A
93AA76B
93LC76A
93LC76B
93C76A
93C76B
93AA76C
93LC76C
93C76C
VCC Range
1.8-5.5
1.8-5-5
2.5-5.5
2.5-5.5
4.5-5.5
4.5-5.5
1.8-5.5
2.5-5.5
4.5-5.5
ORG Pin
No
No
No
No
No
No
Yes
Yes
Yes
PE Pin
No
No
No
No
No
No
Yes
Yes
Yes
Features
• Low-power CMOS technology
• ORG pin to select word size for ‘76C’ version
• 1024 x 8-bit organization ‘A’ devices (no ORG)
• 512 x 16-bit organization ‘B’ devices (no ORG)
• Program Enable pin to write-protect the entire
array (except on SOT-23 packages)
• Self-timed ERASE/WRITE cycles (including
auto-erase)
• Automatic ERAL before WRAL
• Power-on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device Status signal (READY/BUSY)
• Sequential READ function
• 1,000,000 E/W cycles
• Data retention > 200 years
• Temperature ranges supported:
- Industrial (I)
-40°C to +85°C
- Automotive (E)
-40°C to +125°C
Pin Function Table
Name
CS
CLK
DI
DO
VSS
PE
ORG
VCC
Function
Chip Select
Serial Data Clock
Serial Data Input
Serial Data Output
Ground
Program Enable
Memory Configuration
Power Supply
Word Size
8-bit
16-bit
8-bit
16-bit
8-bit
16-bit
8 or 16-bit
8 or 16-bit
8 or 16-bit
Temp Ranges
I
I
I, E
I, E
I, E
I, E
I
I, E
I, E
Packages
OT
OT
OT
OT
OT
OT
P, SN, ST, MS
P, SN, ST, MS
P, SN, ST, MS
Description
The Microchip Technology Inc. 93XX76A/B/C devices
are 8K bit, low-voltage, serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX76C are dependent upon external logic
levels driving the ORG pin to set word size. For
dedicated 8-bit communication, the 93XX76A devices
are available, while the 93XX76B devices provide
dedicated 16-bit communication, available on SOT-23
devices only. A Program Enable (PE) pin allows the
user to write-protect the entire memory array.
Advanced CMOS technology makes these devices
ideal for low-power, nonvolatile memory applications.
The 93XX Series is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead MSOP, 6-lead SOT-23,
and 8-lead TSSOP. Pb-free (Pure Matte Sn) finish is
also available.
Package Types (not to scale)
PDIP/SOIC
(P, SN)
SOT-23
(OT)
CS
CLK
DI
DO
1
2
3
4
8 VCC
7 PE
6 ORG
5 VSS
DO 1
VSS 2
DI 3
6 VCC
5 CS
4 CLK
TSSOP/MSOP
(ST, MS)
CS
CLK
DI
DO
1
2
3
4
8 VCC
7 PE
6 ORG
5 VSS
2004 Microchip Technology Inc.
DS21796D-page 1







93AA76A pdf, 数据表
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.6 ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)
The 93XX76A/B/C powers up in the ERASE/WRITE
Disable (EWDS) state. All programming modes must be
preceded by an ERASE/WRITE Enable (EWEN) instruc-
tion. Once the EWEN instruction is executed, program-
ming remains enabled until an EWDS instruction is
executed or VCC is removed from the device.
To protect against accidental data disturbance, the
EWDS instruction can be used to disable all ERASE/
WRITE functions and should follow all programming
operations. Execution of a READ instruction is
independent of both the EWEN and EWDS instructions.
FIGURE 2-3:
CS
EWDS TIMING
TCSL
CLK
DI
1 00
00
X
•••
X
FIGURE 2-4:
CS
EWEN TIMING
TCSL
CLK
DI
1
00
1
1X
2.7 READ
The READ instruction outputs the serial data of the
addressed memory location on the DO pin. A dummy
zero bit precedes the 8-bit (If ORG pin is low or A-Version
devices) or 16-bit (If ORG pin is high or B-version
FIGURE 2-5:
READ TIMING
CS
••• X
devices) output string. The output data bits will toggle on
the rising edge of the CLK and are stable after the spec-
ified time delay (TPD). Sequential read is possible when
CS is held high. The memory data will automatically cycle
to the next register and output sequentially.
CLK
DI 1 1 0 An ••• A0
DO HIGH-Z
0 Dx ••• D0 Dx ••• D0 Dx ••• D0
DS21796D-page 8
2004 Microchip Technology Inc.







93AA76A equivalent, schematic
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Du8-Lead Plastic Small Outline (al In-line (P) – 300 mil (PDIP)
E1
D
2
n1
E
A
α
A2
β
eB
c
A1
B1
B
L
p
Units
Dimension Limits
Number of Pins
Pitch
n
p
Top to Seating Plane
A
Molded Package Thickness
A2
Base to Seating Plane
A1
Shoulder to Shoulder Width
E
Molded Package Width
E1
Overall Length
D
Tip to Seating Plane
L
Lead Thickness
c
Upper Lead Width
B1
Lower Lead Width
B
Overall Row Spacing
§ eB
Mold Draft Angle Top
α
Mold Draft Angle Bottom
β
* Controlling Parameter
§ Significant Characteristic
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
8
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
MAX
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
MILLIMETERS
MIN NOM
8
2.54
3.56
3.94
2.92
3.30
0.38
7.62
7.94
6.10
6.35
9.14
9.46
3.18
3.30
0.20
0.29
1.14
1.46
0.36
0.46
7.87
9.40
5 10
5 10
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
MAX
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
DS21796D-page 16
2004 Microchip Technology Inc.










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