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零件编号 | NHPXA270Cxxx | ||
描述 | Microprocessor | ||
制造商 | Intel | ||
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1 Page
Intel® PXA270 Processor
Electrical, Mechanical, and Thermal Specification
Data Sheet
■ High-performance processor:
— Intel XScale® microarchitecture with
Intel® Wireless MMX™ Technology
— 7 Stage pipeline
— 32 KB instruction cache
— 32 KB data cache
— 2 KB “mini” data cache
— Extensive data buffering
■ 256 Kbytes of internal SRAM for high
speed code or data storage preserved
during low-power states
■ High-speed baseband processor interface
(Mobile Scalable Link)
■ Rich serial peripheral set:
— AC’97 audio port
— I2S audio port
— USB Client controller
— USB Host controller
— USB On-The-Go controller
— Three high-speed UARTs (two with
hardware flow control)
— FIR and SIR infrared communications
port
■ Hardware debug features — IEEE JTAG
interface with boundary scan
■ Hardware performance-monitoring
features with on-chip trace buffer
■ Real-time clock
w ■ Operating-system timers
w ■ LCD Controller
w ■ Universal Subscriber Identity Module
.DataSheet4U.cominterface
■ Low power:
— Wireless Intel Speedstep® Technology
— Less than 500 mW typical internal
dissipation
— Supply voltage may be reduced to
0.85 V
— Four low-power modes
— Dynamic voltage and frequency
management
■ High-performance memory controller:
— Four banks of SDRAM: up to 104 MHz
@ 2.5V, 3.0V, and 3.3V I/O interface
— Six static chip selects
— Support for PCMCIA and Compact
Flash
— Companion chip interface
■ Flexible clocking:
— CPU clock from 104 to 624 MHz
— Flexible memory clock ratios
— Frequency changes
— Functional clock gating
■ Additional peripherals for system
connectivity:
— SD Card / MMC Controller (with SPI
mode support)
— Memory Stick card controller
— Three SSP controllers
— Two I2C controllers
— Four pulse-width modulators (PWMs)
— Keypad interface with both direct and
matrix keys support
— Most peripheral pins double as GPIOs
Order Number 280002-005
Intel® PXA270 Processor
Contents
viii Electrical, Mechanical, and Thermal Specification
Intel® PXA270 Processor
Package Information
Note: Figure 3-2 and Figure 3-3 show all dimensions in millimeters (mm).
Figure 3-2. 13x13mm VF-BGA Intel® PXA270 Processor Package, bottom view
0.15 M C
0.15 M C A B
ø0.30±0.05 (356)
A
B
11.50
13±0.10
0.50
3-2 Electrical, Mechanical, and Thermal Specification
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页数 | 70 页 | ||
下载 | [ NHPXA270Cxxx.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
NHPXA270Cxxx | Microprocessor | Intel |
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