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PDF ( 数据手册 , 数据表 ) LD12xxxxxx

零件编号 LD12xxxxxx
描述 (LD Series) MLCC Tin / Lead Termination B
制造商 AVX Corporation
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LD12xxxxxx 数据手册, 描述, 功能
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MLCC Tin/Lead Termination “B”
General Specifications
AVX Corporation will support those customers for
commercial and military Multilayer Ceramic Capacitors with
a termination consisting of 5% minimum lead. This
termination is indicated by the use of a “B” in the 12th
position of the AVX Catalog Part Number. This fulfills AVX’s
commitment to providing a full range of products to our
customers. AVX has provided in the following pages a full
range of values that we are currently offering in this special
“B” termination. Please contact the factory if you require
additional information on our MLCC Tin/Lead Termination
“B” products.
PART NUMBER (see page 2 for complete part number explanation)
LD05 5
A
101
J
AB
2
A
Size Voltage
LD02 - 0402
6.3V = 6
LD03 - 0603
10V = Z
LD04 - 0504
16V = Y
LD05 - 0805
25V = 3
LD06 - 1206
50V = 5
LD08 - 1808*
100V = 1
LD10 - 1210
200V = 2
LD12 - 1812
500V = 7
LD13 - 1825
LD14 - 2225
LD15 - 0204 LICC*
LD20 - 2220
LD16 - 0306 LICC
LD17 - 0508 LICC
LD18 - 0612 LICC
Dielectric
C0G (NP0) = A
X7R = C
X5R = D
Capacitance
Capacitance
Code (In pF)
Tolerance
2 Sig. Digits +
Number of
DBat=aS±h.1e0ept4FU(<.c1o0mpF)
C = ±.25 pF (<10pF)
Zeros
D = ±.50 pF (<10pF)
F = ±1% (10 pF)
G = ±2% (10 pF)
J = ±5%
K = ±10%
Failure
Rate
A = Not
Applicable
Terminations
B = 5% min
lead
Packaging
2 = 7" Reel
4 = 13" Reel
7 = Bulk Cass.
9 = Bulk
Contact
Factory
For
Multiples
Special DataShee
Code
A = Std.
Product
*Contact factory
ELECTRICAL GRAPHS
NPO
X7R
X7S
X5R
Y5V
Refer to page 4 for Electrical Graphs
Refer to page 12 for Electrical Graphs
Refer to page 16 for Electrical Graphs
Refer to page 19 for Electrical Graphs
Refer to page 23 for Electrical Graphs
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LD12xxxxxx pdf, 数据表
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Embossed Carrier Configuration
8 & 12mm Tape Only
T2
T DEFORMATION
BETWEEN
EMBOSSMENTS
D0
P0
P2
10 PITCHES CUMULATIVE
TOLERANCE ON TAPE
±0.2mm (±0.008)
EMBOSSMENT
E1
TOP COVER
B1 K0 TAPE
A0
B0
FW
E2
Chip Orientation
S1 T1
CENTER LINES
OF CAVITY
P1
MAX. CAVITY
SIZE - SEE NOTE 1
D1 FOR COMPONENTS
2.00 mm x 1.20 mm AND
LARGER (0.079 x 0.047)
B1 IS FOR TAPE READER REFERENCE ONLY
INCLUDING DRAFT CONCENTRIC AROUND B0
User Direction of Feed
8 & 12mm Embossed Tape
Metric Dimensions Will Govern
CONSTANT DIMENSIONS
Tape Size
8mm
and
12mm
D0
1.50
+0.10
-0.0
(0.059
+0.004
-0.0
)
E P0 P2
1.75 ± 0.10 4.0 ± 0.10
2.0 ± 0.05
(0.069 ± 0.004) (0.157 ± 0.004) (0.079 ± 0.002)
S1 Min.
0.60
(0.024)
T Max.
0.60
(0.024)
et4U.com VARIABLE DIMENSIONS
Tape Size B1
Max.
D1
Min.
E2
Min.
F DataSheet4UP.1com
R
Min.
See Note 5 See Note 2
T2
W
Max.
T1
0.10
(0.004)
Max.
DataShee
A0 B0 K0
8mm
4.35 1.00 6.25 3.50 ± 0.05 4.00 ± 0.10
25.0
(0.171) (0.039) (0.246) (0.138 ± 0.002) (0.157 ± 0.004) (0.984)
2.50 Max.
(0.098)
8.30
(0.327) See Note 1
12mm
8.20 1.50 10.25 5.50 ± 0.05 4.00 ± 0.10
30.0
(0.323) (0.059) (0.404) (0.217 ± 0.002) (0.157 ± 0.004) (1.181)
6.50 Max.
(0.256)
12.3
(0.484) See Note 1
8mm
4.35 1.00 6.25 3.50 ± 0.05 2.00 ± 0.10
25.0
1/2 Pitch (0.171) (0.039) (0.246) (0.138 ± 0.002) (0.079 ± 0.004) (0.984)
2.50 Max.
(0.098)
8.30
(0.327) See Note 1
12mm
Double
Pitch
8.20 1.50 10.25 5.50 ± 0.05 8.00 ± 0.10
30.0
(0.323) (0.059) (0.404) (0.217 ± 0.002) (0.315 ± 0.004) (1.181)
6.50 Max.
(0.256)
12.3 See Note 1
(0.484)
NOTES:
1. The cavity defined by A0, B0, and K0 shall be configured to provide the following:
Surround the component with sufficient clearance such that:
a) the component does not protrude beyond the sealing plane of the cover tape.
b) the component can be removed from the cavity in a vertical direction without mechanical
restriction, after the cover tape has been removed.
c) rotation of the component is limited to 20º maximum (see Sketches D & E).
d) lateral movement of the component is restricted to 0.5mm maximum (see Sketch F).
2. Tape with or without components shall pass around radius “R” without damage.
3. Bar code labeling (if required) shall be on the side of the reel opposite the round sprocket holes.
Refer to EIA-556.
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. If P1 = 2.0mm, the tape may not properly index in all tape feeders.
Top View, Sketch "F"
Component Lateral Movements
0.50mm (0.020)
Maximum
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0.50mm (0.020)
Maximum
61







LD12xxxxxx equivalent, schematic
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General Description
I (Ideal)
I (Actual)
di
The dt seen in current microprocessors can be as high as
0.3 A/ns, and up to 10A/ns. At 0.3 A/ns, 100pH of parasitic
inductance can cause a voltage spike of 30mV. While this
Loss
Angle
Phase
Angle
does not sound very drastic, with the Vcc for microproces-
sors decreasing at the current rate, this can be a fairly large
percentage.
Another important, often overlooked, reason for knowing
f the parasitic inductance is the calculation of the resonant
frequency. This can be important for high frequency, by-
pass capacitors, as the resonant point will give the most
V signal attenuation. The resonant frequency is calculated
IRs from the simple equation:
In practice the current leads the voltage by some other
phase angle due to the series resistance RS. The comple-
ment of this angle is called the loss angle and:
fres =
1
2ͱ LC
Insulation Resistance – Insulation Resistance is the
Power Factor (P.F.) = Cos
Dissipation Factor (D.F.) =
tfanorSine
resistance measured across the terminals of a capacitor
and consists principally of the parallel resistance R P shown
in the equivalent circuit. As capacitance values and hence
the area of dielectric increases, the I.R. decreases and
for small values of the tan and sine are essentially equal
hence the product (C x IR or RC) is often specified in ohm
which has led to the common interchangeability of the two
faradsor more commonly megohm-microfarads. Leakage
terms in the industry.
current is determined by dividing the rated voltage by IR
(Ohm’s Law).
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E.S.R.
C
Dissipation Factor – The DF/PF of a capacitor tells what
percent of the apparent power input will turn to heat in the
capacitor.
Dissipation Factor = E.S.R. = (2 π fC) (E.S.R.)
X
C
The watts loss are:
Watts loss = (2 π fCV2) (D.F.)
Dielectric Absorption – A capacitor does not discharge
instantaneously upon application of a short circuit, but
drains gradually after the capacitance proper has been dis-
charged. It is common practice to measure the dielectric
absorption by determining the “reappearing voltage” which
appears across a capacitor at some point in time after it has
been fully discharged under short circuit conditions.
Corona – Corona is the ionization of air or other vapors
which causes them to conduct current. It is especially
prevalent in high voltage units but can occur with low voltages
as well where high voltage gradients occur. The energy
discharged degrades the performance of the capacitor and
can in time cause catastrophic failures.
Very low values of dissipation factor are expressed as their
reciprocal for convenience. These are called the “Q” or
Quality factor of capacitors.
Parasitic Inductance – The parasitic inductance of capac-
itors is becoming more and more important in the decou-
pling of today’s high speed digital systems. The relationship
between the inductance and the ripple voltage induced on
the DC voltage line can be seen from the simple inductance
equation:
V = L di
dt
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