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PDF ( 数据手册 , 数据表 ) EXB28V

零件编号 EXB28V
描述 Chip Resistor Array
制造商 Matsushita Electric Works(Nais)
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EXB28V 数据手册, 描述, 功能
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXB28V
1. Dimension
A
a
P a’
L
(1)Substrate
(2)Protective
coating
Alumina
Resin
(4)Termination (5)Termination
(Inner)
(Between)
T
Ag or Ag/Pd
Side:Resin+Metal
Ni
Plating
Spec. No.
151-EXB-28V02DE
9-1
(3)Resistive
element
Ruthenium oxide
(6) Termination
(Outer)
Sn or Sn/ Pb
Plating
a-a’ sectional plan
(1) (2) (3) (4) (5) (6)
(0.3) (0.2)
Dimension(mm)
Dimension(mm)
L
2.00±0.10
P
0.50±0.10
W
1.00±0.10
G
0.25±0.10
T
0.35±0.05
A
0.20±0.10
B
0.20±0.10
2. Power derating curve
100
-55°C
80
70°C
60
40
20
125°C
0
-60 -40 -20 0 20 40 60 80 100 120 140 160
Category temperature range
-55°C to +125°C
Ambient Temperature(°C)
Fig. 1
3. Ratings
Item
Rated Dissipation
Rated voltage
&
Rated Continuous
Working Voltage
(RCWV)
Rated Value
Explanation
When used at ambient temperature over 70 °C,
0.031 W / element the rated dissipation should be reduced as shown
in Fig.1
Chip jumper : Rated current 1 A (Resistance is less than 50 mΩ)
The rated voltage of each resistor should be calculated from the
equation below, and when the rated voltage exceeds the limiting
element voltage, the limiting element voltage should the maximum
working voltage.
E= P×R
Limiting element voltage : 50 V
E: Rated voltage(V), P: Rated dissipation(W), R: Rated resistance())
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.







EXB28V pdf, 数据表
Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXB28V
Spec. No.
151-EXB-28V02DE
9-8
1. Application Range
This specification covers taping specification of EXB28V Type.
2. Physical Dimensions
2-1. Stracture and reel dimensions shall be as shown in the figure below.
11.4±1.0
Unit:mm
Carrier Tape(Paper)
Top Tape
Adhesive Tape
2-2. Carrier Tape Dimensions
P0
φD0
P2 P1
9.0±1.0
Sprocket hole
T
(mm)
A Chip hole
Chip resistor array
A BWF
1.20±0.05 2.20±0.10 8.00±0.20 3.50±0.05
E
1.75±0.10
(mm)
P1 P2 P0
T φD0
2.00±0.10 2.00±0.05 4.00±0.10 0.52±0.05 1.50+00.10
3. Specification
3-1.Taping
When the test shall be operated with the below conditions, peel strength should be 0.049N to
0.49N, should not have flash and tear after peeling.
<Test Method>
Carrier Tape
Peeling Direction
10°
Top Tape
Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip and
no break of carrier tape. However minimum bending radius shall be tested for 1 times.
MATSUSHITA ELECTRONIC COMPONENTS Co.,LTD.














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