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PDF ( 数据手册 , 数据表 ) 74HCT123

零件编号 74HCT123
描述 Dual retriggerable monostable multivibrator with reset
制造商 Philips
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74HCT123 数据手册, 描述, 功能
INTEGRATED CIRCUITS
DATA SHEET
For a complete data sheet, please also download:
The IC06 74HC/HCT/HCU/HCMOS Logic Family Specifications
The IC06 74HC/HCT/HCU/HCMOS Logic Package Information
The IC06 74HC/HCT/HCU/HCMOS Logic Package Outlines
74HC/HCT123
Dual retriggerable monostable
multivibrator with reset
Product specification
Supersedes data of September 1993
File under Integrated Circuits, IC06
1998 Jul 08







74HCT123 pdf, 数据表
Philips Semiconductors
Dual retriggerable monostable
multivibrator with reset
Product specification
74HC/HCT123
AC CHARACTERISTICS FOR 74HCT
GND = 0 V; tr = tf = 6 ns; CL = 50 pF
Tamb (°C)
TEST CONDITIONS
SYMBOL
PARAMETER
min.
+25
typ. max.
74HCT
40 to +85
min. max.
40 to +125
min. max.
UNIT
VCC
(V)
WAVEFORMS/
NOTES
tPHL
propagation delay
nRD, nA, nB to nQ
30 51
64
77
ns
4.5
CEXT = 0 pF;
REXT = 5 k
tPLH
propagation delay
nRD, nA, nB to nQ
28 51
64
77
ns
4.5
CEXT = 0 pF;
REXT = 5 k
tPHL
propagation delay
nRD to nQ (reset)
27 46
58
69
ns
4.5
CEXT = 0 pF;
REXT = 5 k
tPLH
propagation delay
nRD to nQ (reset)
23 46
58
69
ns
4.5
CEXT = 0 pF;
REXT = 5 k
tTHL / tTLH output transition time
7 15
19
22 ns 4.5
tW
trigger pulse width
nA = LOW
20 3
25 30
ns 4.5 Fig.7
tW
trigger pulse width
nB = HIGH
20 5
25 30
ns 4.5 Fig.7
tW
reset pulse width
nRD = LOW
20 7
25
output pulse width
tW nQ = HIGH
nQ = LOW
450
30
ns 4.5 Fig.8
CEXT = 100 nF;
µs 5.0 REXT = 10 k;
Figs 7 and 8
output pulse width
tW nQ = HIGH
nQ = LOW
75
CEXT = 0 pF;
ns 5.0 REXT = 5 k;
note 1; Figs 7 and 8
trt
retrigger time
nA, nB
110
CEXT = 0 pF;
ns 5.0 REXT = 5 k;
note 2; Fig.7
REXT
external timing
resistor
2
1000
k5.0 Fig.9
CEXT
external timing
capacitor
no limits
pF 5.0 Fig.9; note 3
1998 Jul 08
8







74HCT123 equivalent, schematic
Philips Semiconductors
Dual retriggerable monostable
multivibrator with reset
Product specification
74HC/HCT123
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
DIP
SOLDERING BY DIPPING OR BY WAVE
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
REPAIRING SOLDERED JOINTS
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
SO, SSOP and TSSOP
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO, SSOP
and TSSOP packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method.
Typical reflow temperatures range from 215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
Wave soldering can be used for all SO packages. Wave
soldering is not recommended for SSOP and TSSOP
packages, because of the likelihood of solder bridging due
to closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering is used - and cannot be avoided for
SSOP and TSSOP packages - the following conditions
must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
The longitudinal axis of the package footprint must be
parallel to the solder flow and must incorporate solder
thieves at the downstream end.
Even with these conditions:
Only consider wave soldering SSOP packages that
have a body width of 4.4 mm, that is
SSOP16 (SOT369-1) or SSOP20 (SOT266-1).
Do not consider wave soldering TSSOP packages
with 48 leads or more, that is TSSOP48 (SOT362-1)
and TSSOP56 (SOT364-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
1998 Jul 08
16










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