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PDF ( 数据手册 , 数据表 ) TDA10045

零件编号 TDA10045
描述 DVB-T channel receiver
制造商 NXP Semiconductors
LOGO NXP Semiconductors LOGO 


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TDA10045 数据手册, 描述, 功能
INTEGRATED CIRCUITS
DATA SHEET
TDA10045H
DVB-T channel receiver
Product specification
Supersedes data of 2000 Jun 21
File under Integrated Circuits, IC02
2001 Nov 08







TDA10045 pdf, 数据表
Philips Semiconductors
DVB-T channel receiver
Product specification
TDA10045H
Notes
1. OD are open-drain outputs, so they must be connected to a pull-up resistor to either VDDD33 or VDDD50
2. All inputs (I) are TTL, 5 V tolerant, (if VDD50 is set to 5 V).
3. Foundry test I/O inputs must be connected to GND.
handbook, full pagewidth
VDDD33
VSSD
DS_SPARE3
1
2
3
VAGC 4
SCL_EEP 5
VDDD33
VSSD
SDA_EEP
6
7
8
SCL_TUN 9
SDA_TUN 10
SCL 11
SDA 12
n.c. 13
CLR# 14
EEPADDR 15
SADDR[1] 16
SADDR[0] 17
VDDD18
VSSD
TM[3]
18
19
20
TM[2] 21
TM[1] 22
TM[0] 23
SCAN_EN 24
VDDD50
VSSD
DWNLOAD
25
26
27
SP_IN[1] 28
SP_IN[0] 29
FFT_WIN 30
TDA10045H
80 XOUT
79 XIN
78 VSSD
77 VDDD33
76 DO[0]
75 DO[1]
74 DO[2]
73 DO[3]
72 DO[4]
71 VSSD
70 VDDD18
69 DO[5]
68 DO[6]
67 DO[7]
66 OCLK
65 DEN
64 PSYNC
63 UNCOR
62 VSSD
61 VDDD33
60 DS_SPARE1
59 DS_SPARE2
58 VSSD
57 VDDD18
56 TDO
55 TCK
54 TDI
53 TMS
52 TRSTN
51 n.c.
MGU413
2001 Nov 08
Fig.2 Pin configuration.
8







TDA10045 equivalent, schematic
Philips Semiconductors
DVB-T channel receiver
Product specification
TDA10045H
Suitability of surface mount IC packages for wave and reflow soldering methods
PACKAGE
BGA, HBGA, LFBGA, SQFP, TFBGA
HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
SOLDERING METHOD
WAVE
REFLOW(1)
not suitable
suitable
not suitable(2)
suitable
suitable
suitable
not recommended(3)(4) suitable
not recommended(5) suitable
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
DATA SHEET STATUS
DATA SHEET STATUS(1)
PRODUCT
STATUS(2)
Objective data
Development
Preliminary data
Qualification
Product data
Production
DEFINITIONS
This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
2001 Nov 08
16










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