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PDF ( 数据手册 , 数据表 ) TS68882MF25

零件编号 TS68882MF25
描述 CMOS Enhanced Floating-point Co-processor
制造商 ATMEL Corporation
LOGO ATMEL Corporation LOGO 


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TS68882MF25 数据手册, 描述, 功能
Features
Eight General-purpose Floating-point Data Registers, Each Supporting a Full 80-bit
Extended Precision Real Data Format (a 64-bit Mantissa Plus a Sign Bit, and a 15-bit
Signed Exponent)
A 67-bit Arithmetic Unit to Allow Very Fast Calculations with Intermediate are Precision
Greater than the Extended Precision Format
A 67-bit Barrel Shifter for High-speed Shifting Operations (for Normalizing etc.)
Special-purpose Hardware for High-speed Conversion Between Single, Double, and
Extended Formats and the Internal Extended Format
An Independent State Machine to Control Main Processor Communication for
Pipelined Instruction Processing
Forty-six Instructions, Including 35 Arithmetic Operations
Full Conformation to the IEEE 754 Standard, Including All Requirements and
Suggestions
Support of Functions Not Defined by the IEEE Standard, Including a Full Set of
Trigonometric and Transcendental Functions
Seven Data Type Types: Byte, Word and Long Integers; Single, Double, and Extended
Precision Real Numbers; and Packed Binary Coded Decimal String Real Numbers
Twenty-two Constants Available In The On-chip ROM, Including π, e, and Powers of 10
Virtual Memory/Machine Operations
Efficient Mechanisms for Procedure Calls, Context Switches, and Interrupt Handling
Fully Concurrent Instruction Execution with the Main Processor
Fully Concurrent Instruction Execution of Multiple Floating-point Instructions
Use with any Host Processor, on an 8-, 16- or 32-bit Data Bus
Available in 16.67, 20, 25 and 33 MHz for Tc from -55°C to +125°C
VCC = 5V ± 10%
Description
The TS68882 enhanced floating-point co-processor is a full implementation of the
IEEE Standard for Binary Floating-Point Arithmetic (754) for use with the THOMSON
TS68000 Family of microprocessors. It is a pin and software compatible upgrade of
the TS68881 with optimized MPU interface that provides over 1.5 times the perfor-
mance of the TS68881. It is implemented using VLSI technology to give systems
designers the highest possible functionality in a physically small device.
Intended primarily for use as a co-processor to the TS68020/68030 32-bit micropro-
cessor units (MPUs), the TS68882 provides a logical extension to the main MPU
integer data processing capabilities. It does this by providing a very high performance
floating-point arithmetic unit and a set of floating-point data registers that are utilized
in a manner that is analogous to the use of the integer data registers. The TS68882
instruction set is a natural extension of all earlier members of the TS68000 Family, and
supports all of the addressing modes of the host MPU. Due to the flexible bus inter-
face of the TS68000 Family, the TS68882 can be used with any of the MPU devices of
the TS68000 Family, and it may also be used as a peripheral to non-TS68000
processors.
Screening/Quality
This product could be manufactured
in full compliance with either:
• MIL-STD-883 Class B
• DESC 5962-89436
• or According to ATMEL-
Grenoble Standards
R suffix
PGA 68
Ceramic Pin Grid Array
F suffix
CQFP 68
Ceramic Quad Flat Pack
CMOS
Enhanced
Floating-point
Co-processor
TS68882
Rev. 2119AHIREL04/02
1







TS68882MF25 pdf, 数据表
Thermal
Characteristics
Table 4.
Package
PGA 68
CQFP
Symbol
θJA
θJC
θJA
θJC
Parameter
Thermal Resistance - Ceramic Junction To Ambient
Thermal Resistance - Ceramic Junction To Case
Thermal Resistance - Ceramic Junction To Ambient
Thermal Resistance - Ceramic Junction To Case
Value
33
4
33
3
Rating
°C/W
°C/W
°C/W
°C/W
Power
Considerations
The average chip-junction temperature, TJ, in °C can be obtained from:
TJ = TA + (PD + θJA)
(1)
TA = Ambient Temperature, °C
θJA = Package Thermal Resistance, Junction-to-Ambient, °C/W
PD = PINT + PI/O
PINT = ICC x VCC, Watts - Chip Internal Power
PI/O = Power Dissipation on Input and Output Pins - User Determined
For most applications PI/O < PINT and can be neglected.
An Approximate relationship between PD and TJ (if PI/O is neglected) is:
PD = K: (TJ + 273)
(2)
Solving equations (1) and (2) for K gives
K = PD. (TA + 273) + θJA · PD2
(3)
where K is constant pertaining to the particular part K can be determined from the equa-
tion (3) by measuring PD (at equilibrium) for a known TA. Using this value of K, the
values of PD and TJ can be obtained by solving equations (1) and (2) iteratively for any
value of TA.
The total thermal resistance of a package (θJA) can be separated into two components,
θJC and θCA, representing the barrier to heat flow from the semiconductor junction to the
package (case), surface (θJC) and from the case to the outside ambient (θCA). These
terms are related by the equation:
θJA = θJC + θCA
(4)
θJA is device related and cannot be influenced by the user. However, θCA is user depen-
dent and can be minimized by such thermal management techniques as heat sinks,
ambient air cooling and thermal convection. Thus, good thermal management on the
part of the user can significantly reduce θCA so that θJA approximately equals θJC. Substi-
tution of θJC for θJA in equation (1) will result in a lower semiconductor junction
temperature.
8 TS68882
2119AHIREL04/02







TS68882MF25 equivalent, schematic
Figure 8. Asynchronous Write Cycle Timing Diagram
Note: START is actually a logical condition, but is shown as an active signal for clarity. The logical equation for this signal is: START =
CS + AS + (R/W · DS).
16 TS68882
2119AHIREL04/02










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