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PDF ( 数据手册 , 数据表 ) MC-458CB641ES

零件编号 MC-458CB641ES
描述 8M-WORD BY 64-BIT SYNCHRONOUS DYNAMIC RAM MODULE SO DIMM
制造商 NEC
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MC-458CB641ES 数据手册, 描述, 功能
DATA SHEET
MOS INTEGRATED CIRCUIT
MC-458CB641ES, 458CB641PS
8M-WORD BY 64-BIT
SYNCHRONOUS DYNAMIC RAM MODULE (SO DIMM)
Description
The MC-458CB641ES and MC-458CB641PS are 8,388,608 words by 64 bits synchronous dynamic RAM module
(Small Outline DIMM) on which 4 pieces of 128M SDRAM: µPD45128163 are assembled.
These modules provide high density and large quantities of memory in a small space without utilizing the surface-
mounting technology on the printed circuit board.
Decoupling capacitors are mounted on power supply line for noise reduction.
Features
8,388,608 words by 64 bits organization
Clock frequency and access time from CLK
Part number
/CAS latency
Clock frequency (MAX.) Access time from CLK (MAX.)
MC-458CB641ES-A80
MC-458CB641ES-A10
5 MC-458CB641PS-A80
5 MC-458CB641PS-A10
CL = 3
CL = 2
CL = 3
CL = 2
CL = 3
CL = 2
CL = 3
CL = 2
125 MHz
100 MHz
100 MHz
77 MHz
125 MHz
100 MHz
100 MHz
77 MHz
6 ns
6 ns
6 ns
7 ns
6 ns
6 ns
6 ns
7 ns
Fully Synchronous Dynamic RAM, with all signals referenced to a positive clock edge
Pulsed interface
Possible to assert random column address in every cycle
Quad internal banks controlled by BA0, BA1 (Bank Select)
Programmable burst-length: 1, 2, 4, 8 and Full Page
Programmable wrap sequence (Sequential / Interleave)
Programmable /CAS latency (2, 3)
Automatic precharge and controlled precharge
CBR (Auto) refresh and self refresh
Single 3.3 V ±0.3 V power supply
LVTTL compatible
4,096 refresh cycles/64 ms
Burst termination by Burst Stop command and Precharge command
144-pin small outline dual in-line memory module (Pin pitch = 0.8 mm)
Unbuffered type
Serial PD
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. M14015EJ4V0DS00 (4th edition)
Date Published February 2000 NS CP(K)
Printed in Japan
The mark shows major revised points.
©
1999







MC-458CB641ES pdf, 数据表
MC-458CB641ES, 458CB641PS
Synchronous Characteristics
Parameter
Symbol
Clock cycle time
/CAS latency = 3 tCK3
/CAS latency = 2 tCK2
Access time from CLK
/CAS latency = 3 tAC3
/CAS latency = 2 tAC2
CLK high level width
tCH
CLK low level width
tCL
Data-out hold time
/CAS latency = 3 tOH3
/CAS latency = 2 tOH2
Data-out low-impedance time
tLZ
Data-out high-impedance time
/CAS latency = 3 tHZ3
/CAS latency = 2 tHZ2
Data-in setup time
tDS
Data-in hold time
tDH
Address setup time
tAS
Address hold time
tAH
CKE setup time
tCKS
CKE hold time
tCKH
CKE setup time (Power down exit)
tCKSP
Command (/CS0, /RAS, /CAS, /WE,
DQMB0 - DQMB7) setup time
Command (/CS0, /RAS, /CAS, /WE,
DQMB0 - DQMB7) hold time
tCMS
tCMH
Note 1. Output load
-A 80
MIN. MAX.
8 (125 MHz)
10 (100 MHz)
6
6
3
3
3
3
0
36
36
2
1
2
1
2
1
2
2
1
-A 10
Unit
MIN. MAX.
10 (100 MHz) ns
13 (77 MHz) ns
6 ns
7 ns
3 ns
3 ns
3 ns
3 ns
0 ns
3 6 ns
3 7 ns
2 ns
1 ns
2 ns
1 ns
2 ns
1 ns
2 ns
2 ns
1 ns
Note
1
1
1
1
Output
Z = 50
50 pF
Remark These specifications are applied to the monolithic device.
8 Data Sheet M14015EJ4V0DS00







MC-458CB641ES equivalent, schematic
MC-458CB641ES, 458CB641PS
CAUTION FOR HANDLING MEMORY MODULES
When handling or inserting memory modules, be sure not to touch any components on the modules, such as
the memory IC, chip capacitors and chip resistors. It is necessary to avoid undue mechanical stress on these
components to prevent damaging them.
When re-packing memory modules, be sure the modules are NOT touching each other. Modules in contact
with other modules may cause excessive mechanical stress, which may damage the modules.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8










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