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PDF ( 数据手册 , 数据表 ) D16311GC

零件编号 D16311GC
描述 1/8- to 1/16-DUTY FIPTM VFD CONTROLLER/DRIVER
制造商 NEC
LOGO NEC LOGO 


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D16311GC 数据手册, 描述, 功能
DDAATTAA SSHHEEEETT
MOS INTEGRATED CIRCUIT
PD16311
1/8- to 1/16-DUTY FIPTM (VFD) CONTROLLER/DRIVER
The PD16311 is a FIP (Fluorescent Indicator Panel or Vacuum Fluorescent Display) controller/driver that is
driven on a 1/8- to 1/16 duty factor. It consists of 12 segment output lines, 8 grid output lines, 8 segment/grid output
drive lines, a display memory, a control circuit, and a key scan circuit. Serial data is input to the PD16311 through a
three-line serial interface. This FIP controller/driver is ideal as a peripheral device of a single-chip microcomputer.
FEATURES
• Many display modes (12-segment & 16-digit to 20-segment & 8-digit)
• Key scanning (12  4 matrices)
• Dimming circuit (eight steps)
• High-voltage output (VDD  35 V max).
• LED ports (5 chs., 20 mA max).
• General-purpose input port (4 bits)
• No external resistor necessary for driver outputs (P-ch open-drain + pull-down resistor output)
• Serial interface (CLK, STB, DIN, DOUT)
ORDERING INFORMATION
Part Number
PD16311GC-AB6
Package
52-pin plastic QFP ( 14)
Document No. IC-3306 (1st edition)
Date Published March 1997 P
Printed in Japan
© 1993







D16311GC pdf, 数据表
PD16311
(2) Data setting command
This command sets data write and data read modes.
MSB
LSB
0 1 − − b3 b2 b1 b0
Don't care
Sets data write and read modes.
00 : Writes data to display memory.
01 : Writes data to LED port.
10 : Reads key data.
11 : Reads SW data.
Sets address increment mode (display memory).
0: Increments address after data has been written.
1: Fixes address.
Sets test mode
0: Normal operation
1: Test mode
On power application, the normal operation mode and address increment mode are set.
(3) Address setting command
This command sets an address of the display memory.
MSB
LSB
1 1 b5 b4 b3 b2 b1 b0
Address (00H - 2FH)
If address 30H or higher is set, the data is ignored, until a correct address is set.
On power application, the address is set to 00H.
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D16311GC equivalent, schematic
PD16311
RECOMMENDED SOLDERING CONDITIONS
The following conditions (see table below) must be met when soldering this product. Please consult with our sales
officers in case other soldering process is used or in case soldering is done under different conditions.
PD16311GC-AB6
Soldering process
Infrared ray reflow
VPS
Wave soldering
Partial heating method
Soldering conditions
Peak package’s surface temperature: 235 C or below,
Reflow time: 30 seconds or below (210 C or higher),
Number of reflow process: 2, Exposure limit*: None
Peak package’s surface temperature: 215 C or below,
Reflow time: 40 seconds or below (200 C or higher),
Number of reflow process: 2, Exposure limit*: None
Solder temperature: 260 C or below,
Flow time: 10 seconds or below,
Number of flow process: 1, Exposure limit*: None
Terminal temperature: 300 C or below,
Flow time: 10 seconds or below,
Exposure limit*: None
Symbol
IR35-00-2
VP15-00-2
WS60-00-1
* Exposure limit before soldering after dry-pack package is opened.
Storage conditions: 25 C and relative humidity at 65 % or less.
Note Do not apply more than a single process at once, except for “Partial heating method”.
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