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PDF ( 数据手册 , 数据表 ) E818AHF

零件编号 E818AHF
描述 Octal 18V Pin Electronics Driver/window Comparator
制造商 Semtech Corporation
LOGO Semtech Corporation LOGO 


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E818AHF 数据手册, 描述, 功能
EDGE HIGH-PERFORMANCE PRODUCTS
Description
Edge818
Octal 18V Pin Electronics
Driver/window Comparator
Features
The Edge818 is an octal pin electronics driver and window
comparator fabricated in a wide voltage CMOS process.
It is designed specifically for Test During Burn In (TDBI)
applications, where cost, functional density, and power
are all at a premium.
The Edge818 incorporates eight channels of
programmable drivers and window comparators into one
14 mm X 20 mm 100 pin MQFP package. Each channel
has per pin driver levels, data, and high impedance
control. In addition, each comparator has per pin high
and low threshold levels.
The Edge818 uses "Flex In" and "Flex Out" digital inputs,
and can therefore mate directly with any digital technology
providing a minimum 2V swing. The digital outputs can
mate directly with any digital technology.
The 18V driver output and receiver input range allow the
Edge818 to interface directly with TTL, ECL, CMOS (3V,
5V, and 7V), LVCMOS, and custom level circuitry, as well
as the high voltage (Super Voltage) level required for
many special test modes for Flash Devices.
• 18V I/O Range
• 50 MHz Operation
• Per Pin Flexibility
• Programmable Input Thresholds
• Flex In Digital Inputs
• Flex Out Digital Outputs
• Small footprint (100 pin MQFP)
Applications
• Burn In ATE
• Low Cost ATE
• Instrumentation
Functional Block Diagram
VH VL
DATA
EN*
QA
COMP HIGH
COMP LOW
QB
8
8
8
8
8
DOUT
8
CVA
+
8
VINP
+8
CVB
Revision 1/ May 23, 2000
1
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E818AHF pdf, 数据表
Edge818
EDGE HIGH-PERFORMANCE PRODUCTS
Package Information (continued)
e/2
–A, B, D– 3
DETAIL "A"
BASE
PLANE
0.40 MIN.
˚0 MIN.
A2 – 0.10 S
0.13
R. MIN.
0.13 / 0.30 R. TYP.
C
GAGE
PLANE
A1
SEATING
PLANE
L
1.60 REF.
C
0.25
DETAIL "B"
˚0 – 7
1.28 REF.
˚12 – 16
SEE DETAIL "B"
˚12 – 16
A
–H– 2
0.076
–C–
12 0.13 / 0.23
SECTION C–C
8
B
ccc M C A – B S D S
WITH LEAD FINISH
0.13 / 0.17
B
1
BASE METAL
Notes:
1. All dimensions and tolerances conform to ANSI Y14.5-1982.
2. Datum plane -H- located at mold parting line and coincident
with lead, where lead exits plastic body at bottom of parting
line.
3. Datums A-B and -D- to be determined where centerline between
leads exits plastic body at datum plane -H-.
4. To be determined at seating plane -C-.
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable mold protrusion is 0.254 mm per side. Dimensions
D1 and E1 do include mold mismatch and are determined at
datum plane -H-.
6. Nis the total # of terminals.
7. Package top dimensions are smaller than bottom dimensions
and top of package will not overhang bottom of package.
8. Dimension B does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08 mm total in excess of the
dimension at maximum material condition. Dambar cannot
be located on the lowerradius or the foot.
9. All dimensions are in millimeters.
10. Maximum allowable die thickness to be assembled in this
package family is 0.635 millimeters.
11. This drawing conforms to JEDEC registered outlines MS-108
and MS-022.
12. These dimensions apply to the flat section of the lead between
0.10 mm and 0.25 mm from the lead tip.
Variations
(all dimensions in millimeters)
Symbol
A
A1
A2
D
D1
D2
ZD
E
E1
E2
ZE
L
N
e
B
B1
ccc
ND
NE
Min
0.25
2.57
0.73
0.22
0.22
Nom
3.04
0.33
2.71
23.20 BSC
20.00 BSC
18.85 REF
0.58 REF
17.20
14.00 BSC
12.35 REF
0.83 REF
0.88
100
0.65 BSC
0.30
0.13
30
20
Max
3.40
2.87
1.03
0.38
0.33
Note Comments
Height above PCB
Gap above PCB
Body Thickness
4
5 Body Dimension
4
5 Body Dimension
6 Pin Count
Lead Pitch
8 Pad Dimension
Pad Dimension
Side Pin Count
Side Pin Count
2000 Semtech Corp.
8
www.semtech.com














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