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PDF ( 数据手册 , 数据表 ) TZA3000

零件编号 TZA3000
描述 SDH/SONET STM4/OC12 optical receiver
制造商 NXP Semiconductors
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TZA3000 数据手册, 描述, 功能
INTEGRATED CIRCUITS
DATA SHEET
TZA3000
SDH/SONET STM4/OC12 optical
receiver
Objective specification
File under Integrated Circuits, IC19
1997 Oct 17







TZA3000 pdf, 数据表
Philips Semiconductors
SDH/SONET STM4/OC12 optical receiver
Objective specification
TZA3000
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
Vn
In
Ptot
Tstg
Tj
Tamb
PARAMETER
MIN.
supply voltage
0.5
DC voltage
pin 7: IPhoto
0.5
pin 14: RFTEST
0.5
pins 22, 23, 26 and 27: OUTPECL, OUTQPECL, LOS and LOSQ
pins 18 and 19: OUTCML and OUTQCML
pin 29: LOSTH
VCC 2
VCC 2
0.5
pin 10: BWC
pin 31: AGC
0.5
0.5
pin 11: Vref
pin 4: DREF
pin 15: OUTSEL
0.5
0.5
0.5
pin 28: LOSTTL
0.5
DC current
pin 7: IPhoto
1
pin 14: RFTEST
2
pins 22, 23, 26 and 27: OUTPECL, OUTQPECL, LOS and LOSQ 25
pins 18,19: OUTCML and OUTQCML
15
pin 29: LOSTH
2
pin 10: BWC
pin 31: AGC
1
0.2
pin 11: Vref
pin 4: DREF
pin 15: OUTSEL
2
2.5
0.5
pin 28: LOSTTL
16
total power dissipation
storage temperature
65
junction temperature
ambient temperature
40
MAX.
+6
UNIT
V
+1 V
VCC + 0.5 V
VCC + 0.5
VCC + 0.5
VCC + 0.5
V
V
V
+3.2 V
VCC + 0.5 V
+3.2 V
VCC + 0.5
VCC + 0.5
VCC + 0.5
V
V
V
+2.5
+2
+10
+15
+2
+1
+0.2
+2.5
+2.5
+0.5
+16
600
+150
150
+85
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mW
°C
°C
°C
THERMAL CHARACTERISTICS
SYMBOL
Rth(j-s)
Rth(j-a)
PARAMETER
thermal resistance from junction to solder point
thermal resistance from junction to ambient
VALUE
tbf
tbf
UNIT
K/W
K/W
1997 Oct 17
8







TZA3000 equivalent, schematic
Philips Semiconductors
SDH/SONET STM4/OC12 optical receiver
Objective specification
TZA3000
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Reflow soldering
Reflow soldering techniques are suitable for all LQFP
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
Wave soldering
Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.
If wave soldering cannot be avoided, the following
conditions must be observed:
A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave)
soldering technique should be used.
The footprint must be at an angle of 45° to the board
direction and must incorporate solder thieves
downstream and at the side corners.
Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1997 Oct 17
16










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