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PDF ( 数据手册 , 数据表 ) TF024

零件编号 TF024
描述 (TFx24 Series) Thin Film Chip Resistors
制造商 Phycomp
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TF024 数据手册, 描述, 功能
DISCRETE CERAMICS
DATA SHEET
TFx24 series, 0.05% TC50
10 to 1 M
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402
Product specification
2001 Sep 10 Rev.0







TF024 pdf, 数据表
Phycomp
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402
Product specification
TFx24 series, 0.05% TC50
10 to 1 M
IEC
60 115-8
CLAUSE
IEC
60 068-2
TEST
METHOD
MIL-STD
TEST
PROCEDURE
4.33
bending
resistors mounted on a 90 mm
glass epoxy resin PCB (FR4);
bending: 2 mm for 1210
2 mm for 1206
3 mm for 0805
3 mm for 0603
2 mm for 0402
MIL-R
55342D
para. 4.7.4
low
temperature
operation
65 +0/5 °C for 1 hour;
loaded with Vrated for
45 +5/0 minutes ON, and
15 +5/0 minutes OFF;
specimen stabilized at room
temperature for 24 hours after
test
4.19
4.25.1
14 (Na)
202F
method
107
202F
method
108A
thermal
shock
2 minutes at LCT and
2 minutes at UCT; 5 cycles
endurance
1000 +48/0 hours; 70 ±2 °C;
loaded with Pn or Vmax;
1.5 hours on and 0.5 hours off;
specimen stabilized at room
temperature for 1 hour min. after
test
4.8.4.2
202F
method
304
temperature at 25/LCT/25 °C and
coefficient 25/UCT/25 °C
4.6.1.1
202F
method
302
insulation
resistance
after 1 minute, metal block
method
1210: 400 V (DC)
1206: 400 V (DC)
0805: 300 V (DC)
0603: 150 V (DC)
0402: 100 V (DC)
EIA 575
3.13
leaching
unmounted chips;
60 ±1 s; 260 ±5 °C
EIA/IS
703 4.6
202F
method
106
moisture
resistance
65 ±2 °C; 95 +3/5% RH;
loaded with 0.01 Pn or Vmax for
42 damp heat cycles. (1 cycle
consists of 7 steps. see Fig.3)
REQUIREMENTS
no visual damage
R/R max.: ±(0.25% +0.05 )
no visible damage
R/R max.: ±(0.5% +0.05 )
no visible damage
R/R max.: ±(0.5% +0.05 )
R/R max.: ±(0.5% +0.05 )
≤ ±50 × 106/K
Rins min.: 104 M
good tinning; no leaching
R/R max.: ±(0.5% +0.05 )
2001 Sep 10 Rev.0
8 www.phycomp-components.com







TF024 equivalent, schematic
Phycomp
Thin-film chip resistors
sizes 1210, 1206, 0805, 0603 and 0402
Product specification
TFx24 series, 0.05% TC50
10 to 1 M
REVISION HISTORY
Revision
Rev.0
Date
Change
Notification
2001 Sep 10 EBR-3240-
01177
Description
- First issue of this specification
- Expansion of the thin-film low-TC product range
2001 Sep 10 Rev.0
16 www.phycomp-components.com










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