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PDF ( 数据手册 , 数据表 ) 74LCX16500MEA

零件编号 74LCX16500MEA
描述 Low Voltage 18-Bit Universal Bus Transceivers with 5V Tolerant Inputs and Outputs
制造商 Fairchild Semiconductor
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74LCX16500MEA 数据手册, 描述, 功能
March 1995
Revised April 1999
74LCX16500
Low Voltage 18-Bit Universal Bus Transceivers with
5V Tolerant Inputs and Outputs
General Description
These 18-bit universal bus transceivers combine D-type
latches and D-type flip-flops to allow data flow in transpar-
ent, latched, and clocked modes.
Data flow in each direction is controlled by output-enable
(OEAB and OEBA), latch-enable (LEAB and LEBA), and
clock (CLKAB and CLKBA) inputs.
The LCX16500 is designed for low voltage (2.5V or 3.3V)
VCC applications with the capability of interfacing to a 5V
signal environment.
The LCX16500 is fabricated with an advanced CMOS tech-
nology to achieve high speed operation while maintaining
CMOS low power.
Features
s 5V tolerant inputs and outputs
s 2.3V–3.6V VCC specifications provided
s 6.0 ns tPD max (VCC = 3.3V), 20 µA ICC max
s Power down high impedance inputs and outputs
s Supports live insertion/withdrawal (Note 1)
s ±24 mA output drive (VCC = 3.0V)
s Implements patented noise/EMI reduction circuitry
s Latch-up performance exceeds 500 mA
s ESD performance:
Human body model > 2000V
Machine model > 200V
Note 1: To ensure the high-impedance state during power up or down, OE
should be tied to VCC and OE tied to GND through a resistor: the minimum
value or the resistor is determined by the current-sourcing capability of the
driver.
Ordering Code:
Order Number Package Number
Package Description
74LCX16500MEA
MS56A
56-Lead Shrink Small Outline Package (SSOP), JEDEC MO-118, 0.300” Wide
74LCX16500MTD
MTD56
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Devices also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering code.
© 1999 Fairchild Semiconductor Corporation DS012407.prf
www.fairchildsemi.com







74LCX16500MEA pdf, 数据表
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
56-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide
Package Number MTD56
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
www.fairchildsemi.com
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.














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