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PDF ( 数据手册 , 数据表 ) ADP1611

零件编号 ADP1611
描述 1.2 MHz Step-Up DC-to-DC Switching Converter
制造商 Analog Devices
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ADP1611 数据手册, 描述, 功能
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FEATURES
Fully integrated 1.2 A , 0.23 Ω power switch
Pin-selectable 700 kHz or 1.2 MHz PWM frequency
90% efficiency
Adjustable output voltage up to 20 V
3% output regulation accuracy
Adjustable soft start
Input undervoltage lockout
MSOP 8-lead package
APPLICATIONS
TFT LC bias supplies
Portable applications
Industrial/instrumentation equipment
20 V,1.2 MHz Step-Up
DC-to-DC Switching Converter
ADP1611
GENERAL DESCRIPTION
The ADP1611 is a step-up dc-to-dc switching converter with an
integrated 1.2 A, 0.23 Ω power switch capable of providing an
output voltage as high as 20 V. With a package height of less
than 1.1 mm, the ADP1611 is optimal for space-constrained
applications such as portable devices or thin film transistor
(TFT) liquid crystal displays (LCDs).
The ADP1611 operates in pulse-width modulation (PWM)
current mode with up to 90% efficiency. Adjustable soft start
prevents inrush currents at startup. The pin-selectable switching
frequency and PWM current-mode architecture allow excellent
transient response, easy noise filtering, and the use of small,
cost-saving external inductors and capacitors.
The ADP1611 is offered in the Pb-free 8-lead MSOP and
operates over the temperature range of −40°C to +85°C.
FB 2
RT 7
FUNCTIONAL BLOCK DIAGRAM
REF
COMP
1
ERROR
AMP
gm
IN
6
BIAS
ADP1611
RAMP
GEN
OSC
F/F
RQ
S
COMPARATOR
DRIVER
5 SW
SS 8
SD 3
SOFT START
CURRENT-
SENSE
AMPLIFIER
4
GND
Figure 1.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.326.8703 © 2005 Analog Devices, Inc. All rights reserved.







ADP1611 pdf, 数据表
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ADP1611
2.0
FSW = 1.23kHz
VFB = 1V
1.8
1.6
VIN = 5.5V
1.4
1.2
1.0
0.8
0.6
–40
VIN = 3.3V
VIN = 2.5V
–15 10 35 60
AMBIENT TEMPERATURE (°C)
85
Figure 16. Supply Current vs. Ambient Temperature
1.0
VIN = 3.3V
0.9 SD = 0.4V
VSW = 20V
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
–40 15
70
AMBIENT TEMPERATURE (°C)
125
Figure 17. Switch Leakage Current vs. Ambient Temperature
1.2
VIN = 3.5V
1.0
0.8
0.6
VIH
VIL
0.4
0.2
0
–40 15
70 125
AMBIENT TEMPERATURE (°C)
Figure 18. Shutdown Threshold vs. Ambient Temperature
300
250
200
150
100
50
0
–40 –15
10
35
60
AMBIENT TEMPERATURE (°C)
85
Figure 19. UVLO Hysteresis vs. Ambient Temperature
3
CH1 = IL 500mA/DIV
VIN = 5V, VOUT = 20V,
CH2 = OUTPUT RIPPLE 100mV/DIV ILOAD = 200mA, FSW = 700kHz,
1 CH3 = SW 10V/DIV
L = 10µH, COUT = 10µF
2
CH1 10.0mVCH2 100mV M2.00µs
A CH3
CH3 10.0V
T 0.00000s
12.4V
Figure 20. Switching Waveform in Continuous Conduction
3
CH1 = IL 500mA/DIV
CH2 = OUTPUT RIPPLE 100mV/DIV
CH3 = SW 10V/DIV
VIN = 5V, VOUT = 20V,
ILOAD = 20mA, FSW = 700kHz,
L = 10µH, COUT = 10µF
1
2
CH1 10.0mVCH2 100mV M2.00µs
CH3 10.0V
A CH3 12.2V
Figure 21. Switching Waveform in Discontinuous Conduction
Rev. 0 | Page 8 of 20







ADP1611 equivalent, schematic
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ADP1611
LAYOUT PROCEDURE
To achieve high efficiency, good regulation, and stability, a well-
designed printed circuit board layout is required. Where
possible, use the sample application board layout as a model.
Follow these guidelines when designing printed circuit boards
(see Figure 1):
Keep the low ESR input capacitor, CIN, close to IN and
GND.
Keep the high current path from CIN through the inductor,
L1, to SW and PGND as short as possible.
Keep the high current path from CIN through L1, the
rectifier, D1, and the output capacitor, COUT, as short as
possible.
Keep high current traces as short and as wide as possible.
Place the feedback resistors as close to FB as possible to
prevent noise pickup.
Place the compensation components as close as possible to
COMP.
Avoid routing high impedance traces near any node
connected to SW or near the inductor to prevent radiated
noise injection.
Figure 31. Sample Application Board (Bottom Layer)
Rev. 0 | Page 16 of 20










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