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PDF ( 数据手册 , 数据表 ) MC-45D16CB641

零件编号 MC-45D16CB641
描述 16 M-WORD BY 64-BIT DDR SYNCHRONOUS DYNAMIC RAM MODULE UNBUFFERED TYPE
制造商 NEC
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MC-45D16CB641 数据手册, 描述, 功能
PRELIMINARY DATA SHEET
MOS INTEGRATED CIRCUIT
MC-45D16CB641
16 M-WORD BY 64-BIT DDR SYNCHRONOUS DYNAMIC RAM MODULE
UNBUFFERED TYPE
Description
The MC-45D16CB641 is a 16,777,216 words by 64 bits DDR synchronous dynamic RAM module on which 8 pieces
of 128M DDR SDRAM: µPD45D128842 are assembled.
These modules provide high density and large quantities of memory in a small space without utilizing the surface-
mounting technology on the printed circuit board.
Decoupling capacitors are mounted on power supply line for noise reduction.
Features
16,777,216 words by 64 bits organization
Clock frequency
Part number
/CAS latency
Clock frequency
(MAX.)
Module type
MC-45D16CB641KF-C75
CL = 2.5
133 MHz
DDR SDRAM
CL = 2
100 MHz
Unbuffered DIMM
MC-45D16CB641KF-C80
CL = 2.5
125 MHz
Design specification
CL = 2
100 MHz
Rev.0.9 compliant
Fully Synchronous Dynamic RAM with all signals except DM, DQS and DQ referenced to a positive clock edge
Double Data Rate interface
Differential CLK (/CLK) input
Data inputs and DM are synchronized with both edges of DQS
Data outputs and DQS are synchronized with a cross point of CLK and /CLK
Quad internal banks operation
Possible to assert random column address in every clock cycle
Programmable Mode register set
/CAS latency (2, 2.5)
Burst length (2, 4, 8)
Wrap sequence (Sequential / Interleave)
Automatic precharge and controlled precharge
CBR (Auto) refresh and self refresh
2.5 V ± 0.2 V Power supply for VDD
2.5 V ± 0.2 V Power supply for VDDQ
SSTL_2 compatible with all signals
4,096 refresh cycles / 64 ms
Burst termination by Precharge command and Burst stop command
184-pin dual in-line memory module (Pin pitch = 1.27 mm)
Unbuffered type
Serial PD
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M14897EJ2V0DS00 (2nd edition)
Date Published June 2000 NS CP(K)
Printed in Japan
The mark 5 shows major revised points.
©
2000







MC-45D16CB641 pdf, 数据表
MC-45D16CB641
Synchronous Characteristics
Parameter
Clock cycle time
CL = 2.5
CL = 2
CLK high-level width
CLK low-level width
DQ output access time from CLK, /CLK
DQS output access time from CLK, /CLK
DQS-DQ skew (for DQS and associated DQ
signals)
DQS-DQ skew (for DQS and all DQ signals)
Data out low-impedance time from CLK, /CLK
Data out high-impedance time from CLK, /CLK
Half clock period
DQS read preamble
DQS read postamble
DQ-DQS hold, DQS to first DQ to go non-valid,
per access
DQ and DM input setup time
DQ and DM input hold time
DQ and DM input pulse width (for each input)
DQS write preamble setup time
DQS write preamble
Write postamble
Write command to first DQS latching transition
DQS input high pulse width
DQS input low pulse width
DQS falling edge to CLK setup time
DQS falling edge hold time from CLK
Address and control input setup time
Address and control input hold time
Address and control input pulse width
Internal write to read command delay
Symbol
tCK
tCH
tCL
tAC
tDQSCK
tDQSQ
tDQSQA
tLZ
tHZ
tHP
tRPRE
tRPST
tQH
tDS
tDH
tDIPW
tWPRES
tWPRE
tWPST
tDQSS
tDQSH
tDQSL
tDSS
tDSH
tIS
tIH
tIPW
tWTR
-C75 (PC266B)
MIN.
MAX.
7.5 15
10 15
0.45 0.55
0.45 0.55
–0.75
0.75
–0.75
0.75
–0.5 0.5
–0.5
–0.75
–0.75
tCH, tCL
0.9
0.4
tHP – 0.75
0.5
0.75
0.75
1.1
0.6
0.5
0.5
1.75
0
0.25
0.4 0.6
0.75 1.25
0.35
0.35
0.2
0.2
0.9
0.9
2.2
1
-C80 (PC200)
MIN.
MAX.
8 15
10 15
0.45 0.55
0.45 0.55
–0.8 0.8
–0.8 0.8
–0.6 0.6
–0.6
–0.8
–0.8
tCH, tCL
0.9
0.4
tHP – 1
0.6
0.8
0.8
1.1
0.6
0.6
0.6
2
0
0.25
0.4 0.6
0.75 1.25
0.35
0.35
0.2
0.2
1.1
1.1
2.5
1
Unit Note
ns
tCK
tCK
ns
ns
ns
ns
ns
ns
ns
tCK
tCK
ns
ns
ns
ns
ns
tCK
tCK
tCK
tCK
tCK
tCK
tCK
ns
ns
ns
tCK
Remark These specifications are applied to the monolithic device.
8 Preliminary Data Sheet M14897EJ2V0DS00







MC-45D16CB641 equivalent, schematic
MC-45D16CB641
CAUTION FOR HANDLING MEMORY MODULES
When handling or inserting memory modules, be sure not to touch any components on the modules, such as
the memory IC, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on these
components to prevent damaging them.
When re-packing memory modules, be sure the modules are NOT touching each other. Modules in contact
with other modules may cause excessive mechanical stress, which may damage the modules.
The information in this document is current as of June, 2000. The information is subject to change
without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data
books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products
and/or types are available in every country. Please check with an NEC sales representative for
availability and additional information.
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
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for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4










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