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PDF ( 数据手册 , 数据表 ) 74VHC08SJ

零件编号 74VHC08SJ
描述 Quad 2-Input AND Gate
制造商 Fairchild Semiconductor
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74VHC08SJ 数据手册, 描述, 功能
December 2007
74VHC08
Quad 2-Input AND Gate
Features
High Speed: tPD = 4.3ns (Typ.) at TA = 25°C
High noise immunity: VNIH = VNIL = 28% VCC (Min.)
Power down protection is provided on all inputs
Low power dissipation: ICC = 2µA (Max.) @ TA = 25°C
Low noise: VOLP = 0.8V (Max.)
Pin and function compatible with 74HC08
General Description
The VHC08 is an advanced high speed CMOS 2 Input
AND Gate fabricated with silicon gate CMOS technol-
ogy. It achieves the high-speed operation similar to
equivalent Bipolar Schottky TTL while maintaining the
CMOS low power dissipation.
The internal circuit is composed of 4 stages including
buffer output, which provide high noise immunity and
stable output. An input protection circuit insures that 0V
to 7V can be applied to the input pins without regard to
the supply voltage. This device can be used to interface
5V to 3V systems and two supply systems such as bat-
tery backup. This circuit prevents device destruction due
to mismatched supply and input voltages.
Ordering Information
Order Number
74VHC08M
74VHC08SJ
74VHC08MTC
Package
Number
M14A
M14D
MTC14
Package Description
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150"
Narrow
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153,
4.4mm Wide
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
©1992 Fairchild Semiconductor Corporation
74VHC08 Rev. 1.4.0
www.fairchildsemi.com







74VHC08SJ pdf, 数据表
Physical Dimensions (Continued)
0.43 TYP
0.65
1.65
0.45
6.10
R0.09 min
12.00°TOP & BOTTOM
A. CONFORMS TO JEDEC REGISTRATION MO-153,
VARIATION AB, REF NOTE 6
B. DIMENSIONS ARE IN MILLIMETERS
1.00
C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH,
AND TIE BAR EXTRUSIONS
D. DIMENSIONING AND TOLERANCES PER ANSI
Y14.5M, 1982
E. LANDPATTERN STANDARD: SOP65P640X110-14M
F. DRAWING FILE NAME: MTC14REV6
R0.09min
Figure 3. 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
©1992 Fairchild Semiconductor Corporation
74VHC08 Rev. 1.4.0
8
www.fairchildsemi.com














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