DataSheet8.cn


PDF ( 数据手册 , 数据表 ) 74AHC374PW

零件编号 74AHC374PW
描述 Octal D-type flip-flop; positive edge-trigger; 3-state
制造商 NXP Semiconductors
LOGO NXP Semiconductors LOGO 


1 Page

No Preview Available !

74AHC374PW 数据手册, 描述, 功能
INTEGRATED CIRCUITS
DATA SHEET
74AHC374; 74AHCT374
Octal D-type flip-flop; positive
edge-trigger; 3-state
Product specification
Supersedes data of 1998 Dec 11
File under Integrated Circuits, IC06
1999 Sep 28







74AHC374PW pdf, 数据表
Philips Semiconductors
Octal D-type flip-flop; positive edge-trigger; 3-state
Product specification
74AHC374;
74AHCT374
74AHCT family
Over recommended operating conditions; voltages are referenced to GND (ground = 0 V).
SYMBOL PARAMETER
VIH HIGH-level input
voltage
VIL LOW-level input
voltage
VOH HIGH-level output
voltage; all
outputs
HIGH-level output
voltage
VOL LOW-level output
voltage; all
outputs
LOW-level output
voltage
II input leakage
current
IOZ 3-state output
OFF current
ICC
ICC
CI
quiescent supply
current
additional
quiescent supply
current per input
pin
input capacitance
TEST CONDITIONS
OTHER
25
VCC (V)
MIN. TYP.
4.5 to 5.5 2.0
4.5 to 5.5 − −
VI = VIH or VIL;
IO = 50 µA
VI = VIH or VIL;
IO = 8.0 mA
VI = VIH or VIL;
IO = 50 µA
4.5
4.5
4.5
4.4 4.5
3.94
0
VI = VIH or VIL;
IO = 8 mA
VI = VIH or VIL
4.5
5.5
−−
−−
VI = VIH or VIL;
VO = VCC or GND
per input pin;
other inputs at
VCC or GND;
IO = 0
VI = VCC or GND;
IO = 0
VI = VCC 2.1 V
other inputs at
VCC or GND;
IO = 0
5.5
5.5
4.5 to 5.5
3
Tamb (°C)
40 to +85 40 to +125 UNIT
MAX. MIN. MAX. MIN. MAX.
2.0 2.0 V
0.8 0.8 0.8 V
4.4 4.4 V
3.8 3.70 V
0.1 0.1 0.1 V
0.36
0.1
±0.25
0.44
1.0
±2.5
0.55 V
2.0 µA
±10.0 µA
4.0
1.35
40
1.5
80 µA
1.5 mA
10 10 10 pF
1999 Sep 28
8







74AHC374PW equivalent, schematic
Philips Semiconductors
Octal D-type flip-flop; positive edge-trigger; 3-state
Product specification
74AHC374;
74AHCT374
SOLDERING
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
1999 Sep 28
16










页数 20 页
下载[ 74AHC374PW.PDF 数据手册 ]


分享链接

Link :

推荐数据表

零件编号描述制造商
74AHC374PWOctal D-type flip-flop; positive edge-trigger; 3-stateNXP Semiconductors
NXP Semiconductors
74AHC374PWDHOctal D-type flip-flop; positive edge-trigger; 3-stateNXP Semiconductors
NXP Semiconductors

零件编号描述制造商
STK15C88256-Kbit (32 K x 8) PowerStore nvSRAMCypress Semiconductor
Cypress Semiconductor
NJM4556DUAL HIGH CURRENT OPERATIONAL AMPLIFIERNew Japan Radio
New Japan Radio
EL1118-G5 PIN LONG CREEPAGE SOP PHOTOTRANSISTOR PHOTOCOUPLEREverlight
Everlight


DataSheet8.cn    |   2020   |  联系我们   |   搜索  |  Simemap