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PDF ( 数据手册 , 数据表 ) X76F100M8I

零件编号 X76F100M8I
描述 1K 128 x 8 Bit
制造商 Xicor
LOGO Xicor LOGO 


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X76F100M8I 数据手册, 描述, 功能
1K
X76F100
128 x 8 Bit
Secure SerialFlash
FEATURES
• 64-bit password security
• One array (112-bytes) two passwords (16-bytes)
—Read password
—Write password
• Programmable passwords
• Retry counter register
—Allows 8 tries before clearing of the array
• 32-bit response to reset (rst input)
• 8-byte sector Write Mode
• 1MHz clock rate
• 2-wire serial interface
• Low power CMOS
—3.0 to 5.5V operation
—Standby current less than 1µA
—Active current less than 3 mA
• High reliability endurance:
—100,000 write cycles
• Data retention: 100 years
• Available in:
—8-lead PDIP, SOIC, MSOP, and smart car module
DESCRIPTION
The X76F100 is a Password Access Security Supervi-
sor, containing one 896-bit Secure SerialFlash array.
Access to the memory array can be controlled by two
64-bit passwords. These passwords protect read and
write operations of the memory array.
The X76F100 features a serial interface and software
protocol allowing operation on a popular two wire bus.
The bus signals are a clock Input (SCL) and a bidirec-
tional data input and output (SDA). Access to the
device is controlled through a chip select (CS) input,
allowing any number of devices to share the same bus.
The X76F100 also features a synchronous response
to reset providing an automatic output of a hard-wired
32-bit data stream conforming to the industry standard
for memory cards.
The X76F100 utilizes Xicor’s proprietary Direct Write
cell, providing a minimum endurance of 100,000
cycles and a minimum data retention of 100 years.
BLOCK DIAGRAM
CS
SCL
SDA
Interface
Logic
RST
Chip Enable
Data Transfer
Array Access
Enable
Password Array
and Password
Verification Logic
Reset
Response Register
8K Byte
SerialFlash Array
Array 0
(Password Protected)
32 Byte
SerialFlash Array
Array 1
(Password Protected)
Retry Counter
REV 1.0 6/22/00
www.xicor.com
Characteristics subject to change without notice. 1 of 16







X76F100M8I pdf, 数据表
X76F100
ABSOLUTE MAXIMUM RATINGS
Temperature under bias ....................–65°C to +135°C
Storage temperature ........................–65°C to +150°C
Voltage on any pin with
respect to VSS......................................... –1V to +7V
D.C. output current ............................................... 5mA
Lead temperature (soldering, 10 seconds).........300°C
RECOMMENDED OPERATING CONDITIONS
Temperature
Commercial
Industrial
Min.
0°C
–40°C
Max.
+70°C
+85°C
COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only; functional operation of the
device (at these or any other conditions above those
listed in the operational sections of this specification) is
not implied. Exposure to absolute maximum rating con-
ditions for extended periods may affect device reliability.
Supply Voltage
X76F100
X76F100-3
Limits
4.5V to 5.5V
3.0V to 5.5V
D.C. OPERATING CHARACTERISTICS (Over the recommended operating conditions unless otherwise specified.)
Symbol
ICC1
ICC2(3)
ISB1(1)
ISB2(1)
ILI
ILO
VIL(2)
VIH(2)
VOL
Parameter
VCC Supply Current
(Read)
VCC Supply Current
(Write)
VCC Supply Current
(Standby)
VCC Supply Current
(Standby)
Input Leakage Current
Output Leakage Current
Input LOW Voltage
Input HIGH Voltage
Output LOW Voltage
Limits
Min.
Max.
1
Unit
mA
3 mA
1 µA
1 µA
10
10
–0.5
VCC x 0.7
VCC x 0.3
VCC + 0.5
0.4
µA
µA
V
V
V
Test Conditions
fSCL = VCC x 0.1/VCC x 0.9 Levels @ 400 kHz,
SDA = Open
RST = CS = VSS
fSCL = VCC x 0.1/VCC x 0.9 Levels @ 400 kHz,
SDA = Open
RST = CS = VSS
VIL = VCC x 0.1, VIH = VCC x 0.9
fSCL = 400 kHz, fSDA = 400 kHz
VSDA = VSCC = VCC
Other = GND or VCC–0.3V
VIN = VSS to VCC
VOUT = VSS to VCC
IOL = 3mA
CAPACITANCE TA = +25°C, f = 1MHz, VCC = 5V
Symbol
COUT(3)
CIN(3)
Test
Output Capacitance (SDA)
Input Capacitance (RST, SCL, CS)
Max.
8
6
Unit
pF
pF
Conditions
VI/O = 0V
VIN = 0V
Notes: (1) Must perform a stop command after a read command prior to measurement.
(2) VIL min. and VIH max. are for reference only and are not tested.
(3) This parameter is periodically sampled and not 100% tested.
REV 1.0 6/22/00
www.xicor.com
Characteristics subject to change without notice. 8 of 16







X76F100M8I equivalent, schematic
X76F100
Ordering Information
X76F100 X
X –X
Device
Part Mark Convention
8-Lead MSOP
EYWW
XXX
AAQ = 3.0 to 5.5V, 0 to +70°C
AAR = 3.0 to 5.5V, -40 to +85°C
AAS = 4.5 to 5.5V, 0 to +70°C
AAT = 4.5 to 5.5V, -40 to +85°C
VCC Limits
Blank = 5V ±10%
3.0 = 3.0V to 5.5V
Temperature Range
Blank = Commercial = 0°C to +70°C
I = Industrial= –40°C to +85°C
Package
S8 = 8-Lead SOIC
M8 = 8-Lead MSOP
P = 8-Lead PDIP
H = Die in Waffle Packs
W = Die in Wafer Form
X = Smart Card Module
8-Lead SOIC/PDIP
X76F100 X
XX
Blank = 8-Lead SOIC
D = 3.0 to 5.5V, 0 to +70°C
E = 3.0 to 5.5V, -40 to +85°C
Blank = 4.5 to 5.5V, 0 to +70°C
I = 4.5 to 5.5V, -40 to +85°C
LIMITED WARRANTY
©Xicor, Inc. 2000 Patents Pending
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty,
express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement.
Xicor, Inc. makes no warranty of merchantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices
at any time and without notice.
Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, or licenses are implied.
TRADEMARK DISCLAIMER:
Xicor and the Xicor logo are registered trademarks of Xicor, Inc. AutoStore, Direct Write, Block Lock, SerialFlash, MPS, and XDCP are also trademarks of Xicor, Inc. All
others belong to their respective owners.
U.S. PATENTS
Xicor products are covered by one or more of the following U.S. Patents: 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846;
4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829,482; 4,874,967; 4,883,976; 4,980,859; 5,012,132; 5,003,197; 5,023,694; 5,084,667; 5,153,880; 5,153,691;
5,161,137; 5,219,774; 5,270,927; 5,324,676; 5,434,396; 5,544,103; 5,587,573; 5,835,409; 5,977,585. Foreign patents and additional patents pending.
LIFE RELATED POLICY
In situations where semiconductor component failure may endanger life, system designers using this product should design the system with appropriate error detection
and correction, redundancy and back-up features to prevent such an occurrence.
Xicor’s products are not authorized for use in critical components in life support devices or systems.
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to
perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life
support device or system, or to affect its safety or effectiveness.
REV 1.0 6/22/00
www.xicor.com
Characteristics subject to change without notice. 16 of 16










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