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零件编号 | D1267 | ||
描述 | CCD Vertical Clock Driver | ||
制造商 | Sony Corporation | ||
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CCD Vertical Clock Driver
CXD1267AN
Description
The CXD1267AN is a vertical clock driver for CCD
image sensors. This IC is the successor of the
CXD1250N with attractive features.
Power consumption is reduced approximately 30%
for the CXD1267AN version.
20 pin SSOP (Plastic)
Features
1) Substrate voltage (Vsub) generator is built-in.
• Variable Vsub in the range of 4.0V to 18.5V.
• Reduction of peripheral parts saves space.
2) Only two power supplies (+15V and –8.5V) are
needed.
3) 3.3V clock interface is acceptable.
4) 20-pin SSOP package is used.
5) Low power consumption
90mW (CXD1267N)
62mW (CXD1267AN)
approximately 30% reduction
Appllications
CCD cameras
Structure
CMOS
Absolute Maximum Ratings (Ta = 25°C)
• Supply voltage
VL 0 to –10
• Supply voltage
VH VL – 0.3 to 2VL + 35
• Supply voltage
VM VL – 0.3 to 3.0
• Input voltage
VI VL – 0.3 to VH + 0.3
• Output voltage (V2, V4) MVφ VL – 0.3 to VM + 0.3
• Output voltage (V1, V3) HVφ VL – 0.3 to VH + 0.3
• Output voltage (VSHT)
HHVφ VL – 0.3 to VH + 0.3
• Operational amplifier output current
IDCOUT
±5
• Operating temperature
Topr
–25 to +85
• Storage temperature Tstg –40 to +125
V
V
V
V
V
V
V
mA
°C
°C
Recommended Operating Conditions
• Supply voltage
VH
• Supply voltage
VM
• Supply voltage
VL
• Input voltage (except for pin 3)
VI
• Operational amplifier input voltage
VIOP
• Operating temperature
Topr
14.5 to 15.5
0
–6.0 to –9.0
0 to 6.0
1.0 to 4.5
–20 to +75
V
V
V
V
V
°C
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
–1–
E94X38-PK
Package Outline
Unit: mm
∗6.5 ± 0.1
20PIN SSOP (Plastic)
+ 0.1
0.15 – 0.05
20 11
0.10
0.1 ± 0.1
1
0.65
+ 0.1
0.22 – 0.05
10
0.10 M
0° to 10°
CXD1267AN
0.575 MAX
SONY CODE
EIAJ CODE
JEDEC CODE
NOTE: Dimension “∗” does not include mold protrusion.
SSOP-20P-L071
SSOP020-P-0044-AN
PACKAGE STRUCTURE
PACKAGE MATERIAL EPOXY RESIN
LEAD TREATMENT
SOLDER PLATING
LEAD MATERIAL
PACKAGE WEIGHT
Cu ALLOY
0.1g
–8–
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页数 | 8 页 | ||
下载 | [ D1267.PDF 数据手册 ] |
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