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PDF ( 数据手册 , 数据表 ) S71GL512NB0

零件编号 S71GL512NB0
描述 (S71GLxxxNB0) Stacked Multi-chip Product (MCP)
制造商 SPANSION
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S71GL512NB0 数据手册, 描述, 功能
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S71GL512NB0/S71GL256NB0/
S71GL128NB0
Stacked Multi-chip Product (MCP)
512/256/128 Megabit (32/16/8 M x 16-bit) CMOS 3.0 Volt-only
MirrorBitTM Page-mode Flash Memory with
32 Megabit (2M x 16-bit) pSRAM
Distinctive Characteristics
ADVANCE
INFORMATION
MCP Features
„ Power supply voltage of 2.7 to 3.1V
High Performance
„ 90 ns access time (S71GL128N, S71GL256N)
„ 100 ns access time (S71GL512N)
„ 25 ns page read times
„ Packages:
— 9.0 x 12.0 mm x 1.2 mm FBGA (TLD084) (S71GL512N)
— 8.0 x 11.6 mm x 1.2 mm FBGA (TLA084) (S71GL128N, S71GL256N)
„ Operating Temperature
— -25°C to +85°C (Wireless)
— -40°C to +85°C (Industrial)
General Description
The S71GL Series is a product line of stacked Multi-chip Product (MCP) packages
and consists of
„ One Flash memory die
„ one pSRAM
The products covered by this document are listed in the table below. For details
about their specifications, please refer to the individual constituent datasheets
for further details.
pSRAM Density
128 Mb
64 Mb
32 Mb
16 Mb
512 Mb
Flash Memory Density
256 Mb
128 Mb
S71GL512NB0 S71GL256NB0 S71GL128NB0
Publication Number S71GL512_256_128NB0_00 Revision A Amendment 1 Issue Date December 7, 2004
This document contains information on a product under development at Spansion LLC. The information is intended to help you evaluate this product. Spansion LLC
reserves the right to change or discontinue work on this proposed product without notice.







S71GL512NB0 pdf, 数据表
Advance Information
256 Mb Flash + 32 Mb pSRAM Pinout
84-ball Fine-Pitch Ball Grid Array
256 Mb Flash + 32 Mb pSRAM
Pinout
(Top View, Balls Facing Down)
A1
NC B2 B3 B4 B5 B6
RFU
RFU
RFU
RFU
RFU
C2 C3 C4 C5 C6
RFU A7 LB# WP/ACC WE#
D2 D3 D4 D5 D6
A3 A6 UB# RST#f CE2s
E2 E3 E4 E5 E6
A2 A5 A18 RY/BY# A20
F2
A1
G2
A0
H2
CE#f1
F3
A4
G3
VSS
H3
OE#
F4
A17
G4
DQ1
H4
DQ9
F5
RFU
G5
RFU
H5
DQ3
F6
A23
G6
RFU
H6
DQ4
J2
CE1#s
K2
J3
DQ0
K3
J4
DQ10
K4
J5
VCCf
K5
J6
VCCs
K6
RFU
DQ8
DQ2 DQ11 RFU
L2 L3 L4 L5 L6
RFU
RFU
RFU
VCCf
RFU
M1
NC
B7
RFU
C7
A8
D7
A19
E7
A9
F7
A10
G7
DQ6
H7
DQ13
J7
DQ12
K7
DQ5
L7
RFU
B8
RFU
C8
A11
D8
A12
E8
A13
F8
A14
G8
RFU
H8
DQ15
J8
DQ7
K8
DQ14
L8
RFU
A10
B9
RFU
C9
RFU
NC
D9
A15
E9
A21
F9
A22
G9
A16
H9
RFU
J9
VSS
K9
RFU
L9
RFU
M10
NC
Legend
Shared
Flash only
RAM only
Reserved for
Future Use
8 S71GL512_256_128NB0_00_A1 December 7, 2004







S71GL512NB0 equivalent, schematic
Advance Information
Physical Dimensions
TLD084—84-ball Fine-Pitch Ball Grid Array (FBGA) 9.0 x 12.0 x1.2 mm MCP
Compatible Package
0.15 C
(2X)
D
PIN A1
CORNER
INDEX MARK
10
TOP VIEW
A A2
A D1
eD
10
9
8
7
E
6
5
4
eE 3
2
1
B
0.15 C
(2X)
0.20 C
ML K J HG F E D C B A
7
SD
BOTTOM VIEW
SE 7
E1
PIN A1
CORNER
A1
6
84X b
0.15 M
0.08 M
SIDE VIEW
CAB
C
C 0.08 C
PACKAGE
JEDEC
TLD 084
N/A
DxE
SYMBOL
A
A1
A2
D
E
D1
E1
MD
ME
n
b
eE
eD
SD / SE
12.00 mm x 9.00 mm
PACKAGE
MIN
NOM
MAX
--- --- 1.20
0.17
---
---
0.81 --- 0.97
12.00 BSC.
9.00 BSC.
8.80 BSC.
7.20 BSC.
12
10
84
0.35 0.40 0.45
0.80 BSC.
0.80 BSC
0.40 BSC.
A2,A3,A4,A5,A6,A7,A8,A9
B1,B10,C1,C10,D1,D10
E1,E10,F1,F10,G1,G10
H1,H10,J1,J10,K1,K10
L1,L10,M2,M3,M4,M5,M6,
M7,M8,M9
NOTE
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
Note: BSC is an ANSI standard for Basic Space Centering
NOTES:
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4. e REPRESENTS THE SOLDER BALL GRID PITCH.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6 DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7 SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9. N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
3367\ 16-038.22a
16 S71GL512_256_128NB0_00_A1 December 7, 2004










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