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零件编号 | BC-148 | ||
描述 | BC148 | ||
制造商 | ETC | ||
LOGO | |||
1 Page
a
*1.40 MAX
148-Lead Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-148)
Dimensions shown in millimeters
9.10
9.00 SQ
8.90
BALL A1
PAD CORNER
TOP VIEW
DETAIL A
7.50
BSC SQ
A1 CORNER
INDEX AREA
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A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
0.50 BSC
DETAIL A
*1.11 MAX
0.15 MIN
0.35
0.30
0.25
BALL DIAMETER
SEATING
PLANE
*COMPLIANT TO JEDEC STANDARDS MO-195 WITH EXCEPTION
TO DIMENSIONS INDICATED BY AN ASTERISK.
COPLANARITY
0.08
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页数 | 1 页 | ||
下载 | [ BC-148.PDF 数据手册 ] |
零件编号 | 描述 | 制造商 |
BC-148 | BC148 | ETC |
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