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PDF ( 数据手册 , 数据表 ) 236

零件编号 236
描述 Board Level Power Semiconductor Heat Sinks
制造商 Wakefield Thermal Solutions
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236 数据手册, 描述, 功能
BOARD LEVEL
HEAT SINKS
BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS
PATENT 361317
216 SERIES Surface Mount Heat Sinks
D2PAK, TO-220, SOL-20
Standard
P/N
216-40CT
216-40CTT
216-40CTR
Height Above
PC Board
.390 in. (9.9)
.390 in. (9.9)
.390 in. (9.9)
Footprint Dimensions
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
.600 in. (15.2) x .740 in. (18.8)
Package
Format
Bulk
Tube
Tape & Reel
Package
Quantity
1
25
250
Thermal Performance at Typical Load
Natural Convection Forced Convection
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
55°C @ 1W
16.0°C/W @ 200 LFM
Increase the power dissipation level of D2PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of
high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder
reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path
from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk,
tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated.
MECHANICAL DIMENSIONS
.740
(18.8)
216-40CT
.600
(15.2)
.640
(16.3)
.600
(15.2)
.020
(0.5)
.215
(5.5) .215
(5.5)
.600
(15.2)
.020
(0.5)
216-40CTT
NOTES:
1. ESD MATERIAL WITH PLUGS
2. LENGTH OF TUBE: 16.25 INCHES
3. QUANTITY PER TUBE: 25 PIECES
TUBE DETAILS
.390 .265
(9.9) .640 (6.7)
(16.3)
.470
(11.9)
.840
(21.3)
.350
(8.9)
.025
(0.6)
216-40CTR
A
TAPE
DETAILS
USE MAX
COPPER
TO ALLOW
MAX
CONDUCTION
TO HEAT SINK
RECOMMENDED COPPER FOOTPRINT
.660
(16.8)
.640
(16.3)
.660
(16.8)
.060
(1.5)
6 LAYER BOARD, D2PAK
125°C LEAD, 40°C AMBIENT
AIR VELOCITY (LFM)
7 0 100 200 300 400 500
6
.626
(15.9)
A
.768
(19.5)
.390
(9.9)
REEL
DETAILS
.945
(24.0)
SECTION
A-A
COPPER FOOTPRINT
FOR HEAT SINK
.640
(16.3)
5
4
1.260
(32.0)
13.000
(330.2)
MIN COPPER
FOR HEAT
3
SINK
2
.390 REF:
(9.9)
JEDEC TO-263 D2PAK
JEDEC TO-220AB
1
JEDEC TO-261AA
.409
.215
(5.5)
JEDEC MO-184
JEDEC MS-013
JEDEC MS-025
(10.4)
NATURAL CONVECTION
6 LAYER BOARD, D2PAK
125°C LEAD, 40°C AMBIENT
THERMAL PERFORMANCE
DATA
POWER, W
100
30 0
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
NO HEAT SINK
6 LAYER BOARD, D2PAK
AIR VELOCITY (LFM)
100 200 300 400 500
25
80
1.28
(32.5)
60
40
20
15
10
20
NOTES:
1. ESD MATERIAL
2. EIA STANDARD, EIA-481-3
3. LENGTH OF REEL: APPROXIMATELY 6 METERS
4. QUANTITY PER REEL: 250 PIECES
0
HS, 2 IN. BOARD
HS, 4 IN. BOARD
NO HS, 2 IN. BOARD
NO HS, 4 IN. BOARD
0
AIR PERPENDICULAR TO FINS
AIR PARALLEL TO FINS
Dimensions: in. (mm)
PATENT PENDING
230 and 234 SERIES Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks
TO-220
Standard
P/N
230-75AB
230-75AB-01
230-75AB-05
230-75AB-10
234-75AB
234-75AB-01
234-75AB-05
Height Above
PC Board
.750 in. (19.1)
.750 in. (19.1)
.500 in. (12.7)
.875 in. (22.2)
.790 in. (20.0)
.790 in. (20.0)
.500 in. (12.7)
Footprint Dimensions
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.750 in. (19.1) x .570 in. (14.5)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.570 in. (14.5) x .500 in. (12.7)
.790 in. (20.0) x .570 in. (14.5)
Mounting
Configuration
Vert./Horiz.
Vertical
Horizontal
Vertical
Vert./Horiz.
Vertical
Horizontal
Solderable
Tab Option
No Tab
01
05
10
No Tab
01
05
Mounting Thermal Performance at Typical Load
Style Natural Convection Forced Convection
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Clip/Mtg Hole 57°C @ 2W 7.5°C/W @ 400 LFM
Compact, slim, labor-saving heat sinks with integral self locking features for TO-220 semiconductors. Their unique design (patent pending) ensures
uniform force applied to the component for effective and maximum thermal contact in horizontal or vertical mounting positions while eliminating
the need for fastening hardware. A mounting hole is available for hardware mounting when desired. The 230 and 234 Series can be used
interchangeably. The 234 Series has standoffs on the base of the heat sink. Specify solderable tab options by the addition of suffix 01, 05, or 10
to the standard part number (i.e. 230-75AB-01). Material: Aluminum, black anodized.
MECHANICAL DIMENSIONS
.500
(12.7)
.570 MAX
(14.5)
230-75AB-01
.500
(12.7)
230-75AB
.500
(12.7)
234-75AB
.750
(19.1)
.050
(1.3)
.570 MAX
(14.5)
.250
(6.4)
.500
(12.7)
230 AND 234 SERIES
230-75AB-10
.125
(3.2)
.063
(1.6)
234-75AB-01
.375 .020 TAB 10
(9.5) (0.5)
.032 TAB 01
(0.8)
.090
(2.3) 234-75AB-05
.720 .790
(18.3) (20.1)
.540
(13.7)
Dimensions: in. (mm)
.720 .790
(18.3) (20.1)
.032 .050
(0.8) (1.3)
.210
(5.3) .430
(10.9)
.032
(0.8)
.165
(4.2)
.570 MAX
(14.5)
230
and
234
SERIES
.500 MIN
(12.7)
.050
(1.3)
2x.100
(2.5)
230-75AB-05
.750
(19.1)
.032
(0.8) .165
(4.2)
234 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
.370
(9.4)
2x.125
(3.2)
.500
(12.7)
230 SERIES
SUGGESTED TAB HOLE=
ø.075 (1.9) (PLATED)
WITH ø.100 (2.5) PAD
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
AIR VELOCITY (LFM)
100 0
200 400 600 800 100010
80
230/234
8
60 6
40
230/234
20
4
2
0
01
23
0
45
POWER DISSIPATION (WATTS)
Wakefield Engineering, Inc.
60 Audubon Road, Wakefield, MA 01880 USA
Tel: (617) 245-5900 • Fax: (617) 246-0874
2
Refer to Full Line Catalog for additional
Board-Level Heat Sinks and
Thermal Accessory Products












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